Inventor · disambiguated record
David M. Leet
Also filed as: LEET DAVID M · LEET DAVID MICHAEL
4 granted patents·280 citations·filing 1997–2002
83Inventor score
Top patents by PatentIndex Score
4 records- 0197US6365502B1Microelectronic interconnect material with adhesion promotion layer and fabrication methodCVC PRODUCTS INC·Filed 2000·Granted Apr 2, 2002·153 cites·17 claims
- 0291US6645847B2Microelectronic interconnect material with adhesion promotion layer and fabrication methodCVC PRODUCTS INC·Filed 2002·Granted Nov 11, 2003·47 cites·22 claims
- 0391US6627995B2Microelectronic interconnect material with adhesion promotion layer and fabrication methodCVC PRODUCTS INC·Filed 2002·Granted Sep 30, 2003·59 cites·25 claims
- 0467US6565717B1Apparatus for sputtering ionized material in a medium to high density plasmaAPPLIED MATERIALS INC·Filed 1997·Granted May 20, 2003·21 cites·64 claims
Join the waitlist — get patent alerts
Get an alert when David M. Leet files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →