Inventor · disambiguated record
Seong-Deok Hwang
Also filed as: HWANG SEONG-DEOK
29 granted patents·13 pending applications·98 citations·filing 2006–2016
95Inventor score
Top patents by PatentIndex Score
42 records- 0191US9065033B2Light emitting device packageSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Jun 23, 2015·14 cites·20 claims
- 0291US8735276B2Semiconductor packages and methods of manufacturing the sameCHUNG HYUN-SOO·Filed 2012·Granted May 27, 2014·14 cites·20 claims
- 0390US8896078B2Light emitting apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Nov 25, 2014·12 cites·16 claims
- 0486US9070852B2Light emitting device package and manufacturing method thereofLEE SANG HYUN·Filed 2011·Granted Jun 30, 2015·4 cites·6 claims
- 0583US8987022B2Light-emitting device package and method of manufacturing the sameYOO CHEOL-JUN·Filed 2012·Granted Mar 24, 2015·7 cites·23 claims
- 0681US8809888B2Light emitting element with improved light extraction efficiency, light emitting device comprising the same, and fabricating method of the light emitting element and the light emitting deviceSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Aug 19, 2014·4 cites·18 claims
- 0780US7626260B2Stack-type semiconductor device having cooling path on its bottom surfaceSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Dec 1, 2009·9 cites·15 claims
- 0877US8178424B2Method of fabricating light-emitting apparatus with improved light extraction efficiency and light-emitting apparatus fabricated using the methodKIM YU-SIK·Filed 2009·Granted May 15, 2012·5 cites·15 claims
- 0977US7544538B2Method of forming semiconductor chips, the semiconductor chips so formed and chip-stack package having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Jun 9, 2009·6 cites·15 claims
- 1075US8587010B2Light emitting device package and method of manufacturing the sameYOO CHEOL JUN·Filed 2011·Granted Nov 19, 2013·3 cites·7 claims
- 1175US8319238B2Light emitting device with improved light extraction efficiencyLEE SEUNG-JAE·Filed 2010·Granted Nov 27, 2012·4 cites·9 claims
- 1274US9472722B1Light emitting device package and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Oct 18, 2016·1 cites·20 claims
- 1372US8415181B2Light emitting element with improved light extraction efficiency, light emitting device comprising the same, and fabricating method of the light emitting element and the light emitting deviceKIM YU-SIK·Filed 2012·Granted Apr 9, 2013·2 cites·11 claims
- 1469US8847270B2LED package with recess and protrusionsPARK HUN YONG·Filed 2011·Granted Sep 30, 2014·2 cites·10 claims
- 1569US8110922B2Wafer level semiconductor module and method for manufacturing the sameCHUNG HYUN-SOO·Filed 2009·Granted Feb 7, 2012·3 cites·15 claims
- 1669US7847416B2Wafer level package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Dec 7, 2010·3 cites·9 claims
- 1766US2007184577A1Method of fabricating wafer level packageSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 1864US8039937B2Method of forming semiconductor chips, the semiconductor chips so formed and chip-stack package having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Oct 18, 2011·2 cites·8 claims
- 1963US9691957B2Light emitting device packageSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Jun 27, 2017·1 cites·20 claims
- 2062US9577147B2Light emitting device package and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Feb 21, 2017·0 cites·7 claims
- 2161US8110843B2Light emitting element with improved light extraction efficiency, light emitting device comprising the same, and fabricating method of the light emitting element and the light emitting deviceKIM YU-SIK·Filed 2009·Granted Feb 7, 2012·1 cites·20 claims
- 2255US9269877B2Method of fabricating light-emitting apparatus with improved light extraction efficiency and light-emitting apparatus fabricated using the methodSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Feb 23, 2016·0 cites·21 claims
- 2355US7969024B2Semiconductor package with joint reliability, entangled wires including insulating materialSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Jun 28, 2011·1 cites·19 claims
- 2454US8722435B2Light emitting device package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted May 13, 2014·0 cites·7 claims
- 2553US8637881B2Method of fabricating light-emitting apparatus with improved light extraction efficiency and light-emitting apparatus fabricated using the methodKIM YU-SIK·Filed 2012·Granted Jan 28, 2014·0 cites·5 claims
- 2651US2009109642A1Semiconductor modules and electronic devices using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 2751US2009184411A1Semiconductor packages and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2009·Application pending·0 cites
- 2849US2007269931A1Wafer level package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 2948US7851256B2Method of manufacturing chip-on-chip semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Dec 14, 2010·0 cites·21 claims
- 3048US2007246826A1Wafer level semiconductor module and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 3147US9165817B2Method of grinding substrate and method of manufacturing semiconductor light emitting device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Oct 20, 2015·0 cites·20 claims
- 3247US8111520B2Semiconductor moduleCHUNG HYUN-SOO·Filed 2008·Granted Feb 7, 2012·0 cites·4 claims
- 3344US8679872B2Light emitting device package and manufacturing method thereofYOO CHEOL JUN·Filed 2011·Granted Mar 25, 2014·0 cites·25 claims
- 3443US2015102373A1Light emitting diode package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Application pending·0 cites
- 3541US2014232293A1Light-emitting device packageSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
- 3641US2013236997A1Method of fabricating light emitting deviceSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
- 3740US2012205696A1Light emitting device package and method of manufacturing thereofYOO CHEOL JUN·Filed 2012·Application pending·0 cites
- 3839US8828756B2Wafer level light-emitting device package and method of manufacturing the sameHWANG SEONG-DEOK·Filed 2011·Granted Sep 9, 2014·0 cites·16 claims
- 3939US2012140210A1Tray, testing apparatus and testing method using the sameYOO CHEOL JUN·Filed 2011·Application pending·0 cites
- 4038US2012235142A1Semiconductor light emitting diode chip, method of manufacturing thereof and method for quality control thereofSONG YOUNG HEE·Filed 2012·Application pending·0 cites
- 4136US2012267663A1Light emitting diode package and manufacturing method thereofPARK HUN YONG·Filed 2012·Application pending·0 cites
- 4232US2012074438A1Method for manufacturing light emitting device, light emitting device, light emitting element substrate, and quality management methodHWANG SEONG DEOK·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →