Inventor · disambiguated record
Jitsuo Kanazawa
Also filed as: KANAZAWA JITSUO
18 granted patents·1 pending application·512 citations·filing 1982–2006
95Inventor score
Top patents by PatentIndex Score
19 records- 0193US7505239B2Light emitting deviceTDK CORP·Filed 2006·Granted Mar 17, 2009·29 cites·21 claims
- 0292US6417026B2Acoustic wave device face-down mounted on a substrateTDK CORP·Filed 2001·Granted Jul 9, 2002·73 cites·6 claims
- 0391US6181015B1Face-down mounted surface acoustic wave deviceTDK CORP·Filed 1999·Granted Jan 30, 2001·115 cites·4 claims
- 0490US6204454B1Wiring board and process for the production thereofTDK CORP·Filed 1998·Granted Mar 20, 2001·115 cites·13 claims
- 0580US7671468B2Light emitting apparatusTDK CORP·Filed 2006·Granted Mar 2, 2010·11 cites·15 claims
- 0680US6460591B1Ultrasonic bonding method and ultrasonic bonding apparatusTDK CORP·Filed 2000·Granted Oct 8, 2002·27 cites·2 claims
- 0773US6281436B1Encapsulated surface mounting electronic partTDK CORP·Filed 2000·Granted Aug 28, 2001·18 cites·6 claims
- 0871US7355251B2Light emitting deviceTDK CORP·Filed 2006·Granted Apr 8, 2008·5 cites·8 claims
- 0971US6282781B1Resin package fabrication processTDK CORP·Filed 1998·Granted Sep 4, 2001·42 cites·4 claims
- 1061US4510813ATemperature compensation circuit for strain gaugesISHIDA SCALE MFG CO LTD·Filed 1982·Granted Apr 16, 1985·16 cites·8 claims
- 1156US6565687B2Ultrasonic bonding methodTDK CORP·Filed 2002·Granted May 20, 2003·6 cites·5 claims
- 1252US6382495B2Chip junction nozzleTDK CORP·Filed 2001·Granted May 7, 2002·5 cites·5 claims
- 1350US6749183B2Production method of electronic parts and water treatment apparatusTDK CORP·Filed 2002·Granted Jun 15, 2004·1 cites·4 claims
- 1447US6730858B2Circuit board having bonding areas to be joined with bumps by ultrasonic bondingTDK CORP·Filed 1998·Granted May 4, 2004·14 cites·11 claims
- 1546US6471783B1Production method of electronic parts and water treatment apparatusTDK CORP·Filed 1999·Granted Oct 29, 2002·8 cites·3 claims
- 1644US6263565B1Method of manufacturing a substrate having electrode arcs for connecting to surface-mounted electronic parts and substrate manufactured by sameTDK CORP·Filed 1998·Granted Jul 24, 2001·10 cites·10 claims
- 1742US6320739B1Electronic part and manufacturing method thereforTDK CORP·Filed 1999·Granted Nov 20, 2001·9 cites·2 claims
- 1839US6189760B1Chip junction nozzleTDK CORP·Filed 1999·Granted Feb 20, 2001·8 cites·8 claims
- 1937US2002014687A1Electronic part and manufacturing method thereforTDK CORP·Filed 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →