Inventor · disambiguated record
Krishna K. Nair
Also filed as: NAIR KRISHNA K · NAIR KRISHNA KIRAN GANGADHARAN
8 granted patents·1 pending application·207 citations·filing 1981–2014
89Inventor score
Top patents by PatentIndex Score
9 records- 0193US7297631B2Methods of forming electronic structures including conductive shunt layers and related structuresUNITIVE INT LTD·Filed 2005·Granted Nov 20, 2007·25 cites·32 claims
- 0292US4386116AProcess for making multilayer integrated circuit substrateIBM·Filed 1981·Granted May 31, 1983·93 cites·4 claims
- 0391US10121187B1Generate a video of an itemAMAZON TECH INC·Filed 2014·Granted Nov 6, 2018·20 cites·20 claims
- 0485US6960828B2Electronic structures including conductive shunt layersUNITIVE INT LTD·Filed 2003·Granted Nov 1, 2005·31 cites·18 claims
- 0585US6863209B2Low temperature methods of bonding componentsUNITIVIE INTERNAT LTD·Filed 2001·Granted Mar 8, 2005·27 cites·55 claims
- 0675US8294269B2Electronic structures including conductive layers comprising copper and having a thickness of at least 0.5 micrometersNAIR KRISHNA K·Filed 2010·Granted Oct 23, 2012·4 cites·17 claims
- 0765US7879715B2Methods of forming electronic structures including conductive shunt layers and related structuresUNITIVE INT LTD·Filed 2007·Granted Feb 1, 2011·2 cites·20 claims
- 0861US7156284B2Low temperature methods of bonding components and related structuresUNITIVE INT LTD·Filed 2004·Granted Jan 2, 2007·5 cites·45 claims
- 0945US2007040003A1Low temperature methods of bonding components and related structuresRINNE GLENN A·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →