Inventor · disambiguated record
Vincent Paneccasio, Jr.
Also filed as: PANECCASIO JR VINCENT · PANECCASIO VINCENT · PANECCASIO VINCENT JR
41 granted patents·9 pending applications·434 citations·filing 1984–2025
98Inventor score
Files withENTHONE25MACDERMID ENTHONE INC16ENTHONE OMI INC4PANECCASIO JR VINCENT2RICHARDSON THOMAS B2
Top patents by PatentIndex Score
50 records- 0194US7670950B2Copper metallization of through silicon viaENTHONE·Filed 2008·Granted Mar 2, 2010·43 cites·21 claims
- 0294US7303992B2Copper electrodeposition in microelectronicsENTHONE·Filed 2005·Granted Dec 4, 2007·29 cites·28 claims
- 0394US6776893B1Electroplating chemistry for the CU filling of submicron features of VLSI/ULSI interconnectENTHONE·Filed 2000·Granted Aug 17, 2004·53 cites·40 claims
- 0493US7410899B2Defectivity and process control of electroless deposition in microelectronics applicationsENTHONE·Filed 2005·Granted Aug 12, 2008·21 cites·22 claims
- 0591US8771495B2Method and composition for electrodeposition of copper in microelectronics with dipyridyl-based levelersENTHONE·Filed 2013·Granted Jul 8, 2014·8 cites·19 claims
- 0690US7998859B2Surface preparation process for damascene copper depositionENTHONE·Filed 2008·Granted Aug 16, 2011·16 cites·33 claims
- 0789US7332193B2Cobalt and nickel electroless plating in microelectronic devicesENTHONE·Filed 2005·Granted Feb 19, 2008·16 cites·17 claims
- 0888US6375866B1Method for applying a conductive paint coating and articles made therebyENTHONE·Filed 2000·Granted Apr 23, 2002·40 cites·18 claims
- 0987US8388824B2Method and composition for electrodeposition of copper in microelectronics with dipyridyl-based levelersPANECCASIO JR VINCENT·Filed 2008·Granted Mar 5, 2013·12 cites·50 claims
- 1087US4512856AZinc plating solutions and method utilizing ethoxylated/propoxylated polyhydric alcoholsENTHONE·Filed 1984·Granted Apr 23, 1985·26 cites·17 claims
- 1186US7968455B2Copper deposition for filling features in manufacture of microelectronic devicesENTHONE·Filed 2007·Granted Jun 28, 2011·11 cites·16 claims
- 1283US7611988B2Defectivity and process control of electroless deposition in microelectronics applicationsENTHONE·Filed 2005·Granted Nov 3, 2009·7 cites·4 claims
- 1382US7611987B2Defectivity and process control of electroless deposition in microelectronics applicationsENTHONE·Filed 2005·Granted Nov 3, 2009·6 cites·17 claims
- 1481US7316772B2Defect reduction in electrodeposited copper for semiconductor applicationsENTHONE·Filed 2002·Granted Jan 8, 2008·23 cites·21 claims
- 1580US11035048B2Cobalt filling of interconnectsMACDERMID ENTHONE INC·Filed 2017·Granted Jun 15, 2021·3 cites·30 claims
- 1678US8608933B2Copper electrodeposition in microelectronicsPANECCASIO JR VINCENT·Filed 2011·Granted Dec 17, 2013·3 cites·13 claims
- 1777US11697884B2Copper deposition in wafer level packaging of integrated circuitsMACDERMID ENTHONE INC·Filed 2021·Granted Jul 11, 2023·0 cites·15 claims
- 1877US7815786B2Copper electrodeposition in microelectronicsENTHONE·Filed 2007·Granted Oct 19, 2010·6 cites·19 claims
- 1977US7615491B2Defectivity and process control of electroless deposition in microelectronics applicationsENTHONE·Filed 2005·Granted Nov 10, 2009·4 cites·11 claims
- 2077US6013203ACoatings for EMI/RFI shieldingENTHONE OMI INC·Filed 1998·Granted Jan 11, 2000·38 cites·9 claims
- 2176US10519557B2Leveler compositions for use in copper deposition in manufacture of microelectronicsMACDERMID ENTHONE INC·Filed 2017·Granted Dec 31, 2019·2 cites·28 claims
- 2272US5182006AZincate solutions for treatment of aluminum and aluminum alloysENTHONE OMI INC·Filed 1991·Granted Jan 26, 1993·34 cites·13 claims
- 2370US11434578B2Cobalt filling of interconnects in microelectronicsMACDERMID ENTHONE INC·Filed 2021·Granted Sep 6, 2022·0 cites·28 claims
- 2470US9222188B2Defect reduction in electrodeposited copper for semiconductor applicationsCOMMANDER JOHN·Filed 2008·Granted Dec 29, 2015·3 cites·10 claims
- 2569US12398480B2Leveler compositions for use in copper deposition in manufacture of microelectronicsMACDERMID ENTHONE INC·Filed 2021·Granted Aug 26, 2025·0 cites·15 claims
- 2669US2024018678A1Copper Electrodeposition in MicroelectronicsMACDERMID ENTHONE INC·Filed 2023·Application pending·0 cites
- 2768US2025243596A1Composition and Method for Fabrication of Nickel InterconnectsMACDERMID ENTHONE INC·Filed 2025·Application pending·0 cites
- 2866US11401618B2Cobalt filling of interconnectsMACDERMID ENTHONE INC·Filed 2021·Granted Aug 2, 2022·0 cites·31 claims
- 2963US10995417B2Cobalt filling of interconnects in microelectronicsMACDERMID ENTHONE INC·Filed 2016·Granted May 4, 2021·0 cites·20 claims
- 3063US10103029B2Process for filling vias in the microelectronicsMACDERMID ENTHONE INC·Filed 2016·Granted Oct 16, 2018·1 cites·27 claims
- 3162US5061351ABright tin electrodeposition compositionENTHONE OMI INC·Filed 1990·Granted Oct 29, 1991·15 cites·11 claims
- 3261US7704306B2Manufacture of electroless cobalt deposition compositions for microelectronics applicationsENTHONE·Filed 2006·Granted Apr 27, 2010·1 cites·22 claims
- 3359US11168406B2Leveler compositions for use in copper deposition in manufacture of microelectronicsMACDERMID ENTHONE INC·Filed 2019·Granted Nov 9, 2021·0 cites·31 claims
- 3458US9613858B2Method and composition for electrodeposition of copper in microelectronics with dipyridyl-based levelersENTHONE·Filed 2014·Granted Apr 4, 2017·0 cites·16 claims
- 3558US9493884B2Copper electrodeposition in microelectronicsENTHONE·Filed 2013·Granted Nov 15, 2016·0 cites·13 claims
- 3657US12270121B2Composition and method for fabrication of nickel interconnectsMACDERMID ENTHONE INC·Filed 2020·Granted Apr 8, 2025·0 cites·19 claims
- 3756USRE49202ECopper electrodeposition in microelectronicsMACDERMID ENTHONE INC·Filed 2018·Granted Sep 6, 2022·0 cites·69 claims
- 3855US8002962B2Copper electrodeposition in microelectronicsENTHONE·Filed 2004·Granted Aug 23, 2011·3 cites·9 claims
- 3955US2017029972A1Copper Electrodeposition in MicroelectronicsENTHONE·Filed 2016·Application pending·0 cites
- 4051US5415685AElectroplating bath and process for white palladiumENTHONE OMI INC·Filed 1993·Granted May 16, 1995·10 cites·14 claims
- 4150US11124888B2Copper deposition in wafer level packaging of integrated circuitsMACDERMID ENTHONE INC·Filed 2017·Granted Sep 21, 2021·0 cites·17 claims
- 4249US2006280860A1Cobalt electroless plating in microelectronic devicesENTHONE·Filed 2005·Application pending·0 cites
- 4348US2019390356A1Copper Electrodeposition in MicroelectronicsMACDERMID ENTHONE INC·Filed 2017·Application pending·0 cites
- 4447US2008236619A1Cobalt capping surface preparation in microelectronics manufactureENTHONE·Filed 2008·Application pending·0 cites
- 4543US2016281251A1Electrodeposition of CopperENTHONE·Filed 2014·Application pending·0 cites
- 4641US2007178697A1Copper electrodeposition in microelectronicsENTHONE·Filed 2006·Application pending·0 cites
- 4740US10541140B2Process for filling vias in the microelectronicsRICHARDSON THOMAS B·Filed 2012·Granted Jan 21, 2020·0 cites·24 claims
- 4839US10294574B2Levelers for copper deposition in microelectronicsMACDERMID ENTHONE INC·Filed 2015·Granted May 21, 2019·0 cites·9 claims
- 4936US2005268991A1Corrosion resistance enhancement of tin surfacesENTHONE·Filed 2004·Application pending·0 cites
- 5033US10221496B2Copper filling of through silicon viasRICHARDSON THOMAS B·Filed 2011·Granted Mar 5, 2019·0 cites·19 claims
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