Inventor · disambiguated record
Hoe-Ku Jung
Also filed as: JUNG HOE-KU
13 granted patents·9 pending applications·51 citations·filing 2006–2012
89Inventor score
Top patents by PatentIndex Score
22 records- 0182US7992291B2Method of manufacturing a circuit boardSAMSUNG ELECTRO MECH·Filed 2007·Granted Aug 9, 2011·9 cites·8 claims
- 0281US7858437B2Method for manufacturing a substrate with cavitySAMSUNG ELECTRO MECH·Filed 2007·Granted Dec 28, 2010·10 cites·2 claims
- 0379US7550316B2Board on chip package and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2007·Granted Jun 23, 2009·5 cites·6 claims
- 0478US7498205B2Method for manufacturing substrate with cavitySAMSUNG ELECTRO MECH·Filed 2006·Granted Mar 3, 2009·8 cites·6 claims
- 0572US7494844B2Method for manufacturing substrate with cavitySAMSUNG ELECTRO MECH·Filed 2006·Granted Feb 24, 2009·5 cites·7 claims
- 0671US7937833B2Method of manufacturing circuit boardSAMSUNG ELECTRO MECH·Filed 2007·Granted May 10, 2011·4 cites·8 claims
- 0771US7562446B2Method for manufacturing substrate with cavitySAMSUNG ELECTRO MECH·Filed 2006·Granted Jul 21, 2009·5 cites·12 claims
- 0868US7516545B2Method of manufacturing printed circuit board having landless via holeSAMSUNG ELECTRO MECH·Filed 2006·Granted Apr 14, 2009·3 cites·12 claims
- 0961US8418355B2Method for manufacturing circuit boardKIM SANG-DUCK·Filed 2007·Granted Apr 16, 2013·2 cites·7 claims
- 1057US8003439B2Board on chip package and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2009·Granted Aug 23, 2011·0 cites·5 claims
- 1156US2009242238A1Buried pattern substrateSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 1254US7802358B2Rigid-flexible printed circuit board manufacturing method for package on packageSAMSUNG ELECTRO MECH·Filed 2009·Granted Sep 28, 2010·0 cites·11 claims
- 1352US2008009128A1Buried pattern substrate and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2007·Application pending·0 cites
- 1450US8633392B2Circuit board with high-density circuit patternsOKABE SHUHICHI·Filed 2012·Granted Jan 21, 2014·0 cites·2 claims
- 1549US8124880B2Circuit board and method for manufacturing thereofOKABE SHUHICHI·Filed 2007·Granted Feb 28, 2012·0 cites·8 claims
- 1649US2008006942A1Bottom substrate of package on package and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2007·Application pending·0 cites
- 1748US2011221074A1Board on chip packageSAMSUNG ELECTRO MECH·Filed 2011·Application pending·0 cites
- 1847US2007059918A1Rigid-flexible printed circuit board for package on package and manufacturing methodSAMSUNG ELECTRO MECH·Filed 2006·Application pending·0 cites
- 1947US2011259627A1Circuit board with buried circuit patternSAMSUNG ELECTRO MECH·Filed 2011·Application pending·0 cites
- 2045US2010255634A1Manufacturing method of bottom substrate of packageSAMSUNG ELECTRO MECH·Filed 2010·Application pending·0 cites
- 2143US2008102410A1Method of manufacturing printed circuit boardSAMSUNG ELECTRO MECH·Filed 2007·Application pending·0 cites
- 2243US2007281390A1Manufacturing method of a package substrateSAMSUNG ELECTRO MECH·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →