Inventor · disambiguated record
Kazushige Toriyama
Also filed as: TORIYAMA KAZUSHIGE
24 granted patents·1 pending application·76 citations·filing 2007–2017
94Inventor score
Top patents by PatentIndex Score
25 records- 0193US7931187B2Injection molded solder method for forming solder bumps on substratesIBM·Filed 2008·Granted Apr 26, 2011·16 cites·16 claims
- 0291US9354408B2Via for electrical contact passing through layers of optical waveguide in multilayer structure including electrical substrate and laminated layers of optical waveguideIBM·Filed 2013·Granted May 31, 2016·12 cites·5 claims
- 0389US9219041B2Electronic package for millimeter wave semiconductor diesELAD DANNY·Filed 2012·Granted Dec 22, 2015·13 cites·15 claims
- 0481US8971678B2Spacer resin pattern helping to reduce optical coupling loss in optical waveguide for light-emitting element or light-receiving element on semiconductorIBM·Filed 2013·Granted Mar 3, 2015·5 cites·18 claims
- 0581US7674651B2Mounting method for semiconductor parts on circuit substrateIBM·Filed 2007·Granted Mar 9, 2010·13 cites·1 claims
- 0680US9508594B2Fabricating pillar solder bumpIBM·Filed 2015·Granted Nov 29, 2016·2 cites·18 claims
- 0780US8381962B2Injection molded solder method for forming solder bumps on substratesIBM·Filed 2011·Granted Feb 26, 2013·3 cites·5 claims
- 0878US9772462B2Via for electrical contact passing through layers of optical waveguide in multilayer structure including electrical substrate and laminated layers of optical waveguideIBM·Filed 2016·Granted Sep 26, 2017·2 cites·10 claims
- 0975US9586281B2Forming a solder joint between metal layersIBM·Filed 2015·Granted Mar 7, 2017·2 cites·12 claims
- 1074US9698119B2Interfacial alloy layer for improving electromigration (EM) resistance in solder jointsIBM·Filed 2016·Granted Jul 4, 2017·2 cites·8 claims
- 1174US9299606B2Fabricating pillar solder bumpIBM·Filed 2014·Granted Mar 29, 2016·2 cites·14 claims
- 1271US9893031B2Chip mounting structureIBM·Filed 2016·Granted Feb 13, 2018·1 cites·4 claims
- 1369US9391034B2Interfacial alloy layer for improving electromigration (EM) resistance in solder jointsIBM·Filed 2013·Granted Jul 12, 2016·2 cites·6 claims
- 1467US10424510B2Solder fill into high aspect through holesIBM·Filed 2017·Granted Sep 24, 2019·0 cites·20 claims
- 1564US9466533B2Semiconductor structure including a through electrode, and method for forming the sameIBM·Filed 2015·Granted Oct 11, 2016·1 cites·5 claims
- 1663US10388566B2Solder fill into high aspect through holesIBM·Filed 2016·Granted Aug 20, 2019·0 cites·13 claims
- 1758US10141278B2Chip mounting structureIBM·Filed 2017·Granted Nov 27, 2018·0 cites·7 claims
- 1852US10252363B2Forming a solder joint between metal layersIBM·Filed 2017·Granted Apr 9, 2019·0 cites·12 claims
- 1951US10090586B2Wireless communication device with joined semiconductorsIBM·Filed 2017·Granted Oct 2, 2018·0 cites·18 claims
- 2048US9780442B2Wireless communication device with joined semiconductorsIBM·Filed 2015·Granted Oct 3, 2017·0 cites·8 claims
- 2148US9373545B2Semiconductor structure including a through electrode, and method for forming the sameIBM·Filed 2015·Granted Jun 21, 2016·0 cites·6 claims
- 2247US9099315B2Mounting structure and mounting structure manufacturing methodIBM·Filed 2014·Granted Aug 4, 2015·0 cites·8 claims
- 2343US9941230B2Electrical connecting structure between a substrate and a semiconductor chipIBM·Filed 2015·Granted Apr 10, 2018·0 cites·15 claims
- 2441US2013119536A1Method for forming studs used for self-alignment of solder bumpsIBM·Filed 2012·Application pending·0 cites
- 2538US9520375B2Method of forming a solder bump on a substrateIBM·Filed 2015·Granted Dec 13, 2016·0 cites·18 claims
Join the waitlist — get patent alerts
Get an alert when Kazushige Toriyama files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →