Inventor · disambiguated record
Tatsuhiko Ema
Also filed as: EMA TATSUHIKO
14 granted patents·8 pending applications·162 citations·filing 2000–2010
93Inventor score
Top patents by PatentIndex Score
22 records- 0191US6506453B2Deposition method, deposition apparatus, and pressure-reduction drying apparatusTOSHIBA KK·Filed 2000·Granted Jan 14, 2003·25 cites·12 claims
- 0286US6372413B2Method for cleaning the surface of substrate to which residues of resist stickTOSHIBA KK·Filed 2001·Granted Apr 16, 2002·35 cites·12 claims
- 0384US6709699B2Film-forming method, film-forming apparatus and liquid film drying apparatusTOSHIBA KK·Filed 2001·Granted Mar 23, 2004·27 cites·8 claims
- 0477US6719844B2Deposition method, deposition apparatus, and pressure-reduction drying apparatusTOSHIBA KK·Filed 2002·Granted Apr 13, 2004·7 cites·4 claims
- 0576US6800569B2Film forming method, film forming apparatus, pattern forming method, and manufacturing method of semiconductor apparatusTOSHIBA KK·Filed 2003·Granted Oct 5, 2004·12 cites·13 claims
- 0674US7018481B2Substrate treating method, substrate-processing apparatus, developing method, method of manufacturing a semiconductor device, and method of cleaning a developing solution nozzleTOSHIBA KK·Filed 2003·Granted Mar 28, 2006·13 cites·12 claims
- 0771US7364839B2Method for forming a pattern and substrate-processing apparatusTOSHIBA KK·Filed 2003·Granted Apr 29, 2008·10 cites·32 claims
- 0867US7604832B2Film forming method, film forming apparatus, pattern forming method, and manufacturing method of semiconductor apparatusTOSHIBA KK·Filed 2004·Granted Oct 20, 2009·7 cites·5 claims
- 0965US7312018B2Film forming method, film forming apparatus, pattern forming method, and manufacturing method of semiconductor apparatusTOSHIBA KK·Filed 2004·Granted Dec 25, 2007·6 cites·7 claims
- 1062US6842281B2Observation device, ultraviolet microscope and observation methodNIKON CORP·Filed 2002·Granted Jan 11, 2005·8 cites·20 claims
- 1162US6709531B2Chemical liquid processing apparatus for processing a substrate and the method thereofTOSHIBA KK·Filed 2003·Granted Mar 23, 2004·6 cites·11 claims
- 1258US2010104988A1Substrate treating method, substrate-processing apparatus, developing method, method of manufacturing a semiconductor device, and method of cleaning a developing solution nozzleTOSHIBA KK·Filed 2009·Application pending·0 cites
- 1357US8071157B2Film forming method, film forming apparatus, pattern forming method, and manufacturing method of semiconductor apparatusITO SHINICHI·Filed 2007·Granted Dec 6, 2011·0 cites·10 claims
- 1457US7669608B2Substrate treating method, substrate-processing apparatus, developing method, method of manufacturing a semiconductor device, and method of cleaning a developing solution nozzleTOSHIBA KK·Filed 2004·Granted Mar 2, 2010·4 cites·12 claims
- 1555US2004089229A1Deposition method, deposition apparatus, and pressure-reduction drying apparatusTOSHIBA KK·Filed 2003·Application pending·0 cites
- 1652US2011008545A1Film forming method, film forming apparatus, pattern forming method, and manufacturing method of semiconductor apparatusTOSHIBA KK·Filed 2010·Application pending·0 cites
- 1751US2006151015A1Chemical liquid processing apparatus for processing a substrate and the method thereofTOSHIBA KK·Filed 2006·Application pending·0 cites
- 1850US7067033B2Chemical liquid processing apparatus for processing a substrateTOSHIBA KK·Filed 2004·Granted Jun 27, 2006·2 cites·7 claims
- 1948US2010143849A1Semiconductor device manufacturing methodEMA TATSUHIKO·Filed 2009·Application pending·0 cites
- 2047US2009190108A1Method and system for leveling topography of semiconductor chip surfaceTOSHIBA AMERICA ELECTRONIC·Filed 2008·Application pending·0 cites
- 2142US2010167213A1Semiconductor device manufacturing methodSEINO YURIKO·Filed 2009·Application pending·0 cites
- 2242US2004126501A1Film-forming method, film-forming apparatus and liquid film drying apparatusTOSHIBA KK·Filed 2003·Application pending·0 cites
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