Inventor · disambiguated record
William J. Decesare
Also filed as: DECESARE WILLIAM · DECESARE WILLIAM J
5 granted patents·2 pending applications·90 citations·filing 1991–2022
78Inventor score
Top patents by PatentIndex Score
7 records- 0169US5289630AProcess for fabricating multilayer printed circuitsMACDERMID INC·Filed 1991·Granted Mar 1, 1994·35 cites·4 claims
- 0268US5261154AProcess for fabricating multilayer printed circuitsMACDERMID INC·Filed 1992·Granted Nov 16, 1993·34 cites·10 claims
- 0355US5328561AMicroetchant for copper surfaces and processes for using sameMACDERMID INC·Filed 1992·Granted Jul 12, 1994·21 cites·11 claims
- 0452US12325927B2Complex waveform for electrolytic platingMACDERMID ENTHONE INC·Filed 2022·Granted Jun 10, 2025·0 cites·24 claims
- 0547US2009238979A1Method of Applying Catalytic Solution for Use in Electroless DepositionDECESARE WILLIAM·Filed 2008·Application pending·0 cites
- 0640US2024224432A1Single Step Electrolytic Method of Filling Through-Holes in Printed Circuit Boards and Other SubstratesMACDERMID ENTHONE INC·Filed 2022·Application pending·0 cites
- 0737US11746433B2Single step electrolytic method of filling through holes in printed circuit boards and other substratesMACDERMID ENTHONE INC·Filed 2019·Granted Sep 5, 2023·0 cites·23 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →