Side view light emitting diode package

Abstract

A side view LED package for a backlight unit includes a package body having a cavity with an inclined inner sidewall, first and second lead frames arranged in the package body, the cavity of the package body exposing a portion of at least one of the first and second lead frames placed in a bottom of the cavity to outside, a light emitting diode chip mounted on the bottom of the cavity to be electrically connected to the first and second lead frames, and a transparent encapsulant arranged in the cavity surrounding the light emitting diode chip. The cavity has a depth larger than a mounting height of the light emitting diode chip and not exceeding six times of the mounting height. The height of the sidewall is shortened to improve beam angle characteristics of emission light, increase light quantity, and prevent a molding defect of the sidewall.

1 . A side view light emitting diode package in use for a backlight unit, comprising:
 a package body having a cavity with an inner sidewall inclined between a bottom and a top;   first and second lead frames arranged in the package body, the cavity of the package body exposing a portion of at least one of the first and second lead frames placed in the bottom of the cavity to outside;   a light emitting diode chip mounted on the bottom of the cavity to be electrically connected to the first and second lead frames; and   a transparent encapsulant arranged in the cavity surrounding the light emitting diode chip,   wherein the cavity has a depth that is larger than a mounting height of the light emitting diode chip and does not exceed six times of the mounting height.   
   
   
       2 - 3 . (canceled) 
   
   
       4 . The side view light emitting diode package according to  claim 1 , further comprising wire for electrically connecting the light emitting diode chip to at least one of the first and second lead frames. 
   
   
       5 . The side view light emitting diode package according to  claim 4 , wherein the wire has one end connected to a bump ball of the light emitting diode chip and the other end stitch-bonded to the lead frame. 
   
   
       6 . The side view light emitting diode package according to  claim 5 , wherein the wire is arranged in such a fashion that a height from a top surface of the light emitting diode chip to a top end of the wire is 100 μm or less. 
   
   
       7 . The side view light emitting diode package according to one of the preceding  claim 1 , wherein the cavity has a first width in a shorter axial direction and a second width in a longer axial direction perpendicular to the shorter axial direction, and
 wherein the second width of the cavity is from 1.5 mm to 1.7 mm at the bottom of the cavity.   
   
   
       8 . The side view light emitting diode package according to  claim 7 , wherein the second width of the cavity is from 2.0 mm to 2.5 mm at a top end of the cavity. 
   
   
       9 - 10 . (canceled) 
   
   
       11 . A side view light emitting diode package in use for a backlight unit, comprising:
 a package body having a cavity with an inner sidewall inclined between a bottom and a top;   first and second lead frames arranged in the package body, the cavity of the package body exposing a portion of at least one of the first and second lead frames placed in the bottom of the cavity to outside;   a light emitting diode chip mounted on the bottom of the cavity to be electrically connected to the first and second lead frames; and   a transparent encapsulant arranged in the cavity surrounding the light emitting diode chip,   wherein the depth of the cavity is from 200 μm to 480 μm, wherein the cavity has a first width in a shorter axial direction and a second width in a longer axial direction perpendicular to the shorter axial direction, and wherein the second width of the cavity is from 1.5 mm to 1.7 mm at the bottom of the cavity.   
   
   
       12 . The side view light emitting diode package according to  claim 11 , wherein the second width of the cavity is from 2.0 mm to 2.5 mm at a top end of the cavity. 
   
   
       13 . A side view light emitting diode package comprising:
 a package body having a cavity with an inner sidewall inclined between a bottom and a top;   first and second lead frames arranged in the package body, the cavity of the package body exposing a portion of at least one of the first and second lead frames placed in the bottom of the cavity to outside;   a light emitting diode chip mounted on the bottom of the cavity to be electrically connected to the first and second lead frames; and   a transparent encapsulant arranged in the cavity surrounding the light emitting diode chip, wherein a beam angle of the light emitting diode package is more than 119.6° in a longer axis.