Inventor · disambiguated record
Kwun-Yao Ho
Also filed as: HO KWUN-YAO
47 granted patents·23 pending applications·1,063 citations·filing 2002–2023
98Inventor score
Top patents by PatentIndex Score
70 records- 0198US7382049B2Chip package and bump connecting structure thereofVIA TECH INC·Filed 2005·Granted Jun 3, 2008·104 cites·26 claims
- 0298US6972964B2Module board having embedded chips and components and method of forming the sameVIA TECH INC·Filed 2005·Granted Dec 6, 2005·100 cites·23 claims
- 0395US6692265B2Electrical connection deviceVIA TECH INC·Filed 2002·Granted Feb 17, 2004·81 cites·26 claims
- 0491US6977348B2High density laminated substrate structure and manufacture method thereofVIA TECH INC·Filed 2002·Granted Dec 20, 2005·54 cites·7 claims
- 0590US7176559B2Integrated circuit package with a balanced-part structureVIA TECH INC·Filed 2003·Granted Feb 13, 2007·113 cites·5 claims
- 0688US7638881B2Chip packageVIA TECH INC·Filed 2006·Granted Dec 29, 2009·17 cites·15 claims
- 0788US6960826B2Multi-chip package and manufacturing method thereofVIA TECH INC·Filed 2004·Granted Nov 1, 2005·49 cites·21 claims
- 0888US6696305B2Metal post manufacturing methodVIA TECH INC·Filed 2002·Granted Feb 24, 2004·49 cites·27 claims
- 0987US7470864B2Multi-conducting through hole structureVIA TECH INC·Filed 2005·Granted Dec 30, 2008·14 cites·9 claims
- 1086US6865089B2Module board having embedded chips and components and method of forming the sameVIA TECH INC·Filed 2003·Granted Mar 8, 2005·44 cites·13 claims
- 1185US6695040B1Thin planar heat distributorVIA TECH INC·Filed 2002·Granted Feb 24, 2004·41 cites·20 claims
- 1283US6569712B2Structure of a ball-grid array package substrate and processes for producing thereofVIA TECH INC·Filed 2002·Granted May 27, 2003·45 cites·12 claims
- 1381US7071569B2Electrical package capable of increasing the density of bonding pads and fine circuit lines inside a interconnectionVIA TECH INC·Filed 2004·Granted Jul 4, 2006·25 cites·12 claims
- 1481US6779783B2Method and structure for tape ball grid array packageVIA TECH INC·Filed 2002·Granted Aug 24, 2004·39 cites·38 claims
- 1578US7180166B2Stacked multi-chip packageVIA TECH INC·Filed 2004·Granted Feb 20, 2007·24 cites·18 claims
- 1678US6707162B1Chip package structureVIA TECH INC·Filed 2003·Granted Mar 16, 2004·26 cites·19 claims
- 1777US6881662B2Pattern formation process for an integrated circuit substrateVIA TECH INC·Filed 2002·Granted Apr 19, 2005·20 cites·4 claims
- 1876US6667190B2Method for high layout density integrated circuit package substrateVIA TECH INC·Filed 2002·Granted Dec 23, 2003·19 cites·9 claims
- 1975US6716037B2Flexible electric-contact structure for IC packageVIA TECH INC·Filed 2002·Granted Apr 6, 2004·23 cites·10 claims
- 2073US6849534B2Process of forming bonding columnsVIA TECH INC·Filed 2003·Granted Feb 1, 2005·17 cites·13 claims
- 2172US6717264B2High density integrated circuit packageVIA TECH INC·Filed 2002·Granted Apr 6, 2004·15 cites·8 claims
- 2271US6876087B2Chip scale package with heat dissipating partVIA TECH INC·Filed 2003·Granted Apr 5, 2005·18 cites·5 claims
- 2370US6916687B2Bump process for flip chip packageVIA TECH INC·Filed 2003·Granted Jul 12, 2005·16 cites·31 claims
- 2465US12368349B2Composite two-phase fluid cooling motor and composite two-phase fluid cooling device thereofTECO ELECTRIC & MACHINERY CO LTD·Filed 2023·Granted Jul 22, 2025·0 cites·9 claims
- 2565US6981320B2Circuit board and fabricating process thereofVIA TECH INC·Filed 2003·Granted Jan 3, 2006·10 cites·6 claims
- 2665US6699046B2Pin grid array integrated circuit connecting deviceVIA TECH INC·Filed 2002·Granted Mar 2, 2004·13 cites·18 claims
- 2762US7173341B2High performance thermally enhanced package and method of fabricating the sameVIA TECH INC·Filed 2003·Granted Feb 6, 2007·10 cites·24 claims
- 2862US6946727B2Vertical routing structureVIA TECH INC·Filed 2003·Granted Sep 20, 2005·10 cites·6 claims
- 2962US6894904B2Tab packageVIA TECH INC·Filed 2003·Granted May 17, 2005·10 cites·8 claims
- 3062US6808643B2Hybrid interconnect substrate and method of manufacture thereofVIA TECH INC·Filed 2003·Granted Oct 26, 2004·9 cites·21 claims
- 3162US2010044014A1Flat-plate loop heat conduction device and manufacturing method thereofHO KWUN-YAO·Filed 2009·Application pending·0 cites
- 3261US7342317B2Low coefficient of thermal expansion build-up layer packaging and method thereofVIA TECH INC·Filed 2004·Granted Mar 11, 2008·9 cites·24 claims
- 3357US6902997B2Process of forming bonding columnsVIA TECH INC·Filed 2004·Granted Jun 7, 2005·6 cites·11 claims
- 3455US6849955B2High density integrated circuit packages and method for the sameVIA TECH INC·Filed 2003·Granted Feb 1, 2005·6 cites·7 claims
- 3554US6724081B2Electronic assemblyVIA TECH INC·Filed 2002·Granted Apr 20, 2004·6 cites·5 claims
- 3653US7247951B2Chip carrier with oxidation protection layerVIA TECH INC·Filed 2004·Granted Jul 24, 2007·5 cites·13 claims
- 3753US6929488B2Electrical connection device between a pin-typed IC package and a circuit boardVIA TECH INC·Filed 2003·Granted Aug 16, 2005·7 cites·13 claims
- 3851US7033917B2Packaging substrate without plating bar and a method of forming the sameVIA TECH INC·Filed 2004·Granted Apr 25, 2006·4 cites·12 claims
- 3951US2009296330A1Electronic apparatusVIA TECH INC·Filed 2009·Application pending·0 cites
- 4050US11627663B2Optical unitNIDEC CORP·Filed 2021·Granted Apr 11, 2023·0 cites·17 claims
- 4150US7622326B2Manufacturing process of a chip package structureVIA TECH INC·Filed 2006·Granted Nov 24, 2009·0 cites·11 claims
- 4248US2010084673A1Light-emitting semiconductor packaging structure without wire bondingHO KWUN-YAO·Filed 2009·Application pending·0 cites
- 4347US6711025B2Combination device of the IC connection device and the main boardVIA TECH INC·Filed 2002·Granted Mar 23, 2004·3 cites·10 claims
- 4445US6896173B2Method of fabricating circuit substrateVIA TECH INC·Filed 2004·Granted May 24, 2005·1 cites·25 claims
- 4545US2022352051A1Heat dissipation member and cooling deviceNIDEC CORP·Filed 2022·Application pending·0 cites
- 4644US7504726B2Chip and manufacturing method and application thereofVIA TECH INC·Filed 2006·Granted Mar 17, 2009·0 cites·14 claims
- 4744US6743659B2Method for manufacturing multi-layer package substratesVIA TECH INC·Filed 2002·Granted Jun 1, 2004·1 cites·20 claims
- 4844US2006118931A1Assembly structure and method for embedded passive deviceHO KWUN-YAO·Filed 2005·Application pending·0 cites
- 4943US11997793B2Optical unitNIDEC CORP·Filed 2021·Granted May 28, 2024·0 cites·16 claims
- 5043US7235429B2Conductive block mounting process for electrical connectionVIA TECH INC·Filed 2004·Granted Jun 26, 2007·0 cites·21 claims
Showing the top 50 of 70 patent records by PatentIndex Score.
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