Inventor · disambiguated record
Georg Meyer-Berg
Also filed as: MEYER-BERG GEORG
62 granted patents·12 pending applications·264 citations·filing 2000–2022
98Inventor score
Files withINFINEON TECHNOLOGIES AG47MEYER-BERG GEORG15INTEL DEUTSCHLAND GMBH3ELIAN KLAUS2INTEL CORP2
Top patents by PatentIndex Score
74 records- 0194US8183677B2Device including a semiconductor chipMEYER-BERG GEORG·Filed 2008·Granted May 22, 2012·26 cites·17 claims
- 0293US6359790B1Multichip module having a silicon carrier substrateINFINEON TECHNOLOGIES AG·Filed 2000·Granted Mar 19, 2002·79 cites·5 claims
- 0392US8648456B1Embedded integrated circuit package and method for manufacturing an embedded integrated circuit packageMAHLER JOACHIM·Filed 2012·Granted Feb 11, 2014·13 cites·20 claims
- 0491US9190389B2Chip package with passivesINFINEON TECHNOLOGIES AG·Filed 2013·Granted Nov 17, 2015·13 cites·11 claims
- 0590US11233027B2Semiconductor deviceINTEL DEUTSCHLAND GMBH·Filed 2020·Granted Jan 25, 2022·2 cites·12 claims
- 0690US8373240B2Sensor device having a structure elementINFINEON TECHNOLOGIES AG·Filed 2012·Granted Feb 12, 2013·9 cites·12 claims
- 0789US11195787B2Semiconductor device including an antennaINFINEON TECHNOLOGIES AG·Filed 2016·Granted Dec 7, 2021·7 cites·12 claims
- 0887US10679959B2Semiconductor deviceINTEL DEUTSCHLAND GMBH·Filed 2018·Granted Jun 9, 2020·3 cites·20 claims
- 0987US9748611B2Apparatus for determining a state of a rechargeable battery or of a battery, a rechargeable battery or a battery, and a method for determining a state of a rechargeable battery or of a batteryINFINEON TECHNOLOGIES AG·Filed 2014·Granted Aug 29, 2017·4 cites·5 claims
- 1086US8513771B2Semiconductor package with integrated inductorELIAN KLAUS·Filed 2010·Granted Aug 20, 2013·8 cites·23 claims
- 1186US8124953B2Sensor device having a porous structure elementELIAN KLAUS·Filed 2009·Granted Feb 28, 2012·10 cites·17 claims
- 1285US8692361B2Electric device package comprising a laminate and method of making an electric device package comprising a laminateMAHLER JOACHIM·Filed 2012·Granted Apr 8, 2014·7 cites·17 claims
- 1385US7317251B2Multichip module including a plurality of semiconductor chips, and printed circuit board including a plurality of componentsINFINEON TECHNOLOGIES AG·Filed 2005·Granted Jan 8, 2008·14 cites·24 claims
- 1483US9349709B2Electronic component with sheet-like redistribution structureINFINEON TECHNOLOGIES AG·Filed 2013·Granted May 24, 2016·5 cites·35 claims
- 1581US7256493B2Ball grid array housing having a cooling foilINFINEON TECHNOLOGIES AG·Filed 2005·Granted Aug 14, 2007·8 cites·13 claims
- 1680US12154878B2Semiconductor deviceINTEL CORP·Filed 2022·Granted Nov 26, 2024·0 cites·20 claims
- 1780US7176059B2Method of fabricating an electronic component having at least one semiconductor chip on a circuit carrier with elastic external contactsINFINEON TECHNOLOGIES AG·Filed 2005·Granted Feb 13, 2007·8 cites·6 claims
- 1878US11848294B2Semiconductor deviceINTEL CORP·Filed 2021·Granted Dec 19, 2023·0 cites·12 claims
- 1975US10211158B2Power semiconductor module having a direct copper bonded substrate and an integrated passive component, and an integrated power moduleINFINEON TECHNOLOGIES AG·Filed 2014·Granted Feb 19, 2019·3 cites·13 claims
- 2074US9171787B2Packaged semiconductor device having an embedded systemINFINEON TECHNOLOGIES AUSTRIA·Filed 2013·Granted Oct 27, 2015·3 cites·20 claims
- 2174US7176131B2Electronic component having at least one semiconductor chip and flip-chip contacts, and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2004·Granted Feb 13, 2007·14 cites·5 claims
- 2273US8652866B2Sensor device and methodINFINEON TECHNOLOGIES AG·Filed 2013·Granted Feb 18, 2014·2 cites·14 claims
- 2372US8338231B2Encapsulated semiconductor chip with external contact pads and manufacturing method thereofMEYER-BERG GEORG·Filed 2010·Granted Dec 25, 2012·3 cites·22 claims
- 2469US9070568B2Chip package with embedded passive componentINFINEON TECHNOLOGIES AG·Filed 2013·Granted Jun 30, 2015·2 cites·19 claims
- 2568US9627305B2Semiconductor module with interlocked connectionINFINEON TECHNOLOGIES AG·Filed 2013·Granted Apr 18, 2017·3 cites·3 claims
- 2667US9159777B2Die arrangements containing an inductor coil and methods of manufacturing a die arrangement containing an inductor coilMEYER-BERG GEORG·Filed 2011·Granted Oct 13, 2015·2 cites·22 claims
- 2766US10049962B2Arrangement of multiple power semiconductor chips and method of manufacturing the sameINFINEON TECHNOLOGIES AG·Filed 2016·Granted Aug 14, 2018·1 cites·12 claims
- 2866US8124449B2Device including a semiconductor chip and metal foilsMEYER-BERG GEORG·Filed 2008·Granted Feb 28, 2012·3 cites·23 claims
- 2963US2022148951A1Semiconductor device including an antennaINFINEON TECHNOLOGIES AG·Filed 2021·Application pending·0 cites
- 3062US9425116B2Integrated circuit package and a method for manufacturing an integrated circuit packageINFINEON TECHNOLOGIES AG·Filed 2012·Granted Aug 23, 2016·1 cites·14 claims
- 3162US8580612B2Chip assemblyTHEUSS HORST·Filed 2009·Granted Nov 12, 2013·2 cites·21 claims
- 3262US8193040B2Manufacturing of a device including a semiconductor chipMEYER-BERG GEORG·Filed 2010·Granted Jun 5, 2012·1 cites·33 claims
- 3362US7498674B2Semiconductor module having a coupling substrate, and methods for its productionINFINEON TECHNOLOGIES AG·Filed 2006·Granted Mar 3, 2009·2 cites·14 claims
- 3461US8680668B2Device including a semiconductor chip and metal foilsMEYER-BERG GEORG·Filed 2012·Granted Mar 25, 2014·1 cites·25 claims
- 3558US10522447B2Chip package and a wafer level packageINFINEON TECHNOLOGIES AG·Filed 2018·Granted Dec 31, 2019·0 cites·20 claims
- 3657US10529678B2Semiconductor deviceINTEL DEUTSCHLAND GMBH·Filed 2015·Granted Jan 7, 2020·0 cites·4 claims
- 3756US11322451B2Power semiconductor module having a direct copper bonded substrate and an integrated passive component, and an integrated power moduleINFINEON TECHNOLOGIES AG·Filed 2019·Granted May 3, 2022·0 cites·9 claims
- 3856US10600690B2Method for handling a product substrate and a bonded substrate systemINFINEON TECHNOLOGIES AG·Filed 2018·Granted Mar 24, 2020·0 cites·17 claims
- 3956US9082767B2Embedded integrated circuit package and method for manufacturing an embedded integrated circuit packageINFINEON TECHNOLOGIES AG·Filed 2014·Granted Jul 14, 2015·0 cites·20 claims
- 4056US2009166843A1Semiconductor device and method for manufacturing a semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2007·Application pending·0 cites
- 4155US7129570B2Electronic component having at least one semiconductor chip on a circuit carrier and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2004·Granted Oct 31, 2006·5 cites·11 claims
- 4254US9917036B2Chip package and a wafer level packageINFINEON TECHNOLOGIES AG·Filed 2015·Granted Mar 13, 2018·0 cites·20 claims
- 4353US9111847B2Method for manufacturing a chip package, a method for manufacturing a wafer level package, a chip package and a wafer level packageMEYER-BERG GEORG·Filed 2012·Granted Aug 18, 2015·0 cites·29 claims
- 4453US2011227204A1Semiconductor device and method for manufacturing a semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2011·Application pending·0 cites
- 4552US8669175B2Semiconductor device and manufacturing of the semiconductor deviceMEYER-BERG GEORG·Filed 2012·Granted Mar 11, 2014·0 cites·18 claims
- 4652US8264085B2Semiconductor device package interconnectionsMEYER-BERG GEORG·Filed 2008·Granted Sep 11, 2012·0 cites·14 claims
- 4752US2007102826A1Electronic Component Having at Least One Semiconductor Chip and Flip-Chip Contacts, and Method for Producing the SameINFINEON TECHNOLOGIES AG·Filed 2007·Application pending·0 cites
- 4850US9666499B2Semiconductor device with encapsulantINFINEON TECHNOLOGIES AG·Filed 2012·Granted May 30, 2017·0 cites·15 claims
- 4950US7414311B2Ball grid array housing having a cooling foilINFINEON TECHNOLOGIES AG·Filed 2007·Granted Aug 19, 2008·0 cites·16 claims
- 5049US10297564B2Semiconductor die attach system and methodINFINEON TECHNOLOGIES AG·Filed 2017·Granted May 21, 2019·0 cites·25 claims
Showing the top 50 of 74 patent records by PatentIndex Score.
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