Inventor · disambiguated record
Karl-Heinz Hohenwarter
Also filed as: HOHENWARTER KARL-HEINZ
10 granted patents·7 pending applications·62 citations·filing 2003–2023
87Inventor score
Technology areasH10P
Top patents by PatentIndex Score
17 records- 0189US8926788B2Closed chamber for wafer wet processingHOHENWARTER KARL-HEINZ·Filed 2010·Granted Jan 6, 2015·14 cites·15 claims
- 0286US10658204B2Spin chuck with concentrated center and radial heatingLAM RES AG·Filed 2017·Granted May 19, 2020·7 cites·18 claims
- 0380US7837803B2Device and method for wet treating disc-shaped articlesLAM RES AG·Filed 2004·Granted Nov 23, 2010·22 cites·2 claims
- 0477US8955529B2Device and method for wet treating disc-shaped articlesHOHENWARTER KARL-HEINZ·Filed 2010·Granted Feb 17, 2015·4 cites·5 claims
- 0564US7122084B2Device for liquid treatment of disk-shaped objectsSEZ AG·Filed 2003·Granted Oct 17, 2006·10 cites·10 claims
- 0661US9536770B2Method and apparatus for liquid treatment of wafer shaped articlesLAM RES AG·Filed 2014·Granted Jan 3, 2017·2 cites·18 claims
- 0759US9355883B2Method and apparatus for liquid treatment of wafer shaped articlesHOHENWARTER KARL-HEINZ·Filed 2011·Granted May 31, 2016·2 cites·17 claims
- 0857US9316443B2Method and apparatus for liquid treatment of wafer shaped articlesHOHENWARTER KARL-HEINZ·Filed 2012·Granted Apr 19, 2016·1 cites·13 claims
- 0954US2025364304A1System for processing wafer-shaped articlesLAM RES AG·Filed 2023·Application pending·0 cites
- 1048US12198945B2Vapor delivery head for preventing stiction of high aspect ratio structures and/or repairing high aspect ratio structuresLAM RES AG·Filed 2019·Granted Jan 14, 2025·0 cites·18 claims
- 1146US2023411177A1Apparatus for processing a wafer-shaped articleLAM RES AG·Filed 2021·Application pending·0 cites
- 1237US10068792B2Method and apparatus for liquid treatment of wafer shaped articlesLAM RES AG·Filed 2016·Granted Sep 4, 2018·0 cites·14 claims
- 1337US2013008602A1Apparatus for treating a wafer-shaped articleLAM RES AG·Filed 2011·Application pending·0 cites
- 1437US2014053982A1Method and apparatus for processing wafer-shaped articlesHOHENWARTER KARL-HEINZ·Filed 2012·Application pending·0 cites
- 1532US2014026926A1Method and apparatus for liquid treatment of wafer-shaped articlesSEMMELROCK CHRISTOPH·Filed 2012·Application pending·0 cites
- 1631US2012286481A1Device and process for liquid treatment of wafer shaped articlesPUGGL MICHAEL·Filed 2011·Application pending·0 cites
- 1729US2016376702A1Dual mode chamber for processing wafer-shaped articlesLAM RES AG·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →