Inventor · disambiguated record
Mark Pavier
Also filed as: PAVIER MARK
52 granted patents·12 pending applications·513 citations·filing 2000–2025
98Inventor score
Files withINT RECTIFIER CORP34INFINEON TECHNOLOGIES AG12INFINEON TECHNOLOGIES AMERICAS CORP6PAVIER MARK5CYPRESS SEMICONDUCTOR CORP2
Top patents by PatentIndex Score
64 records- 0195US6593622B2Power mosfet with integrated drivers in a common packageINT RECTIFIER CORP·Filed 2002·Granted Jul 15, 2003·99 cites·17 claims
- 0294US7227198B2Half-bridge packageINT RECTIFIER CORP·Filed 2005·Granted Jun 5, 2007·48 cites·16 claims
- 0393US10074590B1Molded package with chip carrier comprising brazed electrically conductive layersINFINEON TECHNOLOGIES AG·Filed 2017·Granted Sep 11, 2018·16 cites·30 claims
- 0493US7345563B2Embedded inductor for semiconductor device circuitINT RECTIFIER CORP·Filed 2006·Granted Mar 18, 2008·23 cites·12 claims
- 0591US7547964B2Device packages having a III-nitride based power semiconductor deviceINT RECTIFIER CORP·Filed 2006·Granted Jun 16, 2009·26 cites·12 claims
- 0689US9159703B2Power converter package including vertically stacked driver ICINT RECTIFIER CORP·Filed 2013·Granted Oct 13, 2015·8 cites·14 claims
- 0789US7745930B2Semiconductor device packages with substrates for redistributing semiconductor device electrodesINT RECTIFIER CORP·Filed 2006·Granted Jun 29, 2010·27 cites·17 claims
- 0885US11609180B2Emitter package for a photoacoustic sensorINFINEON TECHNOLOGIES AG·Filed 2020·Granted Mar 21, 2023·2 cites·14 claims
- 0984US6838735B1Trench FET with non overlapping poly and remote contact thereforINT RECTIFIER CORP·Filed 2000·Granted Jan 4, 2005·38 cites·22 claims
- 1082US9269655B2Method for fabricating a semiconductor package with conductive carrier integrated heat spreaderINT RECTIFIER CORP·Filed 2015·Granted Feb 23, 2016·3 cites·20 claims
- 1181US7671455B2Semiconductor device package with integrated heat spreaderINT RECTIFIER CORP·Filed 2006·Granted Mar 2, 2010·10 cites·14 claims
- 1281US7402507B2Semiconductor package fabricationINT RECTIFIER CORP·Filed 2006·Granted Jul 22, 2008·12 cites·22 claims
- 1379US7678609B2Semiconductor package with redistributed padsINT RECTIFIER CORP·Filed 2006·Granted Mar 16, 2010·9 cites·26 claims
- 1479US7235877B2Redistributed solder pads using etched lead frameINT RECTIFIER CORP·Filed 2005·Granted Jun 26, 2007·7 cites·18 claims
- 1578US6717260B2Clip-type lead frame for source mounted dieINT RECTIFIER CORP·Filed 2002·Granted Apr 6, 2004·25 cites·17 claims
- 1676US2024404983A1Method for Fabricating a Semiconductor DeviceINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 1775US7095099B2Low profile package having multiple dieINT RECTIFIER CORP·Filed 2004·Granted Aug 22, 2006·25 cites·25 claims
- 1875US6858922B2Back-to-back connected power semiconductor device packageINT RECTIFIER CORP·Filed 2002·Granted Feb 22, 2005·23 cites·8 claims
- 1973US9111921B2Semiconductor package with conductive carrier integrated heat spreaderINT RECTIFIER CORP·Filed 2013·Granted Aug 18, 2015·2 cites·14 claims
- 2072US7250672B2Dual semiconductor die package with reverse lead formINT RECTIFIER CORP·Filed 2004·Granted Jul 31, 2007·22 cites·22 claims
- 2172US6891739B2H-bridge with power switches and control in a single packageINT RECTIFIER CORP·Filed 2002·Granted May 10, 2005·20 cites·7 claims
- 2271US8836145B2Power semiconductor device with reduced contact resistanceINT RECTIFIER CORP·Filed 2013·Granted Sep 16, 2014·2 cites·20 claims
- 2371US8089147B2IMS formed as can for semiconductor housingPAVIER MARK·Filed 2006·Granted Jan 3, 2012·7 cites·20 claims
- 2468US7365423B2Redistributed solder pads using etched lead frameINT RECTIFIER CORP·Filed 2007·Granted Apr 29, 2008·3 cites·8 claims
- 2566US12068274B2Semiconductor die being connected with a clip and a wire which is partially disposed under the clipINFINEON TECHNOLOGIES AG·Filed 2020·Granted Aug 20, 2024·0 cites·20 claims
- 2666US9299690B2Method for fabricating a power semiconductor package including vertically stacked driver ICINFINEON TECHNOLOGIES AMERICAS CORP·Filed 2015·Granted Mar 29, 2016·1 cites·11 claims
- 2766US8390131B2Semiconductor device with reduced contact resistanceFUCHS SVEN·Filed 2007·Granted Mar 5, 2013·4 cites·17 claims
- 2865US8143729B2Autoclave capable chip-scale packagePAVIER MARK·Filed 2009·Granted Mar 27, 2012·4 cites·20 claims
- 2964US12499343B2Wafer-level package sensor deviceINFINEON TECHNOLOGIES AG·Filed 2023·Granted Dec 16, 2025·0 cites·18 claims
- 3064US7034344B2Integrated semiconductor power device for multiple battery systemsINT RECTIFIER CORP·Filed 2004·Granted Apr 25, 2006·12 cites·9 claims
- 3162US2024288363A1Package for an optical radiation deviceINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 3261US9397212B2Power converter package including top-drain configured power FETINT RECTIFIER CORP·Filed 2013·Granted Jul 19, 2016·1 cites·20 claims
- 3361US7678680B2Semiconductor device with reduced contact resistanceINT RECTIFIER CORP·Filed 2005·Granted Mar 16, 2010·2 cites·16 claims
- 3458US8026580B2Semiconductor device package with integrated heat spreaderINT RECTIFIER CORP·Filed 2006·Granted Sep 27, 2011·1 cites·20 claims
- 3558US6894397B2Plural semiconductor devices in monolithic flip chipINT RECTIFIER CORP·Filed 2002·Granted May 17, 2005·8 cites·22 claims
- 3658US6723620B1Power semiconductor die attach process using conductive adhesive filmINT RECTIFIER CORP·Filed 2000·Granted Apr 20, 2004·8 cites·10 claims
- 3757US8552543B2Semiconductor packagePAVIER MARK·Filed 2007·Granted Oct 8, 2013·1 cites·20 claims
- 3856US10103076B2Semiconductor package including a semiconductor die having redistributed padsINFINEON TECHNOLOGIES AMERICAS CORP·Filed 2017·Granted Oct 16, 2018·0 cites·8 claims
- 3956US8466546B2Chip-scale packageFARLOW ANDY·Filed 2006·Granted Jun 18, 2013·3 cites·19 claims
- 4056US6924175B2Clip-type lead frame for source mounted dieINT RECTIFIER CORP·Filed 2004·Granted Aug 2, 2005·6 cites·5 claims
- 4155US2025079330A1Embedded chip-package, semiconductor package, method of forming an embedded chip-package, method of forming a semiconductor package, and method of analyzing an embedded chip-package or a semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 4255US2018366380A1Semiconductor package including a semiconductor die having redistributed padsINFINEON TECHNOLOGIES AMERICAS CORP·Filed 2018·Application pending·0 cites
- 4355US2024413094A1Semiconductor die shielding structureCYPRESS SEMICONDUCTOR CORP·Filed 2023·Application pending·0 cites
- 4454US9673109B2Method for fabricating a semiconductor package with conductive carrier integrated heat spreaderINFINEON TECHNOLOGIES AMERICAS CORP·Filed 2016·Granted Jun 6, 2017·0 cites·20 claims
- 4554US2024203836A1Semiconductor package including a high voltage semiconductor die and a gate driver semiconductor die, and method of producing the semiconductor packageINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2022·Application pending·0 cites
- 4653US10283432B2Molded package with chip carrier comprising brazed electrically conductive layersINFINEON TECHNOLOGIES AG·Filed 2018·Granted May 7, 2019·0 cites·20 claims
- 4753US9502395B2Power semiconductor package having vertically stacked driver ICINFINEON TECHNOLOGIES AMERICAS CORP·Filed 2015·Granted Nov 22, 2016·0 cites·12 claims
- 4853US2015001722A1Semiconductor Device with Reduced Contact ResistanceINT RECTIFIER CORP·Filed 2014·Application pending·0 cites
- 4953US2024145402A1Semiconductor die shielding structureCYPRESS SEMICONDUCTOR CORP·Filed 2022·Application pending·0 cites
- 5052US2024030502A1Semiconductor device, battery management system and method of producing a semiconductor deviceINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2023·Application pending·0 cites
Showing the top 50 of 64 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →