Inventor · disambiguated record
Erwin Victor Cruz
Also filed as: CRUZ ERWIN V R · CRUZ ERWIN VICTOR · CRUZ ERWIN VICTOR R
18 granted patents·2 pending applications·727 citations·filing 2003–2019
95Inventor score
Technology areasH10W
Files withFAIRCHILD SEMICONDUCTOR14JEREZA ARMAND VINCENT C2CRUZ ERWIN VICTOR1CRUZ ERWIN VICTOR R1QUINONES MARIA CLEMENS1
Top patents by PatentIndex Score
20 records- 0198US6731003B2Wafer-level coated copper stud bumpsFAIRCHILD SEMICONDUCTOR·Filed 2003·Granted May 4, 2004·279 cites·17 claims
- 0297US7285849B2Semiconductor die package using leadframe and clip and method of manufacturingFAIRCHILD SEMICONDUCTOR·Filed 2005·Granted Oct 23, 2007·114 cites·20 claims
- 0396US7271497B2Dual metal stud bumping for flip chip applicationsFAIRCHILD SEMICONDUCTOR·Filed 2003·Granted Sep 18, 2007·110 cites·13 claims
- 0496US6943434B2Method for maintaining solder thickness in flipchip attach packaging processesFAIRCHILD SEMICONDUCTOR·Filed 2003·Granted Sep 13, 2005·133 cites·24 claims
- 0595US7838340B2Pre-molded clip structureFAIRCHILD SEMICONDUCTOR·Filed 2010·Granted Nov 23, 2010·17 cites·10 claims
- 0690US7768105B2Pre-molded clip structureFAIRCHILD SEMICONDUCTOR·Filed 2007·Granted Aug 3, 2010·15 cites·16 claims
- 0784US8222718B2Semiconductor die package and method for making the sameJEREZA ARMAND VINCENT C·Filed 2009·Granted Jul 17, 2012·12 cites·17 claims
- 0882US7972906B2Semiconductor die package including exposed connectionsFAIRCHILD SEMICONDUCTOR·Filed 2008·Granted Jul 5, 2011·10 cites·12 claims
- 0980US7501337B2Dual metal stud bumping for flip chip applicationsFAIRCHILD SEMICONDUCTOR·Filed 2006·Granted Mar 10, 2009·7 cites·7 claims
- 1078US8058107B2Semiconductor die package using leadframe and clip and method of manufacturingCRUZ ERWIN VICTOR R·Filed 2007·Granted Nov 15, 2011·10 cites·22 claims
- 1178US8008759B2Pre-molded clip structureFAIRCHILD SEMICONDUCTOR·Filed 2010·Granted Aug 30, 2011·3 cites·17 claims
- 1273US9978668B1Packaged semiconductor devices with laser grooved wettable flank and methods of manufactureFAIRCHILD SEMICONDUCTOR·Filed 2017·Granted May 22, 2018·2 cites·20 claims
- 1372US8497164B2Semiconductor die package and method for making the sameJEREZA ARMAND VINCENT C·Filed 2012·Granted Jul 30, 2013·3 cites·17 claims
- 1472US7402462B2Folded frame carrier for MOSFET BGAFAIRCHILD SEMICONDUCTOR·Filed 2005·Granted Jul 22, 2008·8 cites·26 claims
- 1569US8513059B2Pre-molded clip structureCRUZ ERWIN VICTOR·Filed 2011·Granted Aug 20, 2013·2 cites·10 claims
- 1666US7932171B2Dual metal stud bumping for flip chip applicationsFAIRCHILD SEMICONDUCTOR·Filed 2009·Granted Apr 26, 2011·2 cites·19 claims
- 1757US10818582B2Packaged semiconductor devices with laser grooved wettable flank and methods of manufactureFAIRCHILD SEMICONDUCTOR·Filed 2019·Granted Oct 27, 2020·0 cites·20 claims
- 1852US10483192B2Packaged semiconductor devices with laser grooved wettable flank and methods of manufactureFAIRCHILD SEMICONDUCTOR·Filed 2018·Granted Nov 19, 2019·0 cites·19 claims
- 1945US2005224940A1Method for maintaining solder thickness in flipchip attach packaging processesTANGPUZ CONSUELO N·Filed 2005·Application pending·0 cites
- 2042US2009057855A1Semiconductor die package including stand off structuresQUINONES MARIA CLEMENS·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →