Inventor · disambiguated record
Byung-Man Kim
Also filed as: KIM BYUNG M · KIM BYUNG MAN
15 granted patents·11 pending applications·351 citations·filing 1998–2017
92Inventor score
Files withSAMSUNG ELECTRONICS CO LTD12SAMSUNG ELECTRO MECH4KIM BYUNG-MAN2PARK CHANG-YONG2BANG HYO-JAE1
Top patents by PatentIndex Score
26 records- 0194US7215026B2Semiconductor module and method of forming a semiconductor moduleSAMSUNG ELECTONICS CO LTD·Filed 2005·Granted May 8, 2007·42 cites·36 claims
- 0293US6121118AChip separation device and methodSAMSUNG ELECTRONICS CO LTD·Filed 1999·Granted Sep 19, 2000·149 cites·19 claims
- 0386US6753599B2Semiconductor package and mounting structure on substrate thereof and stack structure thereofSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Jun 22, 2004·48 cites·3 claims
- 0482US6103554AMethod for packaging integrated circuits with elastomer chip carriersSAMSUNG ELECTRONICS CO LTD·Filed 1998·Granted Aug 15, 2000·74 cites·16 claims
- 0577US7521788B2Semiconductor module with conductive element between chip packagesSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Apr 21, 2009·8 cites·30 claims
- 0657US8632218B2Lighting devicePARK HUN YONG·Filed 2011·Granted Jan 21, 2014·1 cites·11 claims
- 0754US2009321779A1Side view light emitting diode packageSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 0854US2009283792A1Side view light emitting diode packageSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 0953US10096756B2Side view light emitting diode packageSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Oct 9, 2018·0 cites·10 claims
- 1052US10777363B2Lead-free perovskite-based hole transport material composites, solar cells including the same, and method of manufacturing the sameULSAN NAT INST SCIENCE & TECH UNIST·Filed 2017·Granted Sep 15, 2020·0 cites·15 claims
- 1151US2007161224A1Semiconductor module and method of forming a semiconductor modulePARK CHANG-YONG·Filed 2007·Application pending·0 cites
- 1250US2007069378A1Semiconductor module and method of forming a semiconductor modulePARK CHANG-YONG·Filed 2006·Application pending·0 cites
- 1349US2007120234A1Side view light emitting diode packageSAMSUNG ELECTRO MECH·Filed 2006·Application pending·0 cites
- 1449US2010162601A1Device for advertisementKIM BYUNG-MAN·Filed 2006·Application pending·0 cites
- 1548US6421456B1Semiconductor wafer on which recognition marks are formed and method for sawing the wafer using the recognition marksSAMSUNG ELECTRONICS CO LTD·Filed 1998·Granted Jul 16, 2002·15 cites·11 claims
- 1645US2015162475A1Solar cell module and method of manufacturing the sameLEE KOO·Filed 2012·Application pending·0 cites
- 1744US7172106B2Printed circuit board which can be connected with pin connector and method of manufacturing the printed circuit boardSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Feb 6, 2007·1 cites·9 claims
- 1844US7125545B2Permanent cosmetic composition for one-step permanent operationKIM BYUNG-MAN·Filed 2003·Granted Oct 24, 2006·0 cites·1 claims
- 1944US7005735B2Array printed circuit boardSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Feb 28, 2006·3 cites·12 claims
- 2043US2007001295A1Semiconductor device and fabrication method thereofCHO JUNG-CHAN·Filed 2006·Application pending·0 cites
- 2142US7338568B2Method and arrangement for attaching labels to semiconductor modulesSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Mar 4, 2008·2 cites·36 claims
- 2241US7061768B2Open socketSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Jun 13, 2006·1 cites·8 claims
- 2340US2007181899A1Light emitting diode packageSAMSUNG ELECTRO MECH·Filed 2006·Application pending·0 cites
- 2439US2006228878A1Semiconductor package repair methodSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 2539US2006043578A1Semiconductor device having heat sinkBANG HYO-JAE·Filed 2005·Application pending·0 cites
- 2637US6183589B1Method for manufacturing lead-on-chip (LOC) semiconductor packages using liquid adhesive applied under the leadsSAMSUNG ELECTRONICS CO LTD·Filed 1998·Granted Feb 6, 2001·7 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →