Inventor · disambiguated record
Consuelo Tangpuz
Also filed as: TANGPUZ CONSUELO · TANGPUZ CONSUELO N
17 granted patents·2 pending applications·1,129 citations·filing 1998–2009
96Inventor score
Technology areasH10W
Top patents by PatentIndex Score
19 records- 0198US7215011B2Flip chip in leaded molded package and method of manufacture thereofFAIRCHILD SEMICONDUCTOR·Filed 2005·Granted May 8, 2007·65 cites·20 claims
- 0298US6731003B2Wafer-level coated copper stud bumpsFAIRCHILD SEMICONDUCTOR·Filed 2003·Granted May 4, 2004·279 cites·17 claims
- 0396US7271497B2Dual metal stud bumping for flip chip applicationsFAIRCHILD SEMICONDUCTOR·Filed 2003·Granted Sep 18, 2007·110 cites·13 claims
- 0496US6943434B2Method for maintaining solder thickness in flipchip attach packaging processesFAIRCHILD SEMICONDUCTOR·Filed 2003·Granted Sep 13, 2005·133 cites·24 claims
- 0595US6720642B1Flip chip in leaded molded package and method of manufacture thereofFAIRCHILD SEMICONDUCTOR·Filed 1999·Granted Apr 13, 2004·137 cites·7 claims
- 0694US7154168B2Flip chip in leaded molded package and method of manufacture thereofFAIRCHILD SEMICONDUCTOR·Filed 2003·Granted Dec 26, 2006·64 cites·12 claims
- 0794US6989588B2Semiconductor device including molded wireless exposed drain packagingFAIRCHILD SEMICONDUCTOR·Filed 2001·Granted Jan 24, 2006·102 cites·13 claims
- 0890US6391687B1Column ball grid array packageFAIRCHILD SEMICONDUCTOR·Filed 2000·Granted May 21, 2002·68 cites·12 claims
- 0987US7439613B2Substrate based unmolded packageFAIRCHILD SEMICONDCUTOR CORP·Filed 2004·Granted Oct 21, 2008·36 cites·15 claims
- 1084US6949410B2Flip chip in leaded molded package and method of manufacture thereofFAIRCHILD SEMICONDUCTOR·Filed 2003·Granted Sep 27, 2005·24 cites·20 claims
- 1182US6423623B1Low Resistance package for semiconductor devicesFAIRCHILD SEMICONDUCTOR·Filed 1998·Granted Jul 23, 2002·78 cites·4 claims
- 1280US7501337B2Dual metal stud bumping for flip chip applicationsFAIRCHILD SEMICONDUCTOR·Filed 2006·Granted Mar 10, 2009·7 cites·7 claims
- 1374US7501702B2Integrated transistor module and method of fabricating sameFAIRCHILD SEMICONDUCTOR·Filed 2004·Granted Mar 10, 2009·17 cites·18 claims
- 1473US7682877B2Substrate based unmolded packageFAIRCHILD SEMICONDUCTOR·Filed 2008·Granted Mar 23, 2010·3 cites·14 claims
- 1572US7582956B2Flip chip in leaded molded package and method of manufacture thereofFAIRCHILD SEMICONDUCTOR·Filed 2007·Granted Sep 1, 2009·3 cites·9 claims
- 1666US7932171B2Dual metal stud bumping for flip chip applicationsFAIRCHILD SEMICONDUCTOR·Filed 2009·Granted Apr 26, 2011·2 cites·19 claims
- 1760US7842555B2Integrated transistor module and method of fabricating sameFAIRCHILD SEMICONDUCTOR·Filed 2009·Granted Nov 30, 2010·1 cites·7 claims
- 1846US2011095417A1Leadless semiconductor device terminalFAIRCHILD SEMICONDUCTOR·Filed 2009·Application pending·0 cites
- 1945US2005224940A1Method for maintaining solder thickness in flipchip attach packaging processesTANGPUZ CONSUELO N·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →