Inventor · disambiguated record
Richard Hurtubise
Also filed as: HURTUBISE RICHARD · HURTUBISE RICHARD W
29 granted patents·10 pending applications·470 citations·filing 1997–2023
97Inventor score
Top patents by PatentIndex Score
39 records- 0194US7670950B2Copper metallization of through silicon viaENTHONE·Filed 2008·Granted Mar 2, 2010·43 cites·21 claims
- 0294US7303992B2Copper electrodeposition in microelectronicsENTHONE·Filed 2005·Granted Dec 4, 2007·29 cites·28 claims
- 0394US6776893B1Electroplating chemistry for the CU filling of submicron features of VLSI/ULSI interconnectENTHONE·Filed 2000·Granted Aug 17, 2004·53 cites·40 claims
- 0493US7410899B2Defectivity and process control of electroless deposition in microelectronics applicationsENTHONE·Filed 2005·Granted Aug 12, 2008·21 cites·22 claims
- 0592US6024856ACopper metallization of silicon wafers using insoluble anodesENTHONE OMI INC·Filed 1997·Granted Feb 15, 2000·186 cites·13 claims
- 0691US8771495B2Method and composition for electrodeposition of copper in microelectronics with dipyridyl-based levelersENTHONE·Filed 2013·Granted Jul 8, 2014·8 cites·19 claims
- 0790US7998859B2Surface preparation process for damascene copper depositionENTHONE·Filed 2008·Granted Aug 16, 2011·16 cites·33 claims
- 0889US7332193B2Cobalt and nickel electroless plating in microelectronic devicesENTHONE·Filed 2005·Granted Feb 19, 2008·16 cites·17 claims
- 0987US8388824B2Method and composition for electrodeposition of copper in microelectronics with dipyridyl-based levelersPANECCASIO JR VINCENT·Filed 2008·Granted Mar 5, 2013·12 cites·50 claims
- 1086US7968455B2Copper deposition for filling features in manufacture of microelectronic devicesENTHONE·Filed 2007·Granted Jun 28, 2011·11 cites·16 claims
- 1183US7611988B2Defectivity and process control of electroless deposition in microelectronics applicationsENTHONE·Filed 2005·Granted Nov 3, 2009·7 cites·4 claims
- 1283US7393781B2Capping of metal interconnects in integrated circuit electronic devicesENTHONE·Filed 2007·Granted Jul 1, 2008·10 cites·24 claims
- 1382US7611987B2Defectivity and process control of electroless deposition in microelectronics applicationsENTHONE·Filed 2005·Granted Nov 3, 2009·6 cites·17 claims
- 1481US7316772B2Defect reduction in electrodeposited copper for semiconductor applicationsENTHONE·Filed 2002·Granted Jan 8, 2008·23 cites·21 claims
- 1578US8608933B2Copper electrodeposition in microelectronicsPANECCASIO JR VINCENT·Filed 2011·Granted Dec 17, 2013·3 cites·13 claims
- 1677US11697884B2Copper deposition in wafer level packaging of integrated circuitsMACDERMID ENTHONE INC·Filed 2021·Granted Jul 11, 2023·0 cites·15 claims
- 1777US7815786B2Copper electrodeposition in microelectronicsENTHONE·Filed 2007·Granted Oct 19, 2010·6 cites·19 claims
- 1877US7615491B2Defectivity and process control of electroless deposition in microelectronics applicationsENTHONE·Filed 2005·Granted Nov 10, 2009·4 cites·11 claims
- 1973US12157944B2Method and wet chemical compositions for diffusion barrier formationMACDERMID ENTHONE INC·Filed 2023·Granted Dec 3, 2024·0 cites·37 claims
- 2070US9222188B2Defect reduction in electrodeposited copper for semiconductor applicationsCOMMANDER JOHN·Filed 2008·Granted Dec 29, 2015·3 cites·10 claims
- 2169US2024018678A1Copper Electrodeposition in MicroelectronicsMACDERMID ENTHONE INC·Filed 2023·Application pending·0 cites
- 2266US11846018B2Method and wet chemical compositions for diffusion barrier formationMACDERMID ENTHONE INC·Filed 2022·Granted Dec 19, 2023·0 cites·9 claims
- 2362US7268074B2Capping of metal interconnects in integrated circuit electronic devicesENTHONE·Filed 2004·Granted Sep 11, 2007·9 cites·17 claims
- 2461US7704306B2Manufacture of electroless cobalt deposition compositions for microelectronics applicationsENTHONE·Filed 2006·Granted Apr 27, 2010·1 cites·22 claims
- 2558US9613858B2Method and composition for electrodeposition of copper in microelectronics with dipyridyl-based levelersENTHONE·Filed 2014·Granted Apr 4, 2017·0 cites·16 claims
- 2658US9493884B2Copper electrodeposition in microelectronicsENTHONE·Filed 2013·Granted Nov 15, 2016·0 cites·13 claims
- 2756USRE49202ECopper electrodeposition in microelectronicsMACDERMID ENTHONE INC·Filed 2018·Granted Sep 6, 2022·0 cites·69 claims
- 2855US8002962B2Copper electrodeposition in microelectronicsENTHONE·Filed 2004·Granted Aug 23, 2011·3 cites·9 claims
- 2955US2017029972A1Copper Electrodeposition in MicroelectronicsENTHONE·Filed 2016·Application pending·0 cites
- 3054US2009155468A1Metrology in electroless cobalt platingENTHONE·Filed 2007·Application pending·0 cites
- 3150US11124888B2Copper deposition in wafer level packaging of integrated circuitsMACDERMID ENTHONE INC·Filed 2017·Granted Sep 21, 2021·0 cites·17 claims
- 3249US2006280860A1Cobalt electroless plating in microelectronic devicesENTHONE·Filed 2005·Application pending·0 cites
- 3348US2019390356A1Copper Electrodeposition in MicroelectronicsMACDERMID ENTHONE INC·Filed 2017·Application pending·0 cites
- 3447US2006188659A1Cobalt self-initiated electroless via fill for stacked memory cellsENTHONE·Filed 2005·Application pending·0 cites
- 3547US2008236619A1Cobalt capping surface preparation in microelectronics manufactureENTHONE·Filed 2008·Application pending·0 cites
- 3644US2008254205A1Self-initiated alkaline metal ion free electroless deposition composition for thin co-based and ni-based alloysENTHONE·Filed 2007·Application pending·0 cites
- 3743US2016281251A1Electrodeposition of CopperENTHONE·Filed 2014·Application pending·0 cites
- 3841US2007178697A1Copper electrodeposition in microelectronicsENTHONE·Filed 2006·Application pending·0 cites
- 3933US10221496B2Copper filling of through silicon viasRICHARDSON THOMAS B·Filed 2011·Granted Mar 5, 2019·0 cites·19 claims
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