Inventor · disambiguated record
Yuan-Hung Liu
Also filed as: LIU YUAN-HUNG
38 granted patents·8 pending applications·871 citations·filing 1999–2024
98Inventor score
Files withTAIWAN SEMICONDUCTOR MFG23TAIWAN SEMICONDUCTOR MFG CO LTD7YUH SHAN ENV ENGINEERING CO LTD2CHANG CHUN HUA1CHEN HSIN-YU1
Top patents by PatentIndex Score
46 records- 0196US9252238B1Semiconductor structures with coplanar recessed gate layers and fabrication methodsGLOBALFOUNDRIES INC·Filed 2014·Granted Feb 2, 2016·427 cites·20 claims
- 0296US6492245B1Method of forming air gap isolation between a bit line contact structure and a capacitor under bit line structureTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Dec 10, 2002·119 cites·19 claims
- 0392US7883917B2Semiconductor device with bonding padTAIWAN SEMICONDUCTOR MFG·Filed 2009·Granted Feb 8, 2011·20 cites·8 claims
- 0486US8803322B2Through substrate via structures and methods of forming the sameYANG KU-FENG·Filed 2011·Granted Aug 12, 2014·7 cites·20 claims
- 0585US9418999B2MIM capacitors with improved reliabilityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Aug 16, 2016·6 cites·19 claims
- 0685US6486025B1Methods for forming memory cell structuresTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Nov 26, 2002·36 cites·12 claims
- 0783US9263382B2Through substrate via structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Feb 16, 2016·5 cites·20 claims
- 0883US9006101B2Interconnect structure and methodCHEN HSIN-YU·Filed 2012·Granted Apr 14, 2015·6 cites·19 claims
- 0981US8878338B2Capacitor for interposers and methods of manufacture thereofCHANG CHUN HUA·Filed 2012·Granted Nov 4, 2014·4 cites·20 claims
- 1081US7189957B2Methods to improve photonic performances of photo-sensitive integrated circuitsTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Mar 13, 2007·6 cites·18 claims
- 1176US9660016B2Method of manufacturing a capacitorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted May 23, 2017·2 cites·11 claims
- 1276US9059262B2Integrated circuits including conductive structures through a substrate and methods of making the sameLIU YUAN-HUNG·Filed 2011·Granted Jun 16, 2015·4 cites·20 claims
- 1376US8546235B2Integrated circuits including metal-insulator-metal capacitors and methods of forming the sameHUANG SUNG-HUI·Filed 2011·Granted Oct 1, 2013·4 cites·20 claims
- 1476US7443005B2Lens structures suitable for use in image sensors and method for making the sameTIAWAN SEMICONDUCTOR MFG CO LT·Filed 2004·Granted Oct 28, 2008·24 cites·22 claims
- 1574US7122424B2Method for making improved bottom electrodes for metal-insulator-metal crown capacitorsTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Oct 17, 2006·16 cites·16 claims
- 1673US10153338B2Method of manufacturing a capacitorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 11, 2018·1 cites·20 claims
- 1770US6177307B1Process of planarizing crown capacitor for integrated circuitWORLDWIDE SEMICONDUCTOR CORP·Filed 1999·Granted Jan 23, 2001·31 cites·20 claims
- 1867US7563675B2Ladder poly etching back process for word line poly planarizationTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Jul 21, 2009·2 cites·20 claims
- 1967US7172908B2Magnetic memory cells and manufacturing methodsTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Feb 6, 2007·2 cites·14 claims
- 2067US6780731B1HDP gap-filling process for structures with extra step at side-wallTAIWAN SEMICONDUCTORY MFG CO L·Filed 2002·Granted Aug 24, 2004·18 cites·12 claims
- 2167US6399286B1Method of fabricating reduced critical dimension for conductive line and spaceTAIWAN SEMICONDUCTOR MFG CORP·Filed 1999·Granted Jun 4, 2002·33 cites·21 claims
- 2267US6232175B1Method of manufacturing double-recess crown-shaped DRAM capacitorTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted May 15, 2001·32 cites·8 claims
- 2366US8440540B2Method for doping a selected portion of a deviceLIU HAN-CHI·Filed 2009·Granted May 14, 2013·2 cites·20 claims
- 2466US6869837B1Methods of fabricating a word-line spacer for wide over-etching window on outside diameter (OD) and strong fenceTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Mar 22, 2005·11 cites·39 claims
- 2564US7824998B2Method of forming a semiconductor capacitor using amorphous carbonTAIWAN SEMICONDUCTOR MFG·Filed 2009·Granted Nov 2, 2010·1 cites·5 claims
- 2664US6352919B1Method of fabricating a borderless viaTAIWAN SEMICONDUCTOR MFG·Filed 2000·Granted Mar 5, 2002·12 cites·19 claims
- 2760US9041841B2Image sensor having enhanced backside illumination quantum efficiencyLIAO YIN-KAI·Filed 2009·Granted May 26, 2015·2 cites·20 claims
- 2860US2025100917A1Treatment method for waste waterYUH SHAN ENV ENGINEERING CO LTD·Filed 2024·Application pending·0 cites
- 2956US6291312B1Method for forming pullback opening above shallow trenc isolation structureTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted Sep 18, 2001·20 cites·15 claims
- 3056US6218244B1Method of fabricating transistorTAIWAN SEMICONDUCTOR MFG·Filed 2000·Granted Apr 17, 2001·7 cites·14 claims
- 3155US10269848B2Image sensor having enhanced backside illumination quantum efficiencyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 23, 2019·0 cites·20 claims
- 3255US7214589B2Flash memory cell and methods for fabricating sameTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted May 8, 2007·6 cites·16 claims
- 3352US9640582B2Method of manufacturing image sensor having enhanced backside illumination quantum efficiencyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted May 2, 2017·0 cites·20 claims
- 3452US8889507B2MIM capacitors with improved reliabilityWU CHIH-TA·Filed 2007·Granted Nov 18, 2014·1 cites·18 claims
- 3552US7554145B2Magnetic memory cells and manufacturing methodsTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Jun 30, 2009·0 cites·13 claims
- 3651US7202130B2Spacer for a split gate flash memory cell and a memory cell employing the sameTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Apr 10, 2007·4 cites·50 claims
- 3750US9773701B2Methods of making integrated circuits including conductive structures through substratesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Sep 26, 2017·0 cites·20 claims
- 3850US2008124912A1Semiconductor methodsTAIWAN SEMICONDUCTOR MFG·Filed 2006·Application pending·0 cites
- 3949US9953920B2Interconnect structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 24, 2018·0 cites·20 claims
- 4049US2008246152A1Semiconductor device with bonding padTAIWAN SEMICONDUCTOR MFG·Filed 2007·Application pending·0 cites
- 4148US2024163978A1Electric heating material processing device, series electric heating material processing device, and parallel electric heating material processing deviceYUH SHAN ENV ENGINEERING CO LTD·Filed 2023·Application pending·0 cites
- 4244US2008173904A1CMOS image sensors with a bonding pad and methods of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2007·Application pending·0 cites
- 4344US2008217775A1Method of forming contact plugs for eliminating tungsten seam issueTAIWAN SEMICONDUCTOR MFG·Filed 2007·Application pending·0 cites
- 4442US7586145B2EEPROM flash memory device with jagged edge floating gateTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Sep 8, 2009·0 cites·25 claims
- 4542US2009051034A1Semiconductor device and method for the sameTAIWAN SEMICONDUCTOR MFG·Filed 2007·Application pending·0 cites
- 4639US2015024584A1Methods for forming integrated circuits with reduced replacement metal gate height variabilityGLOBAL FOUNDRIES INC·Filed 2013·Application pending·0 cites
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