Inventor · disambiguated record
Shem Ogadhoh
Also filed as: OGADHOH SHEM · OGADHOH SHEM O · OGADHOH SHEM ODHIAMBO
21 granted patents·11 pending applications·31 citations·filing 2004–2023
91Inventor score
Top patents by PatentIndex Score
32 records- 0190US8404403B2Mask design and OPC for device manufactureOGADHOH SHEM·Filed 2010·Granted Mar 26, 2013·10 cites·31 claims
- 0278US11121073B2Through plate interconnect for a vertical MIM capacitorINTEL CORP·Filed 2018·Granted Sep 14, 2021·2 cites·20 claims
- 0378US8778605B2Mask design and OPC for device manufactureOGADHOH SHEM·Filed 2013·Granted Jul 15, 2014·3 cites·4 claims
- 0475US12426247B2Capacitor connections in dielectric layersINTEL CORP·Filed 2023·Granted Sep 23, 2025·0 cites·20 claims
- 0574US8399157B2Lithography mask having sub-resolution phased assist featuresOGADHOH SHEM O·Filed 2010·Granted Mar 19, 2013·3 cites·20 claims
- 0668US12176284B2Through plate interconnect for a vertical MIM capacitorINTEL CORP·Filed 2021·Granted Dec 24, 2024·0 cites·20 claims
- 0768US7470492B2Process window-based correction for photolithography masksINTEL CORP·Filed 2004·Granted Dec 30, 2008·12 cites·20 claims
- 0867US11991873B2Capacitor separations in dielectric layersINTEL CORP·Filed 2023·Granted May 21, 2024·0 cites·18 claims
- 0966US8959465B2Techniques for phase tuning for process optimizationNYHUS PAUL A·Filed 2011·Granted Feb 17, 2015·1 cites·23 claims
- 1066US2022320275A1Thin-film transistor structures with gas spacerINTEL CORP·Filed 2022·Application pending·0 cites
- 1165US11581162B2Fill pattern to enhance ebeam process marginINTEL CORP·Filed 2021·Granted Feb 14, 2023·0 cites·7 claims
- 1257US11610894B2Capacitor separations in dielectric layersINTEL CORP·Filed 2019·Granted Mar 21, 2023·0 cites·20 claims
- 1356US12444685B2Backside electrical contact for PMOS epitaxial voltage supplyINTEL CORP·Filed 2022·Granted Oct 14, 2025·0 cites·25 claims
- 1456US2025006495A1And double patterning strategy with printed erasable dummificationINTEL CORP·Filed 2023·Application pending·0 cites
- 1555US12476183B2Punch-through interconnect feature to couple upper electrodes of capacitors of multi-level memory arraysINTEL CORP·Filed 2022·Granted Nov 18, 2025·0 cites·20 claims
- 1655US11404536B2Thin-film transistor structures with gas spacerINTEL CORP·Filed 2018·Granted Aug 2, 2022·0 cites·13 claims
- 1754US11832438B2Capacitor connections in dielectric layersINTEL CORP·Filed 2019·Granted Nov 28, 2023·0 cites·20 claims
- 1854US2024071955A1Full wafer device with multiple directional indicatorsINTEL CORP·Filed 2022·Application pending·0 cites
- 1954US2024105596A1Integrated circuit devices with angled interconnectsINTEL CORP·Filed 2022·Application pending·0 cites
- 2053US2023422463A1Static random-access memory devices with angled transistorsINTEL CORP·Filed 2023·Application pending·0 cites
- 2152US2024105798A1Trim patterning for forming angled transistorsSHARMA ABHISHEK A·Filed 2022·Application pending·0 cites
- 2251US11107658B2Fill pattern to enhance e-beam process marginINTEL CORP·Filed 2016·Granted Aug 31, 2021·0 cites·20 claims
- 2351US9046761B2Lithography mask having sub-resolution phased assist featuresINTEL CORP·Filed 2013·Granted Jun 2, 2015·0 cites·25 claims
- 2451US2023317148A1Epitaxial layers of a transistor electrically coupled with a backside contact metalINTEL CORP·Filed 2022·Application pending·0 cites
- 2551US2023207445A1High bandwidth and capacity approaches for stitched diesSHARMA ABHISHEK ANIL·Filed 2021·Application pending·0 cites
- 2651US2025159953A1Integrated circuit devices with angled transistorsINTEL CORP·Filed 2022·Application pending·0 cites
- 2749US12080643B2Integrated circuit structures having differentiated interconnect lines in a same dielectric layerINTEL CORP·Filed 2019·Granted Sep 3, 2024·0 cites·13 claims
- 2848US11563107B2Method of contact patterning of thin film transistors for embedded DRAM using a multi-layer hardmaskINTEL CORP·Filed 2019·Granted Jan 24, 2023·0 cites·25 claims
- 2947US12446208B2Multilevel wordline assembly for embedded DRAMINTEL CORP·Filed 2021·Granted Oct 14, 2025·0 cites·11 claims
- 3045US11652047B2Intermediate separation layers at the back-end-of-lineINTEL CORP·Filed 2019·Granted May 16, 2023·0 cites·19 claims
- 3142US2020411635A1Air gaps and capacitors in dielectric layersINTEL CORP·Filed 2019·Application pending·0 cites
- 3238US2021125992A1Interconnect structures for integrated circuitsINTEL CORP·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →