Inventor · disambiguated record
Won Hee Yoo
Also filed as: YOO WON HEE
13 granted patents·8 pending applications·2 citations·filing 2008–2023
82Inventor score
Top patents by PatentIndex Score
21 records- 0178US10937592B2Conductive powder for internal electrode and capacitor component including the sameSAMSUNG ELECTRO MECH·Filed 2018·Granted Mar 2, 2021·1 cites·12 claims
- 0268US11594371B2Conductive powder for internal electrode and capacitor component including the sameSAMSUNG ELECTRO MECH·Filed 2021·Granted Feb 28, 2023·0 cites·16 claims
- 0364US11164700B2Multilayer capacitorSAMSUNG ELECTRO MECH·Filed 2020·Granted Nov 2, 2021·0 cites·17 claims
- 0463US12142432B2Multilayer capacitorSAMSUNG ELECTRO MECH·Filed 2022·Granted Nov 12, 2024·0 cites·20 claims
- 0562US11984269B2Ceramic electronic componentSAMSUNG ELECTRO MECH·Filed 2022·Granted May 14, 2024·0 cites·19 claims
- 0661US10796855B2Multilayer capacitorSAMSUNG ELECTRO MECH·Filed 2018·Granted Oct 6, 2020·0 cites·19 claims
- 0757US11631536B2Electronic componentSAMSUNG ELECTRO MECH·Filed 2021·Granted Apr 18, 2023·0 cites·17 claims
- 0857US8198198B2Method for forming electrode pattern of ceramic substrateYOO WON HEE·Filed 2009·Granted Jun 12, 2012·1 cites·8 claims
- 0956US12094655B2Electronic component and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2021·Granted Sep 17, 2024·0 cites·19 claims
- 1056US11569039B2Conductive powder particle for internal electrode and electronic component, and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2021·Granted Jan 31, 2023·0 cites·20 claims
- 1156US2024212933A1Multilayer electronic componentSAMSUNG ELECTRO MECH·Filed 2023·Application pending·0 cites
- 1250US2011011631A1Ceramic substrate and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 1350US2010300733A1Multilayer ceramic board and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 1449US8106306B2Ceramic multi-layer circuit substrate and manufacturing method thereofYOO WON HEE·Filed 2009·Granted Jan 31, 2012·0 cites·6 claims
- 1547US8198908B2Probe substrate with auxiliary contact pads and probe card therewithYOO WON HEE·Filed 2009·Granted Jun 12, 2012·0 cites·9 claims
- 1646US9101064B2Thin film electrode ceramic substrate and method for manufacturing the sameYOO WON HEE·Filed 2012·Granted Aug 4, 2015·0 cites·6 claims
- 1745US2013032384A1Thin film electrode ceramic substrate and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2012·Application pending·0 cites
- 1842US2009294297A1Method of forming plating layerSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 1941US2012037610A1Ceramic firing furnaceYOO WON HEE·Filed 2011·Application pending·0 cites
- 2038US2013017504A1FurnaceSAMSUNG ELECTRO MECH·Filed 2012·Application pending·0 cites
- 2138US2011148447A1Multilayer ceramic substrate and probe board using pillar-type conductor and fabricating methods of the sameSAMSUNG ELECTRO MECH·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →