Inventor · disambiguated record
Moriss Kung
Also filed as: KUNG MORISS
42 granted patents·19 pending applications·1,060 citations·filing 2002–2006
98Inventor score
Top patents by PatentIndex Score
61 records- 0198US7382049B2Chip package and bump connecting structure thereofVIA TECH INC·Filed 2005·Granted Jun 3, 2008·104 cites·26 claims
- 0298US6972964B2Module board having embedded chips and components and method of forming the sameVIA TECH INC·Filed 2005·Granted Dec 6, 2005·100 cites·23 claims
- 0395US6692265B2Electrical connection deviceVIA TECH INC·Filed 2002·Granted Feb 17, 2004·81 cites·26 claims
- 0490US7176559B2Integrated circuit package with a balanced-part structureVIA TECH INC·Filed 2003·Granted Feb 13, 2007·113 cites·5 claims
- 0589US6951773B2Chip packaging structure and manufacturing process thereofVIA TECH INC·Filed 2003·Granted Oct 4, 2005·64 cites·17 claims
- 0688US7638881B2Chip packageVIA TECH INC·Filed 2006·Granted Dec 29, 2009·17 cites·15 claims
- 0788US6960826B2Multi-chip package and manufacturing method thereofVIA TECH INC·Filed 2004·Granted Nov 1, 2005·49 cites·21 claims
- 0888US6696305B2Metal post manufacturing methodVIA TECH INC·Filed 2002·Granted Feb 24, 2004·49 cites·27 claims
- 0987US7470864B2Multi-conducting through hole structureVIA TECH INC·Filed 2005·Granted Dec 30, 2008·14 cites·9 claims
- 1086US6865089B2Module board having embedded chips and components and method of forming the sameVIA TECH INC·Filed 2003·Granted Mar 8, 2005·44 cites·13 claims
- 1185US6695040B1Thin planar heat distributorVIA TECH INC·Filed 2002·Granted Feb 24, 2004·41 cites·20 claims
- 1283US6569712B2Structure of a ball-grid array package substrate and processes for producing thereofVIA TECH INC·Filed 2002·Granted May 27, 2003·45 cites·12 claims
- 1381US7101781B2Integrated circuit packages without solder mask and method for the sameVIA TECH INC·Filed 2002·Granted Sep 5, 2006·37 cites·21 claims
- 1481US7071569B2Electrical package capable of increasing the density of bonding pads and fine circuit lines inside a interconnectionVIA TECH INC·Filed 2004·Granted Jul 4, 2006·25 cites·12 claims
- 1578US7180166B2Stacked multi-chip packageVIA TECH INC·Filed 2004·Granted Feb 20, 2007·24 cites·18 claims
- 1678US6707162B1Chip package structureVIA TECH INC·Filed 2003·Granted Mar 16, 2004·26 cites·19 claims
- 1777US6881662B2Pattern formation process for an integrated circuit substrateVIA TECH INC·Filed 2002·Granted Apr 19, 2005·20 cites·4 claims
- 1876US6667190B2Method for high layout density integrated circuit package substrateVIA TECH INC·Filed 2002·Granted Dec 23, 2003·19 cites·9 claims
- 1975US6716037B2Flexible electric-contact structure for IC packageVIA TECH INC·Filed 2002·Granted Apr 6, 2004·23 cites·10 claims
- 2073US6849534B2Process of forming bonding columnsVIA TECH INC·Filed 2003·Granted Feb 1, 2005·17 cites·13 claims
- 2172US6717264B2High density integrated circuit packageVIA TECH INC·Filed 2002·Granted Apr 6, 2004·15 cites·8 claims
- 2271US6876087B2Chip scale package with heat dissipating partVIA TECH INC·Filed 2003·Granted Apr 5, 2005·18 cites·5 claims
- 2370US6916687B2Bump process for flip chip packageVIA TECH INC·Filed 2003·Granted Jul 12, 2005·16 cites·31 claims
- 2465US6981320B2Circuit board and fabricating process thereofVIA TECH INC·Filed 2003·Granted Jan 3, 2006·10 cites·6 claims
- 2562US7173341B2High performance thermally enhanced package and method of fabricating the sameVIA TECH INC·Filed 2003·Granted Feb 6, 2007·10 cites·24 claims
- 2662US6946727B2Vertical routing structureVIA TECH INC·Filed 2003·Granted Sep 20, 2005·10 cites·6 claims
- 2762US6894904B2Tab packageVIA TECH INC·Filed 2003·Granted May 17, 2005·10 cites·8 claims
- 2862US6808643B2Hybrid interconnect substrate and method of manufacture thereofVIA TECH INC·Filed 2003·Granted Oct 26, 2004·9 cites·21 claims
- 2961US7342317B2Low coefficient of thermal expansion build-up layer packaging and method thereofVIA TECH INC·Filed 2004·Granted Mar 11, 2008·9 cites·24 claims
- 3059US6716692B1Fabrication process and structure of laminated capacitorVIA TECH INC·Filed 2003·Granted Apr 6, 2004·11 cites·16 claims
- 3157US6902997B2Process of forming bonding columnsVIA TECH INC·Filed 2004·Granted Jun 7, 2005·6 cites·11 claims
- 3255US6849955B2High density integrated circuit packages and method for the sameVIA TECH INC·Filed 2003·Granted Feb 1, 2005·6 cites·7 claims
- 3353US7247951B2Chip carrier with oxidation protection layerVIA TECH INC·Filed 2004·Granted Jul 24, 2007·5 cites·13 claims
- 3453US6929488B2Electrical connection device between a pin-typed IC package and a circuit boardVIA TECH INC·Filed 2003·Granted Aug 16, 2005·7 cites·13 claims
- 3551US7033917B2Packaging substrate without plating bar and a method of forming the sameVIA TECH INC·Filed 2004·Granted Apr 25, 2006·4 cites·12 claims
- 3650US7622326B2Manufacturing process of a chip package structureVIA TECH INC·Filed 2006·Granted Nov 24, 2009·0 cites·11 claims
- 3745US6896173B2Method of fabricating circuit substrateVIA TECH INC·Filed 2004·Granted May 24, 2005·1 cites·25 claims
- 3844US7504726B2Chip and manufacturing method and application thereofVIA TECH INC·Filed 2006·Granted Mar 17, 2009·0 cites·14 claims
- 3944US6743659B2Method for manufacturing multi-layer package substratesVIA TECH INC·Filed 2002·Granted Jun 1, 2004·1 cites·20 claims
- 4044US2006118931A1Assembly structure and method for embedded passive deviceHO KWUN-YAO·Filed 2005·Application pending·0 cites
- 4143US7235429B2Conductive block mounting process for electrical connectionVIA TECH INC·Filed 2004·Granted Jun 26, 2007·0 cites·21 claims
- 4242US2007164447A1Semiconductor package and fabricating method thereofHO KWUN-YAO·Filed 2006·Application pending·0 cites
- 4342US2007069352A1Bumpless chip package and fabricating process thereofHO KWUN-YAO·Filed 2006·Application pending·0 cites
- 4442US2004155357A1[chip package structure and manufacturing process thereof]Filed 2003·Application pending·0 cites
- 4542US2008084677A1Electronic apparatusVIA TECH INC·Filed 2006·Application pending·0 cites
- 4641US2006071314A1Cavity-down stacked multi-chip packageVIA TECH INC·Filed 2005·Application pending·0 cites
- 4741US2005196898A1Process of plating through holeFiled 2005·Application pending·0 cites
- 4841US2006220245A1Flip chip package and the fabrication thereofHO KWUN-YAO·Filed 2005·Application pending·0 cites
- 4941US2005258551A1Fine-pitch packaging substrate and a method of forming the sameVIA TECH INC·Filed 2005·Application pending·0 cites
- 5041US2005230797A1Chip packaging structureHO KWUN-YO·Filed 2005·Application pending·0 cites
Showing the top 50 of 61 patent records by PatentIndex Score.
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