Inventor · disambiguated record
Seiichi Kondo
Also filed as: KONDO SEIICHI
41 granted patents·14 pending applications·1,058 citations·filing 1984–2025
98Inventor score
Top patents by PatentIndex Score
55 records- 0198US6117775APolishing methodHITACHI LTD·Filed 1998·Granted Sep 12, 2000·254 cites·50 claims
- 0296US6562719B2Methods of polishing, interconnect-fabrication, and producing semiconductor devicesHITACHI LTD·Filed 2001·Granted May 13, 2003·88 cites·20 claims
- 0393US6899603B2Polishing apparatusRENESAS TECH CORP·Filed 2004·Granted May 31, 2005·37 cites·14 claims
- 0492US6561883B1Method of polishingHITACHI LTD·Filed 2000·Granted May 13, 2003·59 cites·21 claims
- 0591US7659201B2Process for manufacturing semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2008·Granted Feb 9, 2010·10 cites·26 claims
- 0691US6774041B1Polishing method, metallization fabrication method, method for manufacturing semiconductor device and semiconductor deviceRENESAS TECH CORP·Filed 2000·Granted Aug 10, 2004·52 cites·21 claims
- 0790US6326299B1Method for manufacturing a semiconductor deviceHITACHI LTD·Filed 1999·Granted Dec 4, 2001·88 cites·45 claims
- 0889US6596638B1Polishing methodHITACHI LTD·Filed 2000·Granted Jul 22, 2003·33 cites·41 claims
- 0987US6750128B2Methods of polishing, interconnect-fabrication, and producing semiconductor devicesRENESAS TECH CORP·Filed 2003·Granted Jun 15, 2004·34 cites·12 claims
- 1086US6565422B1Polishing apparatus using substantially abrasive-free liquid with mixture unit near polishing unit, and plant using the polishing apparatusHITACHI LTD·Filed 2000·Granted May 20, 2003·29 cites·21 claims
- 1186US6509273B1Method for manufacturing a semiconductor deviceHITACHI LTD·Filed 2000·Granted Jan 21, 2003·36 cites·45 claims
- 1285US6376345B1Process for manufacturing semiconductor integrated circuit deviceHITACHI LTD·Filed 1999·Granted Apr 23, 2002·46 cites·107 claims
- 1385US5235449APolarizer with patterned diacetylene layer, method for producing the same, and liquid crystal display device including such polarizerHITACHI LTD·Filed 1991·Granted Aug 10, 1993·71 cites·19 claims
- 1484US7510970B2Process for manufacturing semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2006·Granted Mar 31, 2009·5 cites·8 claims
- 1582US6458674B1Process for manufacturing semiconductor integrated circuit deviceHITACHI LTD·Filed 2002·Granted Oct 1, 2002·16 cites·101 claims
- 1681US6638854B2Semiconductor device and method for manufacturing the sameHITACHI LTD·Filed 2002·Granted Oct 28, 2003·25 cites·16 claims
- 1780US6719618B2Polishing apparatusRENESAS TECH CORP·Filed 2001·Granted Apr 13, 2004·17 cites·15 claims
- 1878US6531400B2Process for manufacturing semiconductor integrated circuit deviceHITACHI LTD·Filed 2002·Granted Mar 11, 2003·12 cites·30 claims
- 1973US7279425B2Polishing methodHITACHI LTD·Filed 2006·Granted Oct 9, 2007·2 cites·27 claims
- 2072US4596141AElectrically operated oil level gaugeTSUCHIYA SEISAKUSHO·Filed 1984·Granted Jun 24, 1986·23 cites·3 claims
- 2171US6800557B2Process for manufacturing semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2003·Granted Oct 5, 2004·8 cites·5 claims
- 2269US5561300AAtomic switching devices and logical circuitsHITACHI LTD·Filed 1992·Granted Oct 1, 1996·29 cites·36 claims
- 2367US2025200340A1Information processing apparatus, application generation system, and application generation methodKONDO SEIICHI·Filed 2024·Application pending·0 cites
- 2462US10291620B2Information processing apparatus, terminal apparatus, program, and information processing system for collaborative use of authentication information between shared servicesOHZAKI HIROKI·Filed 2016·Granted May 14, 2019·1 cites·10 claims
- 2560US7132367B2Polishing methodHITACHI LTD·Filed 2003·Granted Nov 7, 2006·4 cites·58 claims
- 2660US2025123811A1Information processing apparatus, application generation system, and application generation methodKONDO SEIICHI·Filed 2024·Application pending·0 cites
- 2759US2025291561A1Information processing apparatus, program generation system, and program generation methodKONDO SEIICHI·Filed 2025·Application pending·0 cites
- 2858US10037894B2Polishing liquid for metal and polishing methodHITACHI CHEMICAL CO LTD·Filed 2013·Granted Jul 31, 2018·1 cites·18 claims
- 2956US7563716B2Polishing methodRENESAS TECH CORP·Filed 2007·Granted Jul 21, 2009·0 cites·5 claims
- 3056US6734103B2Method of polishing a semiconductor deviceHITACHI LTD·Filed 2002·Granted May 11, 2004·5 cites·14 claims
- 3156US2025300949A1Information processing apparatus, report creation system, and information processing methodKONDO SEIICHI·Filed 2025·Application pending·0 cites
- 3256US2025245074A1Information processing apparatus, data registration system, and data registration methodKONDO SEIICHI·Filed 2025·Application pending·0 cites
- 3355US2025291560A1Information processing apparatus, application editing system, and information processing methodKONDO SEIICHI·Filed 2025·Application pending·0 cites
- 3454US7183212B2Polishing method, metallization fabrication method, method for manufacturing semiconductor device and semiconductor deviceRENESAS TECH CORP·Filed 2004·Granted Feb 27, 2007·3 cites·18 claims
- 3554US5694059ABuffer of fine connection structure for connecting an atom level circuit and a general semiconductor circuitHITACHI LTD·Filed 1995·Granted Dec 2, 1997·18 cites·12 claims
- 3653US5402715ARolling mill for noodle makingFiled 1994·Granted Apr 4, 1995·22 cites·4 claims
- 3752US2024147004A1Terminal device, information processing method, and non-transitory recording mediumKONDO SEIICHI·Filed 2023·Application pending·0 cites
- 3849US8129275B2Process for manufacturing semiconductor integrated circuit deviceOHASHI NAOFUMI·Filed 2010·Granted Mar 6, 2012·0 cites·15 claims
- 3949US7125794B2Method of manufacturing semiconductor deviceRENESAS TECH CORP·Filed 2004·Granted Oct 24, 2006·3 cites·9 claims
- 4048US5013526ASuperconducting alloys comprising tungsten, molybdenum, silicon and oxygenHITACHI LTD·Filed 1989·Granted May 7, 1991·13 cites·12 claims
- 4147US11206250B2Coordination support system, coordination support method, and non-transitory computer-readable storage mediumRICOH CO LTD·Filed 2019·Granted Dec 21, 2021·0 cites·5 claims
- 4247US2005170760A1Polishing apparatusFiled 2005·Application pending·0 cites
- 4346US6849542B2Method for manufacturing a semiconductor device that includes planarizing with a grindstone that contains fixed abrasivesHITACHI LTD·Filed 2002·Granted Feb 1, 2005·2 cites·17 claims
- 4445US2004152298A1Process for manufacturing semiconductor integrated circuit deviceFiled 2004·Application pending·0 cites
- 4542US2008260156A1Management Service Device, Backup Service Device, Communication Terminal Device, and Storage MediumBABA AKIHIRO·Filed 2004·Application pending·0 cites
- 4642US2004171264A1Methods of polishing, interconnect-fabrication, and producing semiconductor devicesRENESAS TECH CORP·Filed 2004·Application pending·0 cites
- 4740US2002025605A1Semiconductor device and method for manufacturing the sameHITACHI LTD·Filed 2001·Application pending·0 cites
- 4840US2004229468A1Polishing methodFiled 2004·Application pending·0 cites
- 4939US5295529AMethod of forming zinc collar on insulator metal cap and mold thereforNGK INSULATORS LTD·Filed 1991·Granted Mar 22, 1994·7 cites·4 claims
- 5039US2005170641A1Multilayered wiring structure, method of forming buried wiring, semiconductor device, method of manufacturing semiconductor device, semiconductor mounted device, and method of manufacturing semiconductor mounted deviceSEMICONDUCTOR LEADING EDGE TEC·Filed 2004·Application pending·0 cites
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