Inventor · disambiguated record
John A. Iacoponi
Also filed as: IACOPONI JOHN · IACOPONI JOHN A
53 granted patents·3 pending applications·1,362 citations·filing 1995–2015
99Inventor score
Top patents by PatentIndex Score
56 records- 0192US6468889B1Backside contact for integrated circuit and method of forming sameADVANCED MICRO DEVICES INC·Filed 2000·Granted Oct 22, 2002·98 cites·8 claims
- 0292US6103085AElectroplating uniformity by diffuser designADVANCED MICRO DEVICES INC·Filed 1998·Granted Aug 15, 2000·134 cites·18 claims
- 0390US8691696B2Methods for forming an integrated circuit with straightened recess profileCAI XIUYU·Filed 2012·Granted Apr 8, 2014·11 cites·18 claims
- 0490US6239021B1Dual barrier and conductor deposition in a dual damascene process for semiconductorsADVANCED MICRO DEVICES INC·Filed 2000·Granted May 29, 2001·52 cites·10 claims
- 0589US8753975B1Methods of forming conductive copper-based structures using a copper-based nitride seed layer without a barrier layer and the resulting deviceGLOBALFOUNDRIES INC·Filed 2013·Granted Jun 17, 2014·10 cites·21 claims
- 0688US7557035B1Method of forming semiconductor devices by microwave curing of low-k dielectric filmsADVANCED MICRO DEVICES INC·Filed 2004·Granted Jul 7, 2009·44 cites·20 claims
- 0787US6228754B1Method for forming semiconductor seed layers by inert gas sputter etchingADVANCED MICRO DEVICES INC·Filed 1999·Granted May 8, 2001·87 cites·22 claims
- 0887US5918149ADeposition of a conductor in a via hole or trenchADVANCED MICRO DEVICES INC·Filed 1996·Granted Jun 29, 1999·93 cites·18 claims
- 0984US8728908B2Methods of forming a dielectric cap layer on a metal gate structureXIE RUILONG·Filed 2011·Granted May 20, 2014·9 cites·23 claims
- 1084US6555479B1Method for forming openings for conductive interconnectsADVANCED MICRO DEVICES INC·Filed 2001·Granted Apr 29, 2003·31 cites·48 claims
- 1184US5545592ANitrogen treatment for metal-silicide contactADVANCED MICRO DEVICES INC·Filed 1995·Granted Aug 13, 1996·50 cites·9 claims
- 1283US9117877B2Methods of forming a dielectric cap layer on a metal gate structureCAI XIUYU·Filed 2012·Granted Aug 25, 2015·6 cites·12 claims
- 1381US7759205B1Methods for fabricating semiconductor devices minimizing under-oxide regrowthADVANCED MICRO DEVICES INC·Filed 2009·Granted Jul 20, 2010·9 cites·18 claims
- 1477US9087881B2Electroless fill of trench in semiconductor structureGLOBALFOUNDRIES INC·Filed 2013·Granted Jul 21, 2015·4 cites·12 claims
- 1577US8940633B2Methods of forming semiconductor device with self-aligned contact elements and the resulting devicesGLOBALFOUNDARIES INC·Filed 2013·Granted Jan 27, 2015·4 cites·24 claims
- 1677US6232230B1Semiconductor interconnect interface processing by high temperature depositionADVANCED MICRO DEVICES INC·Filed 1999·Granted May 15, 2001·51 cites·14 claims
- 1777US6117770AMethod for implanting semiconductor conductive layersADVANCED MICRO DEVICES INC·Filed 1998·Granted Sep 12, 2000·52 cites·20 claims
- 1876US6489240B1Method for forming copper interconnectsADVANCED MICRO DEVICES INC·Filed 2001·Granted Dec 3, 2002·23 cites·14 claims
- 1976US6159851ABorderless vias with CVD barrier layerADVANCED MICRO DEVICES INC·Filed 1999·Granted Dec 12, 2000·42 cites·12 claims
- 2076US6048790AMetalorganic decomposition deposition of thin conductive films on integrated circuits using reducing ambientADVANCED MICRO DEVICES INC·Filed 1998·Granted Apr 11, 2000·48 cites·10 claims
- 2175US6809032B1Method and apparatus for detecting the endpoint of a chemical-mechanical polishing operation using optical techniquesADVANCED MICRO DEVICES INC·Filed 2002·Granted Oct 26, 2004·18 cites·15 claims
- 2273US8946075B2Methods of forming semiconductor device with self-aligned contact elements and the resulting devicesGLOBALFOUNDRIES INC·Filed 2013·Granted Feb 3, 2015·3 cites·16 claims
- 2373US6340633B1Method for ramped current density plating of semiconductor vias and trenchesADVANCED MICRO DEVICES INC·Filed 1999·Granted Jan 22, 2002·35 cites·11 claims
- 2473US6261946B1Method for forming semiconductor seed layers by high bias depositionADVANCED MICRO DEVICES INC·Filed 1999·Granted Jul 17, 2001·42 cites·19 claims
- 2573US6187670B1Multi-stage method for forming optimized semiconductor seed layersADVANCED MICRO DEVICES INC·Filed 1998·Granted Feb 13, 2001·45 cites·10 claims
- 2669US6413846B1Contact each methodology and integration schemeADVANCED MICRO DEVICES INC·Filed 2000·Granted Jul 2, 2002·15 cites·36 claims
- 2768US6147404ADual barrier and conductor deposition in a dual damascene process for semiconductorsADVANCED MICRO DEVICES INC·Filed 1999·Granted Nov 14, 2000·29 cites·10 claims
- 2867US6362526B1Alloy barrier layers for semiconductorsADVANCED MICRO DEVICES INC·Filed 1998·Granted Mar 26, 2002·33 cites·4 claims
- 2966US8105943B2Enhancing structural integrity and defining critical dimensions of metallization systems of semiconductor devices by using ALD techniquesSTRECK CHRISTOF·Filed 2009·Granted Jan 31, 2012·3 cites·20 claims
- 3066US6690580B1Integrated circuit structure with dielectric islands in metallized regionsAMD INC·Filed 2002·Granted Feb 10, 2004·14 cites·15 claims
- 3166US6448099B1Method and apparatus for detecting voltage contrast in a semiconductor waferADVANCED MICRO DEVICES INC·Filed 2000·Granted Sep 10, 2002·14 cites·17 claims
- 3266US6100181ALow dielectric constant coating of conductive material in a damascene process for semiconductorsADVANCED MICRO DEVICES INC·Filed 1999·Granted Aug 8, 2000·31 cites·29 claims
- 3365US6218078B1Creation of an etch hardmask by spin-on techniqueADVANCED MICRO DEVICES INC·Filed 1997·Granted Apr 17, 2001·29 cites·6 claims
- 3464US10050118B2Semiconductor device configured for avoiding electrical shortingGLOBALFOUNDRIES INC·Filed 2014·Granted Aug 14, 2018·1 cites·7 claims
- 3564US8859419B2Methods of forming copper-based nitride liner/passivation layers for conductive copper structures and the resulting deviceGLOBALFOUNDRIES INC·Filed 2013·Granted Oct 14, 2014·1 cites·15 claims
- 3664US6110345AMethod and system for plating workpiecesADVANCED MICRO DEVICES INC·Filed 1998·Granted Aug 29, 2000·16 cites·21 claims
- 3762US6514858B1Test structure for providing depth of polish feedbackADVANCED MICRO DEVICES INC·Filed 2001·Granted Feb 4, 2003·8 cites·16 claims
- 3860US8592312B2Method for depositing a conductive capping layer on metal linesRYAN E TODD·Filed 2007·Granted Nov 26, 2013·2 cites·20 claims
- 3960US6649533B1Method and apparatus for forming an under bump metallurgy layerADVANCED MICRO DEVICES INC·Filed 1999·Granted Nov 18, 2003·25 cites·19 claims
- 4059US6489683B1Variable grain size in conductors for semiconductor vias and trenchesADVANCED MICRO DEVICES INC·Filed 2001·Granted Dec 3, 2002·5 cites·5 claims
- 4159US5969425ABorderless vias with CVD barrier layerADVANCED MICRO DEVICES INC·Filed 1997·Granted Oct 19, 1999·21 cites·15 claims
- 4257US6344691B1Barrier materials for metal interconnect in a semiconductor deviceADVANCED MICRO DEVICES INC·Filed 2000·Granted Feb 5, 2002·6 cites·6 claims
- 4356US9318436B2Copper based nitride liner passivation layers for conductive copper structuresGLOBALFOUNDRIES INC·Filed 2014·Granted Apr 19, 2016·0 cites·10 claims
- 4455US6166427AIntegration of low-K SiOF as inter-layer dielectric for AL-gapfill applicationADVANCED MICRO DEVICES INC·Filed 1999·Granted Dec 26, 2000·16 cites·10 claims
- 4555US6080669ASemiconductor interconnect interface processing by high pressure depositionADVANCED MICRO DEVICES INC·Filed 1999·Granted Jun 27, 2000·19 cites·18 claims
- 4653US6346472B1Manufacturing method for semiconductor metalization barrierADVANCED MICRO DEVICES INC·Filed 2001·Granted Feb 12, 2002·4 cites·14 claims
- 4753US6146993AMethod for forming in-situ implanted semiconductor barrier layersADVANCED MICRO DEVICES INC·Filed 1998·Granted Nov 14, 2000·18 cites·18 claims
- 4850US5912508AMetal-semiconductor contact formed using nitrogen plasmaADVANCED MICRO DEVICES INC·Filed 1996·Granted Jun 15, 1999·10 cites·8 claims
- 4949US6150268ABarrier materials for metal interconnectADVANCED MICRO DEVICES INC·Filed 1998·Granted Nov 21, 2000·12 cites·11 claims
- 5048US6320263B1Semiconductor metalization barrier and manufacturing method thereforADVANCED MICRO DEVICES INC·Filed 1999·Granted Nov 20, 2001·12 cites·5 claims
Showing the top 50 of 56 patent records by PatentIndex Score.
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