Semiconductor package including a semiconductor die having redistributed pads

Abstract

A semiconductor package that includes a semiconductor die, an insulation around the die, and a conforming conductive pad coupled to an electrode of the die.

1 . A semiconductor package, comprising:
 a semiconductor die including at least one electrode disposed on one major surface thereof, said electrode having a first area;   an insulation body disposed around said semiconductor die;   a conforming conductive pad being coupled to said at least one electrode and extending over and conforming to a portion of said insulation body; and   a passivation body disposed over said conforming conductive pad, said passivation body including at least one opening over said conforming conductive pad such that an exposed portion of said conforming conductive pad is exposed by said opening, wherein said exposed portion has a second area that is larger than said first area of said electrode.   
     
     
         2 . The package of  claim 1 , wherein said conforming conductive pad includes a solderable surface. 
     
     
         3 . (canceled) 
     
     
         4 . The package of  claim 1 , wherein said passivation body includes solder resist characteristics. 
     
     
         5 . The package of  claim 1 , further comprising a conductive clip having a web portion coupled to another major surface of said semiconductor die opposite said one major surface. 
     
     
         6 . The package of  claim 5 , wherein said clip includes at least one lead extending from an edge of said web portion and including a connection surface generally coplanar with said conforming conductive pad. 
     
     
         7 . The package of  claim 6 , wherein said web portion is coupled to said another major surface by a conductive adhesive body. 
     
     
         8 . The package of  claim 7 , wherein said conductive adhesive body is comprised of solder or a conductive epoxy. 
     
     
         9 . The package of  claim 1 , further comprising a conductive plate coupled to another major surface of said semiconductor die opposite said one major surface. 
     
     
         10 . The package of  claim 9 , wherein said conductive plate is coupled to said another major surface with a conductive adhesive body. 
     
     
         11 . The package of  claim 10 , wherein said conductive adhesive body is comprised of either solder or a conductive epoxy. 
     
     
         12 . The package of  claim 9 , further comprising a conductive clip having a web portion coupled to said conductive plate. 
     
     
         13 . The package of  claim 12 , wherein said conductive clip includes at least one lead extending from an edge of said web portion and including a connection surface generally coplanar with said conforming conductive pad. 
     
     
         14 - 25 . (canceled) 
     
     
         26 . A method for fabricating a semiconductor package, comprising:
 coupling a first major surface of a semiconductor die to a metallic body;   depositing an insulation body over said semiconductor die;   removing a portion of said insulation body to expose at least one electrode of said semiconductor die on a second major surface of said semiconductor die opposite said first surface, said one electrode having a first area;   forming a conductive pad on said one electrode and extending over said insulation body; and   forming a passivation body over said conductive pad, said passivation body including at least one opening over said conductive pad such that an exposed portion of said conductive pad is exposed by said opening, wherein said exposed portion has a second area that is larger than said first area of said electrode.   
     
     
         27 . The method of  claim 26 , wherein said insulation body is photoimageable. 
     
     
         28 . The method of  claim 26 , wherein said conductive pad is formed by forming a seed layer of a conductive material on said one electrode and plating a conductive body on said seed layer. 
     
     
         29 . The method of  claim 26 , wherein said conductive pad is comprised of copper. 
     
     
         30 . The method of  claim 26 , wherein said metallic body is a metallic plate. 
     
     
         31 . The method of  claim 26 , wherein said metallic body is a metallic clip. 
     
     
         32 . The method of  claim 31 , wherein said clip includes a connection surface that is generally coplanar with said conductive pad. 
     
     
         33 . The method of  claim 31 , wherein said metallic clip is cup-shaped.