Electronic Component Having at Least One Semiconductor Chip and Flip-Chip Contacts, and Method for Producing the Same

Abstract

An electronic component has a semiconductor chip and microscopically small flip-chip contacts belonging to a rewiring plate, on which macroscopically large elastic external contacts are arranged. The rewiring plate has a wiring support made of polycrystalline silicon, amorphous glass, or metal. Furthermore, the present invention relates to a method for the production of a suitable wiring support and of the electronic component.

1 . An electronic component comprising: 
 at least one semiconductor chip, wherein the semiconductor chip includes microscopically small flip-chip contacts;    a rewiring plate, on which macroscopically large external contacts and the semiconductor chip with its flip-chip contacts are arranged, the rewiring plate including a wiring support with a rewiring pattern, the rewiring pattern including microscopically small contact connecting areas, macroscopically large external contact areas and conductor tracks, the conductor tracks connecting the microscopically small flip-chip contacts on the contact connecting areas electrically to macroscopically large external contacts on the external contact areas;    wherein a material of the wiring support includes a thermal expansion coefficient greater than or equal to the expansion coefficient of the semiconductor chip and not exceeding  1 . 5  times the thermal expansion coefficient of the semiconductor chip and the macroscopically large external contacts are elastic external contacts.    
   
   
       2 . The electronic component as claimed in  claim 1 , wherein the wiring support comprises one of a polycrystalline silicon, an amorphous glass, and a metal.  
   
   
       3 . The electronic component as claimed in  claim 1 , wherein the flip-chip contacts are microscopically small surface contacts or solid contacts, which comprise intermetallic phases.  
   
   
       4 . The electronic component as claimed in  claim 1 , wherein the wiring support comprises metal with an insulating layer, which is arranged between the rewiring pattern and that side of the wiring support which bears the rewiring pattern.  
   
   
       5 . The electronic component as claimed in  claim 1 , wherein the wiring support comprises an iron/nickel alloy with 40 to 42% by weight of nickel.  
   
   
       6 . The electronic component as claimed in  claim 1 , wherein the wiring support comprises a copper/molybdenum alloy with 10 to 30% by weight of copper.  
   
   
       7 . The electronic component as claimed in  claim 1 , wherein the at least one semiconductor chip and the elastic external contacts are arranged on a common surface of the rewiring plate which includes the rewiring pattern.  
   
   
       8 . The electronic component as claimed in  claim 1 , wherein the at least one semiconductor chip and the elastic external contacts are arranged on opposite surfaces of the rewiring plate.  
   
   
       9 . The electronic component as claimed in  claim 8 , wherein the at least one semiconductor chip with its flip-chip contacts is arranged on the rewiring pattern, and elastic external contacts on the surface of the rewiring plate opposite the rewiring pattern are connected to the external contact areas via through contacts.  
   
   
       10 . The electronic component as claimed in  claim 8 , wherein the wiring support has through contacts made of one of metal and polycrystalline silicon, and are insulated electrically with respect to the wiring support.  
   
   
       11 . The electronic component as claimed in  claim 1 , wherein the wiring support includes metallic wires embedded in glass or polycrystalline silicon as through contacts and arranged in a grid dimension corresponding to the grid dimension of the external contacts.  
   
   
       12 . The electronic component as claimed in  claim 11 , wherein the wiring support includes metallic wires made of one of chrome-vanadium steel, chrome-molybdenum steel, chrome-nickel steel, nickel-iron alloys, and copper-molybdenum alloys and embedded in one of glass and polycrystalline silicon as through contacts.  
   
   
       13 . The electronic component as claimed in  claim 1 , wherein the wiring support includes at least one of carbon fibers and graphite fibers embedded in one of glass or polycrystalline silicon as through contacts and arranged in a grid dimension corresponding to the grid dimension of the external contacts.  
   
   
       14 . The electronic component as claimed in  claim 1 , wherein a semiconductor chip arranged in the center of the electronic component includes a solder layer at its rear, the solder layer permitting central fixing of the electronic component on a circuit board and limiting the elastic pressure on the external contacts.  
   
   
       15 . The electronic component as claimed  claim 1 , further comprising: 
 rigid external contacts disposed in the center of the electronic component, the rigid external contacts permitting central fixing of the component on a circuit board and limiting the elastic pressure on the external contacts.    
   
   
       16 . The electronic component as claimed in  claim 1 , wherein a plurality of electronic components are stacked on one another and at least one of the components has a wiring support including through contacts on both opposite sides including external contact areas connected electrically to external contacts.  
   
   
       17 . A wiring support made of metal, comprising: 
 an insulating layer on an upper side and underside of said wiring support;    rewiring lines connecting to microscopically small contact areas being arranged on the insulating layer of the wiring support upper side and connecting to macroscopically large elastic external contents being arranged on the insulating layer of the wiring support underside;    wherein passage openings are etched between the upper side and underside and include through contact lines insulated from the metal by an insulating layer to electricaly connect the rewiring lines of the upper side and underside to one another.