Inventor · disambiguated record
Syuichiro Yamamoto
Also filed as: YAMAMOTO SYUICHIRO
7 granted patents·1 pending application·199 citations·filing 1998–2002
86Inventor score
Files withTDK CORP8
Top patents by PatentIndex Score
8 records- 0190US6204454B1Wiring board and process for the production thereofTDK CORP·Filed 1998·Granted Mar 20, 2001·115 cites·13 claims
- 0271US6282781B1Resin package fabrication processTDK CORP·Filed 1998·Granted Sep 4, 2001·42 cites·4 claims
- 0350US6749183B2Production method of electronic parts and water treatment apparatusTDK CORP·Filed 2002·Granted Jun 15, 2004·1 cites·4 claims
- 0447US6730858B2Circuit board having bonding areas to be joined with bumps by ultrasonic bondingTDK CORP·Filed 1998·Granted May 4, 2004·14 cites·11 claims
- 0546US6471783B1Production method of electronic parts and water treatment apparatusTDK CORP·Filed 1999·Granted Oct 29, 2002·8 cites·3 claims
- 0644US6263565B1Method of manufacturing a substrate having electrode arcs for connecting to surface-mounted electronic parts and substrate manufactured by sameTDK CORP·Filed 1998·Granted Jul 24, 2001·10 cites·10 claims
- 0742US6320739B1Electronic part and manufacturing method thereforTDK CORP·Filed 1999·Granted Nov 20, 2001·9 cites·2 claims
- 0837US2002014687A1Electronic part and manufacturing method thereforTDK CORP·Filed 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →