Inventor · disambiguated record
Gu-Sung Kim
Also filed as: KIM GU S · KIM GU-SUNG
36 granted patents·11 pending applications·3,137 citations·filing 1991–2012
98Inventor score
Files withSAMSUNG ELECTRONICS CO LTD37EPWORKS CO LTD2KIM GU-SUNG2LEE KANG-WOOK2FOUNDATION SEOUL TECHNOPARK1
Top patents by PatentIndex Score
47 records- 0199US7531890B2Multi-chip package (MCP) with a conductive bar and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted May 12, 2009·239 cites·20 claims
- 0299US7276799B2Chip stack package and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Oct 2, 2007·429 cites·10 claims
- 0399US7215033B2Wafer level stack structure for system-in-package and method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted May 8, 2007·422 cites·11 claims
- 0499US6908785B2Multi-chip package (MCP) with a conductive bar and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Jun 21, 2005·338 cites·21 claims
- 0598US6607938B2Wafer level stack chip package and method for manufacturing sameSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Aug 19, 2003·394 cites·16 claims
- 0697US7537959B2Chip stack package and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted May 26, 2009·52 cites·10 claims
- 0796US5552635AHigh thermal emissive semiconductor device packageSAMSUNG ELECTRONICS CO LTD·Filed 1995·Granted Sep 3, 1996·280 cites·7 claims
- 0896US5518957AMethod for making a thin profile semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 1994·Granted May 21, 1996·233 cites·14 claims
- 0995US8368231B2Chipstack package and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2011·Granted Feb 5, 2013·12 cites·19 claims
- 1095US7262475B2Image sensor device and method of manufacturing sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Aug 28, 2007·30 cites·8 claims
- 1194US5407864AProcess for mounting a semiconductor chip and depositing contacts into through holes of a circuit board and of an insulating interposer and onto the chipSAMSUNG ELECTRONICS CO LTD·Filed 1993·Granted Apr 18, 1995·175 cites·14 claims
- 1292US5186381ASemiconductor chip bonding processSAMSUNG ELECTRONICS CO LTD·Filed 1991·Granted Feb 16, 1993·148 cites·1 claims
- 1387US7977156B2Chipstack package and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Jul 12, 2011·11 cites·20 claims
- 1483US6518675B2Wafer level package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Feb 11, 2003·26 cites·27 claims
- 1583US5356838AManufacturing method of a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 1993·Granted Oct 18, 1994·71 cites·16 claims
- 1678US7786594B2Wafer level stack structure for system-in-package and method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Aug 31, 2010·5 cites·25 claims
- 1778US6586275B2Wafer level package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Jul 1, 2003·20 cites·18 claims
- 1877US8278766B2Wafer level stack structure for system-in-package and method thereofLEE KANG-WOOK·Filed 2010·Granted Oct 2, 2012·3 cites·16 claims
- 1976US7196000B2Method for manufacturing a wafer level chip scale packageSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Mar 27, 2007·20 cites·12 claims
- 2075US5157588ASemiconductor package and manufacture thereofSAMSUNG ELECTRONICS CO LTD·Filed 1991·Granted Oct 20, 1992·53 cites·4 claims
- 2172US7550317B2Method for manufacture of wafer level package with air padsSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Jun 23, 2009·4 cites·16 claims
- 2271US7824959B2Wafer level stack structure for system-in-package and method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Nov 2, 2010·3 cites·13 claims
- 2371US7534656B2Image sensor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted May 19, 2009·2 cites·12 claims
- 2471US6836018B2Wafer level package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Dec 28, 2004·13 cites·17 claims
- 2569US7141885B2Wafer level package with air pads and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Nov 28, 2006·13 cites·14 claims
- 2665US5504373ASemiconductor memory moduleSAMSUNG ELECTRONICS CO LTD·Filed 1994·Granted Apr 2, 1996·36 cites·5 claims
- 2764US7307340B2Wafer-level electronic modules with integral connector contactsSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Dec 11, 2007·11 cites·38 claims
- 2863US7224055B2Center pad type IC chip with jumpers, method of processing the same and multi chip packageSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted May 29, 2007·11 cites·20 claims
- 2961US7375426B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted May 20, 2008·2 cites·43 claims
- 3061US7300864B2Method for forming solder bump structureSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Nov 27, 2007·9 cites·20 claims
- 3160US5199164AMethod of manufacturing semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 1992·Granted Apr 6, 1993·27 cites·4 claims
- 3259US5568057AMethod for performing a burn-in testSAMSUNG ELECTRONICS CO LTD·Filed 1995·Granted Oct 22, 1996·27 cites·10 claims
- 3358US7521657B2Assembly having wafer with image sensor chips, a photo-sensitive adhesive pattern and plate thereof and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Apr 21, 2009·2 cites·21 claims
- 3458US7371614B2Image sensor device and methods thereofSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted May 13, 2008·2 cites·20 claims
- 3551US2007205512A1Solder bump structure for flip chip package and method for manufacturing the sameLEE IN-YOUNG·Filed 2007·Application pending·0 cites
- 3649US2007132108A1Method for manufacturing a wafer level chip scale packageSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 3747US5621242ASemiconductor package having support film formed on inner leadsSAMSUNG ELECTRONICS CO LTD·Filed 1996·Granted Apr 15, 1997·14 cites·21 claims
- 3847US2010193903A1Three dimensional semiconductor device, method of manufacturing the same and electrical cutoff method for using fuse pattern of the sameEPWORKS CO LTD·Filed 2008·Application pending·0 cites
- 3945US2007010041A1Method of manufacturing optical device having transparent cover and method of manufacturing optical device module using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 4044US2007197030A1Center pad type ic chip with jumpers, method of processing the same and multi chip packageSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 4144US2005127508A1Solder bump structure for flip chip package and method for manufacturing the sameFiled 2004·Application pending·0 cites
- 4242US8821826B2Method for regenerating silicon from silicon waste and silicon manufactured using the sameKIM GU SUNG·Filed 2009·Granted Sep 2, 2014·0 cites·6 claims
- 4342US2012225501A1Three dimensional semiconductor device, method of manufacturing the same and electrical cutoff method for using fuse pattern of the sameKIM GU-SUNG·Filed 2012·Application pending·0 cites
- 4441US2005104222A1Flip chip device having supportable bar and mounting structure thereofFiled 2004·Application pending·0 cites
- 4540US2007007641A1Chip-embedded interposer structure and fabrication method thereof, wafer level stack structure and resultant package structureLEE KANG-WOOK·Filed 2006·Application pending·0 cites
- 4635US2013037946A1Semiconductor chip including bump having barrier layer, and manufacturing method thereofFOUNDATION SEOUL TECHNOPARK·Filed 2011·Application pending·0 cites
- 4734US2011272729A1Wafer level led interposerEPWORKS CO LTD·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →