Inventor · disambiguated record
Lan H. Hoang
Also filed as: HOANG LAN · HOANG LAN H · HOANG LAN HOANG
35 granted patents·6 pending applications·686 citations·filing 1997–2022
97Inventor score
Top patents by PatentIndex Score
41 records- 0198US7378733B1Composite flip-chip package with encased components and method of fabricating sameXILINX INC·Filed 2006·Granted May 27, 2008·112 cites·11 claims
- 0296US11462461B2System in package for lower z height and reworkable component assemblyAPPLE INC·Filed 2020·Granted Oct 4, 2022·4 cites·15 claims
- 0396US7696006B1Composite flip-chip package with encased components and method of fabricating sameXILINX INC·Filed 2008·Granted Apr 13, 2010·44 cites·7 claims
- 0495US10602612B1Vertical module and perpendicular pin array interconnect for stacked circuit board structureAPPLE INC·Filed 2019·Granted Mar 24, 2020·17 cites·16 claims
- 0595US10485103B1Electrical components attached to fabricAPPLE INC·Filed 2017·Granted Nov 19, 2019·16 cites·21 claims
- 0694US7098542B1Multi-chip configuration to connect flip-chips to flip-chipsXILINX INC·Filed 2003·Granted Aug 29, 2006·95 cites·30 claims
- 0792US10356903B1System-in-package including opposing circuit boardsAPPLE INC·Filed 2018·Granted Jul 16, 2019·9 cites·20 claims
- 0890US7906857B1Molded integrated circuit package and method of forming a molded integrated circuit packageXILINX INC·Filed 2008·Granted Mar 15, 2011·30 cites·18 claims
- 0990US7061102B2High performance flipchip package that incorporates heat removal with minimal thermal mismatchXILINX INC·Filed 2001·Granted Jun 13, 2006·76 cites·10 claims
- 1087US9287204B2Semiconductor device and method of bonding semiconductor die to substrate in reconstituted wafer formSTATS CHIPPAC LTD·Filed 2013·Granted Mar 15, 2016·8 cites·25 claims
- 1184US11388817B2Electrical components attached to fabricAPPLE INC·Filed 2021·Granted Jul 12, 2022·1 cites·20 claims
- 1284US9245770B2Semiconductor device and method of simultaneous molding and thermalcompression bondingSTATS CHIPPAC LTD·Filed 2013·Granted Jan 26, 2016·7 cites·24 claims
- 1383US10709018B2System-in-package including opposing circuit boardsAPPLE INC·Filed 2019·Granted Jul 7, 2020·3 cites·21 claims
- 1483US10624214B2Low-profile space-efficient shielding for SIP moduleAPPLE INC·Filed 2016·Granted Apr 14, 2020·3 cites·20 claims
- 1582US6373142B1Method of adding filler into a non-filled underfill system by using a highly filled filletLSI LOGIC CORP·Filed 1999·Granted Apr 16, 2002·66 cites·32 claims
- 1682US5942795ALeaded substrate carrier for integrated circuit device and leaded substrate carrier device assemblyNAT SEMICONDUCTOR CORP·Filed 1997·Granted Aug 24, 1999·68 cites·13 claims
- 1781US6201301B1Low cost thermally enhanced flip chip BGALSI LOGIC CORP·Filed 1998·Granted Mar 13, 2001·62 cites·17 claims
- 1876US12041728B2Selective soldering with photonic soldering technologyAPPLE INC·Filed 2021·Granted Jul 16, 2024·1 cites·20 claims
- 1976US9240331B2Semiconductor device and method of making bumpless flipchip interconnect structuresSTATS CHIPPAC LTD·Filed 2013·Granted Jan 19, 2016·4 cites·22 claims
- 2075US9721921B2Semiconductor device and method of bonding semiconductor die to substrate in reconstituted wafer formSTATS CHIPPAC LTD·Filed 2016·Granted Aug 1, 2017·2 cites·23 claims
- 2175US2022346228A1Electrical Components Attached to FabricAPPLE INC·Filed 2022·Application pending·0 cites
- 2271US10959331B2Electrical components attached to fabricAPPLE INC·Filed 2020·Granted Mar 23, 2021·0 cites·20 claims
- 2370US10638608B2Interconnect frames for SIP modulesAPPLE INC·Filed 2018·Granted Apr 28, 2020·1 cites·18 claims
- 2470US10292258B2Vertical shielding and interconnect for SIP modulesAPPLE INC·Filed 2017·Granted May 14, 2019·1 cites·20 claims
- 2567US10966321B2System-in-package including opposing circuit boardsAPPLE INC·Filed 2020·Granted Mar 30, 2021·0 cites·20 claims
- 2667US8442706B2Module for integrated approach to an offshore facilityDOEPPNER RONALD S·Filed 2008·Granted May 14, 2013·12 cites·44 claims
- 2764US10701802B2Electrical components attached to fabricAPPLE INC·Filed 2019·Granted Jun 30, 2020·0 cites·20 claims
- 2864US6744131B1Flip chip integrated circuit packages accommodating exposed chip capacitors while providing structural rigidityXILINX INC·Filed 2003·Granted Jun 1, 2004·12 cites·42 claims
- 2963US7361995B2Molded high density electronic packaging structure for high performance applicationsXILINX INC·Filed 2004·Granted Apr 22, 2008·13 cites·24 claims
- 3062US11765838B2Right angle sidewall and button interconnects for molded SiPsAPPLE INC·Filed 2021·Granted Sep 19, 2023·0 cites·16 claims
- 3160US12148741B2Sidewall connections and button interconnects for molded SiPsAPPLE INC·Filed 2022·Granted Nov 19, 2024·0 cites·16 claims
- 3260US12095185B2Built-in connector for board-to-board and flex-to-rigid board connectionAPPLE INC·Filed 2021·Granted Sep 17, 2024·0 cites·20 claims
- 3358US12153268B2Technologies for increased volumetric and functional efficiencies of optical packagesAPPLE INC·Filed 2022·Granted Nov 26, 2024·0 cites·8 claims
- 3458US12040262B2Flex board and flexible moduleAPPLE INC·Filed 2021·Granted Jul 16, 2024·0 cites·16 claims
- 3554US6475828B1Method of using both a non-filled flux underfill and a filled flux underfill to manufacture a flip-chipLSI LOGIC CORP·Filed 1999·Granted Nov 5, 2002·19 cites·5 claims
- 3652US2023099638A1System and method for temperature sensing using thermopile integrated with rigid printed circuit boardAPPLE INC·Filed 2022·Application pending·0 cites
- 3749US2023078536A1Conductive features on system-in-package surfacesAPPLE INC·Filed 2022·Application pending·0 cites
- 3847US10334732B2Area-efficient connections to SIP modulesAPPLE INC·Filed 2017·Granted Jun 25, 2019·0 cites·20 claims
- 3940US2019082534A1Interconnect frames for sip modulesAPPLE INC·Filed 2017·Application pending·0 cites
- 4038US2021043597A1Selective Soldering with Photonic Soldering TechnologyAPPLE INC·Filed 2020·Application pending·0 cites
- 4134US2016286647A1Vertical shielding and interconnect for sip modulesAPPLE INC·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →