Inventor · disambiguated record
Rung-Jeng Lin
Also filed as: LIN RUNG-JENG
5 granted patents·6 pending applications·2 citations·filing 2018–2024
64Inventor score
Technology areasH10W
Top patents by PatentIndex Score
11 records- 0175US10756438B2Electronic package and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2018·Granted Aug 25, 2020·2 cites·7 claims
- 0263US11101566B2Method for fabricating electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2020·Granted Aug 24, 2021·0 cites·11 claims
- 0359US11516925B2Package stack structure and method for manufacturing the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2020·Granted Nov 29, 2022·0 cites·8 claims
- 0459US2025372510A1Semiconductor device and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
- 0552US2024145908A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2022·Application pending·0 cites
- 0649US11289794B2Electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2020·Granted Mar 29, 2022·0 cites·8 claims
- 0747US2025054828A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2023·Application pending·0 cites
- 0847US2018288886A1Package stack structure and method for manufacturing the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2018·Application pending·0 cites
- 0945US2024379609A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2023·Application pending·0 cites
- 1039US2020043908A1Package stacked structure, method for fabricating the same, and package structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2018·Application pending·0 cites
- 1138US11380978B2Electronic package and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2018·Granted Jul 5, 2022·0 cites·27 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →