Inventor · disambiguated record
Hideki Tsuchida
Also filed as: TSUCHIDA HIDEKI
9 granted patents·10 pending applications·155 citations·filing 1995–2006
89Inventor score
Top patents by PatentIndex Score
19 records- 0195US7374652B2Plating methodROHM & HAAS ELECT MAT·Filed 2006·Granted May 20, 2008·62 cites·6 claims
- 0288US6881319B2Electrolytic copper plating solution and method for controlling the sameSHIPLEY CO LLC·Filed 2001·Granted Apr 19, 2005·27 cites·13 claims
- 0388US6835294B2Electrolytic copper plating methodSHIPLEY CO LLC·Filed 2002·Granted Dec 28, 2004·27 cites·10 claims
- 0473US6740425B2Method for manufacturing copper-resin composite materialSHIPLEY CO LLC·Filed 2002·Granted May 25, 2004·15 cites·12 claims
- 0566US6899781B2Method for forming resin composite materialSHIPLEY CO LLC·Filed 2002·Granted May 31, 2005·6 cites·13 claims
- 0661US6821556B2Process for producing heat sensitive recording materialOJI PAPER CO·Filed 2001·Granted Nov 23, 2004·4 cites·18 claims
- 0755US6761814B2Via filling methodSHIPLEY CO LLC·Filed 2002·Granted Jul 13, 2004·6 cites·9 claims
- 0850US6977035B2Method for electrolytic copper platingSHIPLEY CO LLC·Filed 2003·Granted Dec 20, 2005·3 cites·6 claims
- 0946US2005164020A1Composite material with improved binding strength and method for forming the sameSHIPLEY CO LLC·Filed 2005·Application pending·0 cites
- 1042US2003221967A1Via filling methodSHIPLEY CO LLC·Filed 2003·Application pending·0 cites
- 1142US2004118691A1Electroplating methodSHIPLEY CO LLC·Filed 2002·Application pending·0 cites
- 1240US2004101665A1Direct patterning methodSHIPLEY CO LLC·Filed 2003·Application pending·0 cites
- 1339US2004050706A1Copper electroplating method using insoluble anodeFiled 2001·Application pending·0 cites
- 1438US2003003307A1Non-charging resin composite and method for manufacturing the sameSHIPLEY CO LLC·Filed 2001·Application pending·0 cites
- 1538US2004072015A1Composite material with improved binding strength and method for forming the sameSHIPLEY CO LLC·Filed 2001·Application pending·0 cites
- 1636US2004170846A1Resin composite material and method of forming the sameFiled 2001·Application pending·0 cites
- 1735US5653779AMethod for manufacturing quartz glass components and molding frame thereforHERAEUS QUARZGLAS·Filed 1995·Granted Aug 5, 1997·5 cites·6 claims
- 1835US2004089557A1Process for electrolytic copper platingSHIPLEY CO LLC·Filed 2002·Application pending·0 cites
- 1935US2004253450A1Formaldehyde-free electroless copper plating process and solution for use in the processSHIPLEY CO LLC·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →