Inventor · disambiguated record
Marcus E. Interrante
Also filed as: INTERRANTE MARCUS E
11 granted patents·52 citations·filing 2012–2019
86Inventor score
Top patents by PatentIndex Score
11 records- 0195US10541156B1Multi integrated circuit chip carrier packageIBM·Filed 2018·Granted Jan 21, 2020·16 cites·20 claims
- 0294US9401315B1Thermal hot spot cooling for semiconductor devicesGLOBALFOUNDRIES INC·Filed 2015·Granted Jul 26, 2016·16 cites·20 claims
- 0386US8444043B1Uniform solder reflow fixtureBERNIER WILLIAM E·Filed 2012·Granted May 21, 2013·11 cites·18 claims
- 0480US9093563B2Electronic module assembly with patterned adhesive arrayIBM·Filed 2013·Granted Jul 28, 2015·4 cites·21 claims
- 0577US9583408B1Reducing directional stress in an orthotropic encapsulation member of an electronic packageIBM·Filed 2015·Granted Feb 28, 2017·3 cites·15 claims
- 0676US10804181B2Heterogeneous thermal interface material for corner and or edge degradation mitigationIBM·Filed 2019·Granted Oct 13, 2020·2 cites·7 claims
- 0759US10978314B2Multi integrated circuit chip carrier packageIBM·Filed 2019·Granted Apr 13, 2021·0 cites·20 claims
- 0856US9293439B2Electronic module assembly with patterned adhesive arrayGLOBALFOUNDRIES INC·Filed 2014·Granted Mar 22, 2016·0 cites·7 claims
- 0946US9224712B23D bond and assembly process for severely bowed interposer dieIBM·Filed 2014·Granted Dec 29, 2015·0 cites·19 claims
- 1045US10832987B2Managing thermal warpage of a laminateIBM·Filed 2018·Granted Nov 10, 2020·0 cites·16 claims
- 1141US11164804B2Integrated circuit (IC) device package lid attach utilizing nano particle metallic pasteIBM·Filed 2019·Granted Nov 2, 2021·0 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →