Assignee
UNITIVE INT LTD
AN·22 granted patents·1 pending application·511 citations·filing 1998–2009
Top patents by PatentIndex Score
23 records- 0194US7427557B2Methods of forming bumps using barrier layers as etch masksUNITIVE INT LTD·Filed 2005·Granted Sep 23, 2008·28 cites·15 claims
- 0293US7297631B2Methods of forming electronic structures including conductive shunt layers and related structuresUNITIVE INT LTD·Filed 2005·Granted Nov 20, 2007·25 cites·32 claims
- 0392US6392163B1Controlled-shaped solder reservoirs for increasing the volume of solder bumpsUNITIVE INT LTD·Filed 2001·Granted May 21, 2002·73 cites·28 claims
- 0492US6329608B1Key-shaped solder bumps and under bump metallurgyUNITIVE INT LTD·Filed 1999·Granted Dec 11, 2001·65 cites·13 claims
- 0591US7213740B2Optical structures including liquid bumps and related methodsUNITIVE INT LTD·Filed 2005·Granted May 8, 2007·16 cites·8 claims
- 0690US6389691B1Methods for forming integrated redistribution routing conductors and solder bumpsUNITIVE INT LTD·Filed 1999·Granted May 21, 2002·59 cites·29 claims
- 0787US7579694B2Electronic devices including offset conductive bumpsUNITIVE INT LTD·Filed 2006·Granted Aug 25, 2009·19 cites·19 claims
- 0885US6960828B2Electronic structures including conductive shunt layersUNITIVE INT LTD·Filed 2003·Granted Nov 1, 2005·31 cites·18 claims
- 0985US6388203B1Controlled-shaped solder reservoirs for increasing the volume of solder bumps, and structures formed therebyUNITIVE INT LTD·Filed 1998·Granted May 14, 2002·74 cites·21 claims
- 1084US7834454B2Electronic structures including barrier layers defining lipsUNITIVE INT LTD·Filed 2008·Granted Nov 16, 2010·9 cites·21 claims
- 1183US7531898B2Non-Circular via holes for bumping pads and related structuresUNITIVE INT LTD·Filed 2005·Granted May 12, 2009·12 cites·40 claims
- 1281US7839000B2Solder structures including barrier layers with nickel and/or copperUNITIVE INT LTD·Filed 2009·Granted Nov 23, 2010·11 cites·18 claims
- 1380US7547623B2Methods of forming lead free solder bumpsUNITIVE INT LTD·Filed 2005·Granted Jun 16, 2009·11 cites·28 claims
- 1479US6793792B2Electroplating methods including maintaining a determined electroplating voltage and related systemsUNITIVE INT LTD·Filed 2002·Granted Sep 21, 2004·16 cites·36 claims
- 1573US7659621B2Solder structures for out of plane connectionsUNITIVE INT LTD·Filed 2006·Granted Feb 9, 2010·4 cites·41 claims
- 1669US7550849B2Conductive structures including titanium-tungsten base layersUNITIVE INT LTD·Filed 2007·Granted Jun 23, 2009·5 cites·34 claims
- 1769US7495326B2Stacked electronic structures including offset substratesUNITIVE INT LTD·Filed 2003·Granted Feb 24, 2009·15 cites·71 claims
- 1868US7244671B2Methods of forming conductive structures including titanium-tungsten base layers and related structuresUNITIVE INT LTD·Filed 2004·Granted Jul 17, 2007·17 cites·42 claims
- 1965US7879715B2Methods of forming electronic structures including conductive shunt layers and related structuresUNITIVE INT LTD·Filed 2007·Granted Feb 1, 2011·2 cites·20 claims
- 2063US7049216B2Methods of providing solder structures for out plane connectionsUNITIVE INT LTD·Filed 2004·Granted May 23, 2006·8 cites·49 claims
- 2161US7156284B2Low temperature methods of bonding components and related structuresUNITIVE INT LTD·Filed 2004·Granted Jan 2, 2007·5 cites·45 claims
- 2254US7665652B2Electronic devices including metallurgy structures for wire and solder bondingUNITIVE INT LTD·Filed 2004·Granted Feb 23, 2010·6 cites·38 claims
- 2351US2007152020A1Optical structures including liquid bumpsUNITIVE INT LTD·Filed 2007·Application pending·0 cites
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