Inventor · disambiguated record
Teruo Yoshino
Also filed as: YOSHINO TERUO
30 granted patents·8 pending applications·1,224 citations·filing 1986–2025
96Inventor score
Files withKOKUSAI ELECTRIC CORP19HITACHI INT ELECTRIC INC7TOSHIBA KK4TOSHIBA MITSUBISHI ELEC IND3HAMANO KATSUYOSHI1
Top patents by PatentIndex Score
38 records- 0198US9929005B1Method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2016·Granted Mar 27, 2018·345 cites·7 claims
- 0298US9870964B1Method of manufacturing semiconductor device by determining and selecting cooling recipe based on temperatureHITACHI INT ELECTRIC INC·Filed 2017·Granted Jan 16, 2018·418 cites·10 claims
- 0397US11538661B1Substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2022·Granted Dec 27, 2022·3 cites·19 claims
- 0495US8443484B2Substrate processing apparatusOZAKI YUKIO·Filed 2008·Granted May 21, 2013·327 cites·9 claims
- 0594US11905596B2Method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2021·Granted Feb 20, 2024·2 cites·12 claims
- 0690US11841343B2Method of processing substrate, substrate processing apparatus, method of manufacturing semiconductor processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Granted Dec 12, 2023·1 cites·18 claims
- 0790US11495435B2Substrate processing apparatus, non-transitory computer-readable recording medium, method of manufacturing semiconductor device, and a substrate processing methodKOKUSAI ELECTRIC CORP·Filed 2020·Granted Nov 8, 2022·2 cites·10 claims
- 0889US10934622B2Substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2018·Granted Mar 2, 2021·5 cites·9 claims
- 0988US6742977B1Substrate processing device, substrate conveying device, and substrate processing methodKOKUSAI ELECTRIC CO LTD·Filed 2000·Granted Jun 1, 2004·75 cites·18 claims
- 1087US12424409B2Substrate processing apparatus, substrate processing method, method of manufacturing semiconductor device, and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Granted Sep 23, 2025·0 cites·20 claims
- 1186US7767053B2Substrate processing apparatus and substrate processing methodHITACHI INT ELECTRIC INC·Filed 2007·Granted Aug 3, 2010·14 cites·3 claims
- 1286US2025343060A1Substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 1385US12387949B2Substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2024·Granted Aug 12, 2025·0 cites·20 claims
- 1482US12320778B2Method of processing substrate, substrate processing apparatus, method of manufacturing semiconductor processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2023·Granted Jun 3, 2025·0 cites·16 claims
- 1582US12195854B2Substrate processing apparatus, method of processing substrate, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Granted Jan 14, 2025·0 cites·20 claims
- 1682US11923173B2Substrate processing apparatus, substrate processing method, method of manufacturing semiconductor device, and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Granted Mar 5, 2024·0 cites·20 claims
- 1780US2025271401A1Substrate processing apparatus, processing method, method of manufacturing semiconductor processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 1878US11145491B2Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2020·Granted Oct 12, 2021·1 cites·16 claims
- 1973US11967513B2Substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2021·Granted Apr 23, 2024·0 cites·20 claims
- 2073US9236246B2Substrate processing apparatus and a method of manufacturing a semiconductor deviceHAMANO KATSUYOSHI·Filed 2012·Granted Jan 12, 2016·4 cites·6 claims
- 2168US11384431B2Substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2017·Granted Jul 12, 2022·1 cites·18 claims
- 2268US2023029994A1Substrate Processing ApparatusKOKUSAI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 2362US2024363309A1Substrate processing apparatus, semiconductor device manufacturing method, and substrate processing methodKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 2460US12106998B2Substrate processing apparatus, substrate processing method, non-transitory computer-readable recording medium and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2022·Granted Oct 1, 2024·0 cites·11 claims
- 2560US11155922B2Method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2018·Granted Oct 26, 2021·0 cites·6 claims
- 2656US2023317438A1Maintenance method, method of manufacturing semiconductor device, non-transitory computer-readable recording medium and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 2751US10938297B2AC-DC conversion device and method for controlling same by controlling the timing of multiple switch portionsTOSHIBA MITSUBISHI ELEC IND·Filed 2019·Granted Mar 2, 2021·0 cites·17 claims
- 2847US9472424B2Substrate processing apparatus and a method of manufacturing a semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2015·Granted Oct 18, 2016·0 cites·8 claims
- 2945US2020312625A1Substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2020·Application pending·0 cites
- 3044US10404157B2AC-DC conversion device and method for controlling same by controlling the timing of multiple switch portionsTOSHIBA MITSUBISHI ELEC IND·Filed 2016·Granted Sep 3, 2019·0 cites·19 claims
- 3141US10581338B2Power supply systemNAT UNIV CORP YOKOHAMA NAT UNIV·Filed 2016·Granted Mar 3, 2020·0 cites·11 claims
- 3241US4680691AMethod and system for preventing an excessive voltage build-up in a power converter systemTOSHIBA KK·Filed 1986·Granted Jul 14, 1987·8 cites·4 claims
- 3340US11271508B2Power conversion device, motor driving system, and control methodTOSHIBA MITSUBISHI ELEC IND·Filed 2019·Granted Mar 8, 2022·0 cites·15 claims
- 3438US4859884AGate signal generator for thyristor valveTOSHIBA KK·Filed 1988·Granted Aug 22, 1989·11 cites·9 claims
- 3538US2006252283A1Substrate processing apparatus and sustrate processing methodHITACHI INT ELECTRIC INC·Filed 2004·Application pending·0 cites
- 3631US2001035124A1Substrate processing apparatus and semiconductor manufacturing methodFiled 2001·Application pending·0 cites
- 3730US5410464AVoltage-type self-commutated conversion system with voltage controlTOSHIBA KK·Filed 1993·Granted Apr 25, 1995·2 cites·6 claims
- 3829US5170334ABypass-pair control apparatus for thyristor bridgeTOSHIBA KK·Filed 1991·Granted Dec 8, 1992·5 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →