Dicing tape attaching unit that can attach pre-cut dicing tape and general dicing tape to wafer and in-line system having the dicing tape attaching unit

Abstract

A dicing tape attaching unit that can attach both a pre-cut dicing tape and a general dicing tape to a wafer in a semiconductor package assembling process, and an in-line system used in a semiconductor package process including the dicing tape attaching unit are provided. The dicing tape attaching unit supplies one of the pre-cut dicing tape and the general dicing tape and attaches it to a wafer according to the direction of rotation of a tape loader. Accordingly, without an additional pre-cut dicing tape attaching unit, either of the pre-cut dicing tape and the general dicing tape can be attached to the back side of the wafer by one and the same unit.

1 . A dicing tape attaching unit comprising: 
 a tape loader which supplies one of a pre-cut dicing tape and a general dicing tape depending on the direction in which the taper loader rotates;    a tape cutter portion which cuts a portion of the general dicing tape remaining after the general dicing tape is attached to the back sides of a wafer and a ring frame; and    an unloading unit which transfers the ring frame, to which the pre-cut dicing tape or general dicing tape is attached to the wafer, to a location outside the unit.    
     
     
         2 . The unit of  claim 1 , wherein the tape loader rotates clockwise when supplying the pre-cut dicing tape.  
     
     
         3 . The unit of  claim 1 , wherein the tape loader rotates counterclockwise when supplying the general dicing tape.  
     
     
         4 . The unit of  claim 1 , which further includes a liner film winding reel which winds a liner film separated from the pre-cut dicing tape or general dicing tape.  
     
     
         5 . The unit of  claim 4 , wherein the liner film winding reel winds the amount of the pre-cut dicing tape remaining after a pre-cut process is performed.  
     
     
         6 . The unit of  claim 1 , which further includes an attaching table where the pre-cut dicing tape or general dicing tape is attached onto the ring frame and the wafer.  
     
     
         7 . The unit of  claim 1 , which further includes a press roller portion that presses the pre-cut dicing tape or general dicing tape supplied by the tape loader and the ring frame.  
     
     
         8 . The unit of  claim 1 , which further includes a peeling unit that removes from the attaching table the portion of the general dicing tape remaining after the general dicing tape is attached.  
     
     
         9 . The unit of  claim 1 , which further includes a mount frame transferring portion that transfers the ring frame, in which the pre-cut dicing tape or general dicing tape is attached to the wafer, to a lamination tape detaching portion.  
     
     
         10 . The unit of  claim 1 , which further includes a wafer stacking portion for stacking a wafer used to attach the pre-cut dicing tape or general dicing tape to a wafer.  
     
     
         11 . The unit of  claim 1 , which further includes a ring frame stacking portion that stacks a ring frame used to attach the pre-cut dicing tape or general dicing tape to a wafer.