Electronic part and manufacturing method therefor

Abstract

An electronic part in which a chip 2 having bump electrodes is sealed in a cavity 14 of a resin container 10 , wherein the resin container having: a mounting board 1 having a conductor pattern 4 for bump-mounting the chip 2 ; an intermediate board 5 overlaid on the mounting board 1 and having a window for forming an inner wall apart from the chip 2 for predetermined distances; a cover board overlaid on the intermediate board 5 to cover the window; a first adhesive layer 8 which is interposed between overlaid portions of the mounting board 1 and the intermediate board 5 ; and a second adhesive layer 9 which is interposed between overlaid portion of the intermediate board 5 and the cover board 7 , wherein the first and second adhesive layers 8 and 9 between which the intermediate board 5 is interposed are heated and pressed at a time in a direction of the thickness of each of the mounting board 1 and the cover board 7 , and the mounting board 1 , the intermediate board 5 and the cover board 7 are brought into intimate contact with one another so as to seal and form the cavity 14 defined by the inner wall of the window.

What is claimed is:  
     
         1 . An electronic part in which a chip device having bump electrodes is sealed in a cavity of a resin container, wherein 
 said resin container includes;    a mounting board having a conductor pattern formed on at least either surface of a resin member for the purpose of bump-mounting said chip device;    an intermediate board constituted by a frame-shape resin member which is overlaid on said mounting board, which has a window for forming an inner wall apart from said chip device for predetermined distances and which is made of a frame-shape resin member;    a cover board constituted by a resin member overlaid on said intermediate board to cover said window;    a first adhesive layer which is interposed between overlaid portions of said mounting board and said intermediate board; and    a second adhesive layer which is interposed between overlaid portion of said intermediate board and said cover board;    wherein said first and second adhesive layers between which said intermediate board is interposed are heated and pressed at a time in a direction of the thickness of each of said mounting board and said cover board, and said mounting board, said intermediate board and said cover board are brought into intimate contact with one another so as to seal and form the cavity defined by the inner wall of said window.    
     
     
         2 . An electronic part as claimed in  claim 1 , wherein said mounting board, intermediate board, and cover board are made of resin materials substantially having the same thermal expansion coefficients