US2011221074A1PendingUtilityA1
Board on chip package
Est. expiryMar 10, 2026(expired)· nominal 20-yr term from priority
H10W 70/682H10W 72/865H10W 90/754H10W 72/07236H10W 90/724H10W 90/734F21S 9/03H05B 39/04H10P 72/7424H10P 72/74H10W 74/019H10W 70/68H10W 74/117F21S 8/033
48
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Claims
Abstract
A board on chip package including a photo solder resist having a cavity and a pattern on one side, the pattern corresponding to a circuit wire; a solder ball pad accommodated in the cavity; a circuit wire electrically connected with the solder ball pad, and formed on the other side of the photo solder resist; a semiconductor chip mounted on the solder ball pad by a flip chip bonding; and a passivation material to mold the semiconductor chip.
Claims
exact text as granted — not AI-modified1 . A board on chip package comprising:
a photo solder resist having a cavity and a pattern on one side, the pattern corresponding to a circuit wire; a solder ball pad accommodated in the cavity; a circuit wire electrically connected with the solder ball pad, and formed on the other side of the photo solder resist; a semiconductor chip mounted on the solder ball pad by a flip chip bonding; and a passivation material to mold the semiconductor chip.
2 . A board on chip package comprising:
a photo solder resist having an area and a pattern, a semiconductor chip being mounted on the area, the pattern being formed in accordance with a circuit wire; a circuit wire formed in one side of the photo solder resist, and having a pattern; a solder ball pad formed on one side of the photo solder resist, and electrically connected with the circuit wire; a semiconductor chip mounted on the solder ball pad by a flip chip bonding; and a passivation material molding the semiconductor chip.Join the waitlist — get patent alerts
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