Assignee
HO KWUN-YAO
0 granted patents·6 pending applications·0 citations·filing 2005–2009
Top patents by PatentIndex Score
6 records- 0162US2010044014A1Flat-plate loop heat conduction device and manufacturing method thereofHO KWUN-YAO·Filed 2009·Application pending·0 cites
- 0248US2010084673A1Light-emitting semiconductor packaging structure without wire bondingHO KWUN-YAO·Filed 2009·Application pending·0 cites
- 0344US2006118931A1Assembly structure and method for embedded passive deviceHO KWUN-YAO·Filed 2005·Application pending·0 cites
- 0442US2007164447A1Semiconductor package and fabricating method thereofHO KWUN-YAO·Filed 2006·Application pending·0 cites
- 0542US2007069352A1Bumpless chip package and fabricating process thereofHO KWUN-YAO·Filed 2006·Application pending·0 cites
- 0641US2006220245A1Flip chip package and the fabrication thereofHO KWUN-YAO·Filed 2005·Application pending·0 cites
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