Inventor · disambiguated record
Terry Tarn
Also filed as: TARN TERRY
23 granted patents·2 pending applications·526 citations·filing 1990–2014
96Inventor score
Top patents by PatentIndex Score
25 records- 0196US7042623B1Light blocking layers in MEMS packagesREFLECTIVITY INC·Filed 2004·Granted May 9, 2006·99 cites·52 claims
- 0295US7449773B2Microelectromechanical device packages with integral heatersTEXAS INSTRUMENTS INC·Filed 2005·Granted Nov 11, 2008·26 cites·48 claims
- 0395US7282393B2Microelectromechanical device packages with integral heatersTEXAS INSTRUMENTS INC·Filed 2005·Granted Oct 16, 2007·25 cites·35 claims
- 0493US7872338B2Microelectromechanical device packages with integral heatersTEXAS INSTRUMENTS INC·Filed 2008·Granted Jan 18, 2011·19 cites·11 claims
- 0593US7787170B2Micromirror array assembly with in-array pillarsTEXAS INSTRUMENTS INC·Filed 2004·Granted Aug 31, 2010·39 cites·35 claims
- 0692US7164199B2Device packages with low stress assembly processTEXAS INSTRUMENTS INC·Filed 2005·Granted Jan 16, 2007·21 cites·11 claims
- 0780US5865935AMethod of packaging image sensorsEASTMAN KODAK CO·Filed 1997·Granted Feb 2, 1999·59 cites·5 claims
- 0879US7508063B2Low cost hermetically sealed packageTEXAS INSTRUMENTS INC·Filed 2005·Granted Mar 24, 2009·7 cites·55 claims
- 0978US9056764B2Microelectromechanical device packages with integral heatersTARN TERRY·Filed 2007·Granted Jun 16, 2015·7 cites·22 claims
- 1076US5192835ABonding of solid state device to terminal boardEASTMAN KODAK CO·Filed 1990·Granted Mar 9, 1993·56 cites·19 claims
- 1172US7402878B2Packaging method for microstructure and semiconductor devicesTEXAS INSTRUMENTS INC·Filed 2004·Granted Jul 22, 2008·11 cites·54 claims
- 1268US5289002AOptical sensor and method of productionEASTMAN KODAK CO·Filed 1992·Granted Feb 22, 1994·31 cites·7 claims
- 1367US7110160B2Electrical contacts in microelectromechanical devices with multiple substratesREFLECTIVITY INC·Filed 2005·Granted Sep 19, 2006·6 cites·45 claims
- 1465US8693082B2Micromirror array assembly with in-array pillarsPATEL SATYADEV·Filed 2010·Granted Apr 8, 2014·2 cites·9 claims
- 1562US5670009AAssembly technique for an image sensor arrayEASTMAN KODAK CO·Filed 1995·Granted Sep 23, 1997·29 cites·8 claims
- 1662US5074683AFiber optic faceplates and method of mounting sameEASTMAN KODAK CO·Filed 1990·Granted Dec 24, 1991·25 cites·17 claims
- 1754US5340420AMethod for bonding a color separation filter to an image sensorEASTMAN KODAK CO·Filed 1993·Granted Aug 23, 1994·15 cites·5 claims
- 1848US9261696B2Micromirror array assemblyTEXAS INSTRUMENTS INC·Filed 2014·Granted Feb 16, 2016·0 cites·9 claims
- 1948US8778741B2Low cost hermetically sealed packageDUBOC ROBERT M·Filed 2008·Granted Jul 15, 2014·0 cites·20 claims
- 2048US5349234APackage and method for assembly of infra-red imaging devicesEASTMAN KODAK CO·Filed 1992·Granted Sep 20, 1994·18 cites·29 claims
- 2147US5382310APackaging medical image sensorsEASTMAN KODAK CO·Filed 1994·Granted Jan 17, 1995·16 cites·2 claims
- 2247US5337217AIntegrated circuit package for an image sensorEASTMAN KODAK CO·Filed 1993·Granted Aug 9, 1994·15 cites·8 claims
- 2345US7408250B2Micromirror array device with compliant adhesiveTEXAS INSTRUMENTS INC·Filed 2005·Granted Aug 5, 2008·0 cites·57 claims
- 2441US2004232535A1Microelectromechanical device packages with integral heatersFiled 2003·Application pending·0 cites
- 2540US2005093134A1Device packages with low stress assembly processFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →