Inventor · disambiguated record
James Mckinnell
Also filed as: MCKINNELL JAMES · MCKINNELL JAMES C · MCKINNELL JAMES CHARLES
41 granted patents·24 pending applications·138 citations·filing 2001–2024
97Inventor score
Top patents by PatentIndex Score
65 records- 0190US12042860B2Build material compositionHEWLETT PACKARD DEVELOPMENT CO·Filed 2023·Granted Jul 23, 2024·0 cites·15 claims
- 0287US11534824B2CompositionHEWLETT PACKARD DEVELOPMENT CO·Filed 2018·Granted Dec 27, 2022·1 cites·15 claims
- 0386US7447891B2Light modulator with concentric control-electrode structureHEWLETT PACKARD DEVELOPMENT CO·Filed 2005·Granted Nov 4, 2008·16 cites·34 claims
- 0485US12303974B2Three-dimensional printingPERIDOT PRINT LLC·Filed 2024·Granted May 20, 2025·0 cites·19 claims
- 0585US12023738B2Creating a breakaway regionHEWLETT PACKARD DEVELOPMENT CO·Filed 2022·Granted Jul 2, 2024·0 cites·8 claims
- 0685US8705774B2Acoustic pressure transducerJILANI ADEL·Filed 2009·Granted Apr 22, 2014·16 cites·14 claims
- 0785US7733553B2Light modulator with tunable optical stateHEWLETT PACKARD DEVELOPMENT CO·Filed 2005·Granted Jun 8, 2010·15 cites·25 claims
- 0883US11583920B2Three-dimensional printingHEWLETT PACKARD DEVELOPMENT CO·Filed 2017·Granted Feb 21, 2023·1 cites·17 claims
- 0983US11207827B2Energy dosing for additive manufacturingHEWLETT PACKARD DEVELOPMENT CO·Filed 2017·Granted Dec 28, 2021·2 cites·14 claims
- 1080US12121973B2Three-dimensional (3D) printingHEWLETT PACKARD DEVELOPMENT CO·Filed 2023·Granted Oct 22, 2024·0 cites·8 claims
- 1177US12076917B2Energy dosing for additive manufacturingHEWLETT PACKARD DEVELOPMENT CO·Filed 2021·Granted Sep 3, 2024·0 cites·14 claims
- 1275US10684662B2Electronic device having a coolantHEWLETT PACKARD DEVELOPMENT CO·Filed 2015·Granted Jun 16, 2020·3 cites·20 claims
- 1373US11684978B2Build material compositionHEWLETT PACKARD DEVELOPMENT CO·Filed 2018·Granted Jun 27, 2023·0 cites·19 claims
- 1473US7760197B2Fabry-perot interferometric MEMS electromagnetic wave modulator with zero-electric fieldHEWLETT PACKARD DEVELOPMENT CO·Filed 2005·Granted Jul 20, 2010·6 cites·18 claims
- 1573US7319552B2Micro-electro mechanical light modulator deviceHEWLETT PACKARD DEVELOPMENT CO·Filed 2005·Granted Jan 15, 2008·5 cites·43 claims
- 1673US2023234139A1Break away support for 3d printingHEWLETT PACKARD DEVELOPMENT CO·Filed 2023·Application pending·0 cites
- 1772US11498130B2Three-dimensional printingHEWLETT PACKARD DEVELOPMENT CO·Filed 2018·Granted Nov 15, 2022·0 cites·11 claims
- 1872US11433457B2Creating a breakaway regionHEWLETT PACKARD DEVELOPMENT CO·Filed 2018·Granted Sep 6, 2022·0 cites·9 claims
- 1971US11998977B2Build material composition with metal powder and freeze-dried heteropolymerHEWLETT PACKARD DEVELOPMENT CO·Filed 2018·Granted Jun 4, 2024·0 cites·15 claims
- 2070US2021331243A1Three-dimensional printingHEWLETT PACKARD DEVELOPMENT CO·Filed 2018·Application pending·0 cites
- 2169US11958110B2Three-dimensional printingHEWLETT PACKARD DEVELOPMENT CO·Filed 2018·Granted Apr 16, 2024·0 cites·17 claims
- 2267US11648612B2Break away support for 3D printingHEWLETT PACKARD DEVELOPMENT CO·Filed 2018·Granted May 16, 2023·0 cites·12 claims
- 2366US7332411B2Systems and methods for wafer bonding by localized induction heatingHEWLETT PACKARD DEVELOPMENT CO·Filed 2004·Granted Feb 19, 2008·13 cites·17 claims
- 2466US7205675B2Micro-fabricated device with thermoelectric device and method of makingHEWLETT PACKARD DEVELOPMENT CO·Filed 2003·Granted Apr 17, 2007·11 cites·29 claims
- 2565US11753703B2Three-dimensional printingHEWLETT PACKARD DEVELOPMENT CO·Filed 2018·Granted Sep 12, 2023·0 cites·15 claims
- 2665US8737663B2Acoustic energy transducerJILANI ADEL·Filed 2009·Granted May 27, 2014·3 cites·14 claims
- 2765US6969667B2Electrical device and method of makingHEWLETT PACKARD DEVELOPMENT CO·Filed 2002·Granted Nov 29, 2005·16 cites·40 claims
- 2864US7471441B1FlexuresHEWLETT PACKARD DEVELOPMENT CO·Filed 2006·Granted Dec 30, 2008·3 cites·11 claims
- 2963US7454221B1Electron tube amplificationHEWLETT PACKARD DEVELOPMENT CO·Filed 2005·Granted Nov 18, 2008·2 cites·12 claims
- 3062US9969164B2Fluid ejection apparatuses including compressible materialHEWLETT PACKARD DEVELOPMENT CO·Filed 2016·Granted May 15, 2018·0 cites·20 claims
- 3162US7571650B2Piezo resistive pressure sensorHEWLETT PACKARD DEVELOPMENT CO·Filed 2007·Granted Aug 11, 2009·2 cites·22 claims
- 3261US2022258238A1Three-dimensional printing with austenitic steel particlesHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Application pending·0 cites
- 3360US11633782B2Three-dimensional (3D) printingHEWLETT PACKARD DEVELOPMENT CO·Filed 2016·Granted Apr 25, 2023·0 cites·14 claims
- 3459US7732902B2Semiconductor package with getter formed over an irregular structureHEWLETT PACKARD DEVELOPMENT CO·Filed 2006·Granted Jun 8, 2010·1 cites·25 claims
- 3559US7211881B2Structure for containing desiccantHEWLETT PACKARD DEVELOPMENT CO·Filed 2004·Granted May 1, 2007·8 cites·13 claims
- 3659US2023144833A13d object pore density reductionHEWLETT PACKARD DEVELOPMENT CO·Filed 2021·Application pending·0 cites
- 3758US9539809B2Fluid ejection apparatuses including compressible materialHEWLETT PACKARD DEVELOPMENT CO LP·Filed 2013·Granted Jan 10, 2017·0 cites·7 claims
- 3855US7508132B2Device having a getter structure and a photomaskHEWLETT PACKARD DEVELOPMENT CO·Filed 2003·Granted Mar 24, 2009·6 cites·56 claims
- 3953US2024001446A1Controlling stainless steel green body object deformationHEWLETT PACKARD DEVELOPMENT CO·Filed 2020·Application pending·0 cites
- 4051US2007068620A1System and method for transferring structured material to a substrateCHEN CHIEN-HUA·Filed 2006·Application pending·0 cites
- 4150US7570417B2Micro-electro mechanical light modulator deviceHEWLETT PACKARD DEVELOPMENT CO·Filed 2007·Granted Aug 4, 2009·0 cites·7 claims
- 4250US7184193B2Systems and methods for amorphous flexures in micro-electro mechanical systemsHEWLETT PACKARD DEVELOPMENT CO·Filed 2004·Granted Feb 27, 2007·4 cites·43 claims
- 4350US7147908B2Semiconductor package with getter formed over an irregular structureHEWLETT PACKARD DEVELOPMENT CO·Filed 2004·Granted Dec 12, 2006·3 cites·21 claims
- 4450US2021331236A1Three-dimensional printingHEWLETT PACKARD DEVELOPMENT CO·Filed 2018·Application pending·0 cites
- 4550US2021362240A1Three-dimensional printingHEWLETT PACKARD DEVELOPMENT CO·Filed 2018·Application pending·0 cites
- 4649US2007152352A1Micro-fabricated device with thermoelectric device and method of makingMCKINNELL JAMES C·Filed 2007·Application pending·0 cites
- 4747US11318669B2Three-dimensional (3D) printingHEWLETT PACKARD DEVELOPMENT CO·Filed 2016·Granted May 3, 2022·0 cites·14 claims
- 4847US2021197263A1Build material formationHEWLETT PACKARD DEVELOPMENT CO·Filed 2017·Application pending·0 cites
- 4947US2022274173A1Three-dimensional printing with stainless steel particlesHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Application pending·0 cites
- 5047US2006254677A1Substitutionally alloyed intermetallic compoundsMCKINNELL JAMES·Filed 2005·Application pending·0 cites
Showing the top 50 of 65 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →