Inventor · disambiguated record
Dong-Kuk Kim
Also filed as: KIM DONG KUK
25 granted patents·6 pending applications·442 citations·filing 1994–2023
97Inventor score
Files withSAMSUNG ELECTRONICS CO LTD13DAEWOO ELECTRONICS CO LTD9SAMSUNG ELECTRO MECH6CHA JONG DAE1DAEWOOD ELECTRONICS CO LTD1
Top patents by PatentIndex Score
31 records- 0191US7346982B2Method of fabricating printed circuit board having thin core layerSAMSUNG ELECTRO MECH·Filed 2005·Granted Mar 25, 2008·26 cites·3 claims
- 0289US7298032B2Semiconductor multi-chip package and fabrication methodSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Nov 20, 2007·58 cites·3 claims
- 0387US6742561B2Apparatus for die bondingSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Jun 1, 2004·48 cites·8 claims
- 0486US7453045B2Rigid-flexible PCB having coverlay made of liquid crystalline polymer and fabrication method thereofSAMSUNG ELECTRO MECH·Filed 2006·Granted Nov 18, 2008·12 cites·6 claims
- 0584US7294531B2Wafer level chip stack methodSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Nov 13, 2007·44 cites·18 claims
- 0679US7347950B2Rigid flexible printed circuit board and method of fabricating sameSAMSUNG ELECTRO MECH·Filed 2005·Granted Mar 25, 2008·14 cites·13 claims
- 0779US5758396AMethod of manufacturing a piezoelectric actuator arrayDAEWOO ELECTRONICS CO LTD·Filed 1994·Granted Jun 2, 1998·35 cites·7 claims
- 0878US7051428B2In line system used in a semiconductor package assemblingSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted May 30, 2006·18 cites·8 claims
- 0976US7082679B2Rigid-flexible PCB having coverlay made of liquid crystalline polymer and fabrication method thereofSAMSUNG ELECTRO MECH·Filed 2004·Granted Aug 1, 2006·17 cites·14 claims
- 1075US5636070AThin film actuated mirror arrayDAEWOO ELECTRONICS CO LTD·Filed 1995·Granted Jun 3, 1997·47 cites·8 claims
- 1172US7374966B2Apparatus for stacking semiconductor chips, method for manufacturing semiconductor package using the same and semiconductor package manufactured therebySAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted May 20, 2008·5 cites·2 claims
- 1268US5760947AThin film actuated mirror array for use in an optical projection system and method for the manufacture thereofDAEWOO ELECTRONICS CO LTD·Filed 1994·Granted Jun 2, 1998·31 cites·35 claims
- 1358US7679928B2System-in-package module and mobile terminal having the sameSAMSUNG ELECTRO MECH·Filed 2008·Granted Mar 16, 2010·2 cites·2 claims
- 1456US6662799B2Vertical wafer sawing apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Dec 16, 2003·7 cites·13 claims
- 1555US5661611AThin film actuated mirror array and method for the manufacture thereofDAEWOOD ELECTRONICS CO LTD·Filed 1994·Granted Aug 26, 1997·16 cites·18 claims
- 1655US2024225147A9Batting padKIM DONG KUK·Filed 2023·Application pending·0 cites
- 1752US7135353B2Apparatus for stacking semiconductor chips, method for manufacturing semiconductor package using the same and semiconductor package manufactured therebySAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Nov 14, 2006·5 cites·8 claims
- 1852US7096914B2Apparatus for bonding a chip using an insulating adhesive tapeSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Aug 29, 2006·6 cites·19 claims
- 1949US6923077B2Apparatus and method for wafer backside inspectionSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Aug 2, 2005·4 cites·25 claims
- 2049US5936757AThin film actuated mirror arrayDAEWOO ELECTRONICS CO LTD·Filed 1997·Granted Aug 10, 1999·13 cites·32 claims
- 2149US2006177954A1Dicing tape attaching unit that can attach pre-cut dicing tape and general dicing tape to wafer and in-line system having the dicing tape attaching unitSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 2248US6620028B2Apparatus for cutting a waferSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Sep 16, 2003·2 cites·5 claims
- 2347US2008191364A1Apparatus for stacking semiconductor chips, method for manufacturing semiconductor package using the same and semiconductor package manufactured therebySAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 2447US2009316373A1PCB having chips embedded therein and method of manfacturing the sameSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 2545US5505807AActuated mirror array and method for the fabricating thereofDAEWOO ELECTRONICS CO LTD·Filed 1994·Granted Apr 9, 1996·11 cites·7 claims
- 2644US2008026506A1Semiconductor multi-chip package and fabrication methodSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 2744US2015138910A1Dental vacuum mixerCHA JONG-DAE·Filed 2013·Application pending·0 cites
- 2841US5900998AThin film actuated mirror array and method for the manufacture thereofDAEWOO ELECTRONICS CO LTD·Filed 1997·Granted May 4, 1999·7 cites·31 claims
- 2941US5608569AMethod for manufacturing an array of thin film actuated mirrorsDAEWOO ELECTRONICS CO LTD·Filed 1995·Granted Mar 4, 1997·8 cites·10 claims
- 3033US5841569AMethod of manufacturing an array of thin film actuated mirrorsDAEWOO ELECTRONICS CO LTD·Filed 1996·Granted Nov 24, 1998·3 cites·8 claims
- 3127US5606451AElectrodisplacive actuator array and method for the manufacture thereofDAEWOO ELECTRONICS CO LTD·Filed 1994·Granted Feb 25, 1997·3 cites·7 claims
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