Copper Electrodeposition in Microelectronics

Abstract

A method and composition for electroplating Cu onto a substrate in the manufacture of a microelectronic device involving and electrolytic solution containing a source of Cu ions and a a quaternized pyridinium salt compound for leveling.

1 - 13 . (canceled) 
     
     
         14 . A composition for electroplating Cu onto a substrate having electrical interconnect features in the manufacture of a microelectronic device, comprising:
 a source of Cu ions in an amount sufficient to electro deposit Cu onto the substrate and into the electrical interconnect features; and   a leveling agent comprising a quaternized pyridinium salt.   
     
     
         15 . The composition of  claim 14  wherein the quaternized pyridinium salt is selected from the group consisting of quaternized salts of vinyl pyridine homo-polymers and quaternized salts of vinyl pyridine co-polymers. 
     
     
         16 . The composition of  claim 14  wherein the quaternized pyridinium salt is a reaction product of 4-vinyl pyridine. 
     
     
         17 . A method for electroplating a substrate having electrical interconnect features in the manufacture of a microelectronic device, the method comprising:
 immersing the substrate in an eletrolytic solution comprising the following:
 a source of Cu ions in an amount sufficient to electrodeposit Cu onto the substrate and into the electrical interconnect features; and 
 a leveling agent comprising a quaternized pyridinium salt; and 
   
       supplying electrical current to the electrolytic solution to deposit Cu onto the substrate. 
     
     
         18 . The method of  claim 17  wherein the quaternized pyridinium salt is selected from the group consisting of quaternized salts of vinyl pyridine homo-polymers and quaternized salts of vinyl pyridine co-polymers. 
     
     
         19 . The method of  claim 17  wherein the quaternized pyridinium salt is a reaction product of 4-vinyl pyridine.