Flat-plate loop heat conduction device and manufacturing method thereof

Abstract

A flat-plate loop heat conduction device and a manufacturing method thereof. The flat-plate loop heat conduction device includes an upper flat plate and a lower flat plate overlapping and mating with each other. Complementary partial evaporation sections, partial vapor transfer pipes, partial condensing sections and partial condensing transfer pipes are disposed on the upper and lower flat plates. After the upper and lower flat plates are mated with each other, a complete evaporation section, a complete condensing section, a complete vapor transfer pipe and a complete condensing transfer pipe are formed in communication with each other to achieve a heat conduction loop structure for a working fluid to circulate therein. The flat-plate loop heat conduction device is easier to manufacture. Moreover, the flat-plate loop heat conduction device has reinforced structure and is not subject to damage.

1 . A flat-plate loop heat conduction device at least comprising an upper flat plate and a lower flat plate overlapping and mating with each other, on a mating face of at least one of the upper and lower flat plates being disposed at least one partial evaporation section, one partial vapor transfer pipe, one partial condensing section and one partial condensing transfer pipe, two ends of the partial vapor transfer pipe being respectively connected to one end of the partial evaporation section and one end of the partial condensing section, two ends of the partial condensing transfer pipe being respectively connected to the other end of the partial evaporation section and the other end of the partial condensing section, whereby after the upper and lower flat plates are mated with each other, a complete evaporation section, a complete condensing section, a complete vapor transfer pipe and a complete condensing transfer pipe are formed between the mating faces of the upper and lower flat plates in communication with each other to achieve a loop structure within which a working fluid can circulate. 
   
   
       2 . The flat-plate loop heat conduction device as claimed in  claim 1 , wherein complementary partial winding passages are arranged in the partial condensing sections of the upper and lower flat plates, two ends of the partial winding passages being respectively connected to the partial vapor transfer pipes and the partial condensing transfer pipes, capillary structures being disposed on inner surfaces of the partial winding passages. 
   
   
       3 . The flat-plate loop heat conduction device as claimed in  claim 1 , wherein capillary structures are disposed on inner surfaces of at least one of the evaporation section, the condensing section, the vapor transfer pipe and the condensing transfer pipe. 
   
   
       4 . The flat-plate loop heat conduction device as claimed in  claim 2 , wherein capillary structures are disposed on inner surfaces of at least one of the evaporation section, the condensing section, the vapor transfer pipe and the condensing transfer pipe. 
   
   
       5 . The flat-plate loop heat conduction device as claimed in  claim 3 , wherein the capillary structures are formed with multiple channels. 
   
   
       6 . The flat-plate loop heat conduction device as claimed in  claim 3 , wherein the capillary structures are filled with sintered metal powder or ceramic powder to form porous structures. 
   
   
       7 . The flat-plate loop heat conduction device as claimed in  claim 1 , wherein there are multiple evaporation sections and one condensing section. 
   
   
       8 . The flat-plate loop heat conduction device as claimed in  claim 2 , wherein there are multiple evaporation sections and one condensing section. 
   
   
       9 . The flat-plate loop heat conduction device as claimed in  claim 3 , wherein there are multiple evaporation sections and one condensing section. 
   
   
       10 . The flat-plate loop heat conduction device as claimed in  claim 1 , wherein the upper and lower flat plates have a thickness ranging from 0.05 cm to 20 cm. 
   
   
       11 . The flat-plate loop heat conduction device as claimed in  claim 2 , wherein the upper and lower flat plates have a thickness ranging from 0.05 cm to 20 cm. 
   
   
       12 . The flat-plate loop heat conduction device as claimed in  claim 3 , wherein the upper and lower flat plates have a thickness ranging from 0.05 cm to 20 cm. 
   
   
       13 . The flat-plate loop heat conduction device as claimed in  claim 7 , wherein the upper and lower flat plates have a thickness ranging from 0.05 cm to 20 cm. 
   
   
       14 . The flat-plate loop heat conduction device as claimed in  claim 1 , wherein the upper and lower flat plates are made of at least one of the following materials: metal, alloy, ceramic material and silicon. 
   
   
       15 . The flat-plate loop heat conduction device as claimed in  claim 2 , wherein the upper and lower flat plates are made of at least one of the following materials: metal, alloy, ceramic material and silicon. 
   
   
       16 . The flat-plate loop heat conduction device as claimed in  claim 3 , wherein the upper and lower flat plates are made of at least one of the following materials: metal, alloy, ceramic material and silicon. 
   
   
       17 . The flat-plate loop heat conduction device as claimed in  claim 1 , wherein radiating fins are disposed at the condensing section. 
   
   
       18 . The flat-plate loop heat conduction device as claimed in  claim 2 , wherein radiating fins are disposed at the condensing section. 
   
   
       19 . The flat-plate loop heat conduction device as claimed in  claim 3 , wherein radiating fins are disposed at the condensing section. 
   
   
       20 . The flat-plate loop heat conduction device as claimed in  claim 10 , wherein radiating fins are disposed at the condensing section. 
   
   
       21 . A manufacturing method of a flat-plate loop heat conduction device, comprising steps of:
 preparing an upper flat plate and a lower flat plate;   forming complementary partial evaporation sections, partial vapor transfer pipes, partial condensing sections and partial condensing transfer pipe on mating faces of the upper and lower flat plates respectively, two ends of the partial vapor transfer pipes being respectively connected to one end of the partial evaporation sections and one end of the partial condensing sections, two ends of the partial condensing transfer pipes being respectively connected to the other end of the partial evaporation sections and the other end of the partial condensing sections; and   mating the upper and lower flat plates with each other to form a complete evaporation section, a complete condensing section, a complete vapor transfer pipe and a complete condensing transfer pipe between the mating faces of the upper and lower flat plates in communication with each other, whereby a loop structure is achieved for a working fluid to circulate therewithin.   
   
   
       22 . The manufacturing method of the flat-plate loop heat conduction device as claimed in  claim 19 , wherein complementary partial winding passages are arranged in the partial condensing sections of the upper and lower flat plates, two ends of the partial winding passages being respectively connected to the partial vapor transfer pipes and the partial condensing transfer pipes. 
   
   
       23 . The manufacturing method of the flat-plate loop heat conduction device as claimed in  claim 21 , wherein capillary structures are disposed on inner surfaces of at least one of the evaporation section, the condensing section, the vapor transfer pipe and the condensing transfer pipe. 
   
   
       24 . The manufacturing method of the flat-plate loop heat conduction device as claimed in  claim 23 , wherein the capillary structures are formed with multiple channels. 
   
   
       25 . The manufacturing method of the flat-plate loop heat conduction device as claimed in  claim 23 , wherein before mating the upper and lower flat plates with each other, the capillary structures are filled with sintered metal powder or ceramic powder to form porous structures. 
   
   
       26 . The manufacturing method of the flat-plate loop heat conduction device as claimed in  claim 24 , wherein the capillary structures are filled with sintered metal powder or ceramic powder to form porous structures. 
   
   
       27 . The manufacturing method of the flat-plate loop heat conduction device as claimed in  claim 23 , wherein the capillary structures are formed by means of die-casting, etching, electroplating or laser processing. 
   
   
       28 . The manufacturing method of the flat-plate loop heat conduction device as claimed in  claim 25 , wherein the capillary structures are formed by means of die-casting, etching, electroplating or laser processing. 
   
   
       29 . The manufacturing method of the flat-plate loop heat conduction device as claimed in  claim 21 , wherein the upper and lower flat plates are mated with each other by means of thermal ultrasonic welding, laser sealing or metal/nonmetal adhesion. 
   
   
       30 . The manufacturing method of the flat-plate loop heat conduction device as claimed in  claim 22 , wherein the upper and lower flat plates are mated with each other by means of thermal ultrasonic welding, laser sealing or metal/nonmetal adhesion 
   
   
       31 . The manufacturing method of the flat-plate loop heat conduction device as claimed in  claim 23 , wherein the upper and lower flat plates are mated with each other by means of thermal ultrasonic welding, laser sealing or metal/nonmetal adhesion. 
   
   
       32 . The manufacturing method of the flat-plate loop heat conduction device as claimed in  claim 25 , wherein the upper and lower flat plates are mated with each other by means of thermal ultrasonic welding, laser sealing or metal/nonmetal adhesion. 
   
   
       33 . The manufacturing method of the flat-plate loop heat conduction device as claimed in  claim 27 , wherein the upper and lower flat plates are mated with each other by means of thermal ultrasonic welding, laser sealing or metal/nonmetal adhesion. 
   
   
       34 . The manufacturing method of the flat-plate loop heat conduction device as claimed in  claim 21 , wherein the upper and lower flat plates have a thickness ranging from 0.05 cm to 20 cm. 
   
   
       35 . The manufacturing method of the flat-plate loop heat conduction device as claimed in  claim 22 , wherein the upper and lower flat plates have a thickness ranging from 0.05 cm to 20 cm. 
   
   
       36 . The manufacturing method of the flat-plate loop heat conduction device as claimed in  claim 23 , wherein the upper and lower flat plates have a thickness ranging from 0.05 cm to 20 cm. 
   
   
       37 . The manufacturing method of the flat-plate loop heat conduction device as claimed in  claim 21 , wherein the upper and lower flat plates are made of at least one of the following materials: metal, alloy, ceramic material and silicon. 
   
   
       38 . The manufacturing method of the flat-plate loop heat conduction device as claimed in  claim 22 , wherein the upper and lower flat plates are made of at least one of the following materials: metal, alloy, ceramic material and silicon. 
   
   
       39 . The manufacturing method of the flat-plate loop heat conduction device as claimed in  claim 23 , wherein the upper and lower flat plates are made of at least one of the following materials: metal, alloy, ceramic material and silicon. 
   
   
       40 . The manufacturing method of the flat-plate loop heat conduction device as claimed in  claim 25 , wherein the upper and lower flat plates are made of at least one of the following materials: metal, alloy, ceramic material and silicon. 
   
   
       41 . The manufacturing method of the flat-plate loop heat conduction device as claimed in  claim 27 , wherein the upper and lower flat plates are made of at least one of the following materials: metal, alloy, ceramic material and silicon. 
   
   
       42 . The manufacturing method of the flat-plate loop heat conduction device as claimed in  claim 28 , wherein the upper and lower flat plates are made of at least one of the following materials: metal, alloy, ceramic material and silicon. 
   
   
       43 . The manufacturing method of the flat-plate loop heat conduction device as claimed in  claim 21 , wherein radiating fins are disposed at the condensing section. 
   
   
       44 . The manufacturing method of the flat-plate loop heat conduction device as claimed in  claim 22 , wherein radiating fins are disposed at the condensing section. 
   
   
       45 . The manufacturing method of the flat-plate loop heat conduction device as claimed in  claim 23 , wherein radiating fins are disposed at the condensing section. 
   
   
       46 . The manufacturing method of the flat-plate loop heat conduction device as claimed in  claim 25 , wherein radiating fins are disposed at the condensing section. 
   
   
       47 . The manufacturing method of the flat-plate loop heat conduction device as claimed in  claim 27 , wherein radiating fins are disposed at the condensing section. 
   
   
       48 . The manufacturing method of the flat-plate loop heat conduction device as claimed in  claim 28 , wherein radiating fins are disposed at the condensing section.