Apparatus for stacking semiconductor chips, method for manufacturing semiconductor package using the same and semiconductor package manufactured thereby

Abstract

The present invention relates to an apparatus for stacking semiconductor chips, a method for manufacturing a semiconductor package using the same and a semiconductor package manufactured thereby. The apparatus for stacking semiconductor chips may comprise two tables for supporting wafers, a picker for picking up semiconductor chips and a picker transfer unit for moving the picker vertically and horizontally. The method for manufacturing a semiconductor package using the same may allow easy and rapid stacking of semiconductor chips, thereby improving the productivity of semiconductor package manufacture. Further, a semiconductor chip having a relatively thick film is attached onto another semiconductor chip having a relatively thin film. The thicker semiconductor chip may protect the thinner semiconductor chip from faults such as chipping or warpage which may occur due to external shocks such as that caused by a picker, thereby improving the reliability of the package.

1 . A semiconductor package comprising:
 a first semiconductor chip;   a second semiconductor chip set including at least one semiconductor chip;   a substrate having the second semiconductor chip set attached on a top surface;   solder balls formed on a bottom surface of the substrate; and   bonding wires electrically connecting the first semiconductor chip and the second semiconductor chip set to the substrate,   wherein the first semiconductor chip has a first chip height and a first chip area and the second semiconductor chip set has a second chip height and a second chip area and a first ratio of the first chip area to the first chip height and a second ratio of the second chip area to the second chip height.   
   
   
       2 . The package of  claim 1 , wherein the first ratio is between 100 mm and 1,000 mm and the second ratio is between 1,000 mm and 5,000 mm. 
   
   
       3 . The package of  claim 1 , wherein the first chip height is larger than the second chip height.