Inventor · disambiguated record
Jun Takayasu
Also filed as: TAKAYASU JUN
16 granted patents·5 pending applications·183 citations·filing 1995–2016
92Inventor score
Top patents by PatentIndex Score
21 records- 0189US10249518B2Polishing device and polishing methodTOSHIBA MEMORY CORP·Filed 2015·Granted Apr 2, 2019·10 cites·11 claims
- 0288US9902038B2Polishing apparatus, polishing method, and semiconductor manufacturing methodTOSHIBA MEMORY CORP·Filed 2015·Granted Feb 27, 2018·3 cites·11 claims
- 0387US9539696B2Retainer ring, polish apparatus, and polish methodTOSHIBA KK·Filed 2014·Granted Jan 10, 2017·6 cites·8 claims
- 0475US9502318B2Polish apparatus, polish method, and method of manufacturing semiconductor deviceTOSHIBA KK·Filed 2015·Granted Nov 22, 2016·2 cites·15 claims
- 0573US6354913B1Abrasive and method for polishing semiconductor substrateTOSHIBA KK·Filed 1998·Granted Mar 12, 2002·42 cites·16 claims
- 0669US6007696AApparatus and method for manufacturing electrolytic ionic water and washing method using electroyltic ionic waterTOSHIBA KK·Filed 1997·Granted Dec 28, 1999·33 cites·39 claims
- 0767US6723226B1Method and apparatus for forming electrolytic water and apparatus for washing semiconductor substrate using electrolytic water-forming apparatusTOSHIBA KK·Filed 1996·Granted Apr 20, 2004·33 cites·8 claims
- 0865US8823079B2Semiconductor device and method for manufacturing sameTOSHIBA KK·Filed 2013·Granted Sep 2, 2014·1 cites·19 claims
- 0956US7037839B2Method for polishing organic film on semiconductor substrate by use of resin particles, and slurryTOSHIBA KK·Filed 2003·Granted May 2, 2006·4 cites·14 claims
- 1054US6001238AMethod for purifying pure water and an apparatus for the sameTOSHIBA KK·Filed 1997·Granted Dec 14, 1999·18 cites·21 claims
- 1153US5665464ACarbon fiber-reinforced carbon composite material and process for the preparation thereofTONEN CORP·Filed 1995·Granted Sep 9, 1997·13 cites·6 claims
- 1252US6098638AMethod of manufacturing a semiconductor device and an apparatus for manufacturing the sameTOSHIBA KK·Filed 1996·Granted Aug 8, 2000·18 cites·12 claims
- 1348US9296083B2Polishing apparatus and polishing methodTOSHIBA KK·Filed 2013·Granted Mar 29, 2016·0 cites·5 claims
- 1448US2006006142A1Method for polishing organic film on semiconductor substrate by use of resin particles, and slurryTOSHIBA KK·Filed 2005·Application pending·0 cites
- 1543US2005026441A1Abrasive used for planarization of semiconductor device and method of manufacturing semiconductor device using the abrasiveTOSHIBA KK·Filed 2004·Application pending·0 cites
- 1641US6878631B2Abrasive used for planarization of semiconductor device and method of manufacturing semiconductor device using the abrasiveTOSHIBA KK·Filed 2002·Granted Apr 12, 2005·0 cites·8 claims
- 1737US10441979B2Cleaning apparatus and cleaning methodTOSHIBA MEMORY CORP·Filed 2015·Granted Oct 15, 2019·0 cites·18 claims
- 1836US9947555B2Semiconductor manufacturing apparatus and method of manufacturing semiconductor deviceTOSHIBA MEMORY CORP·Filed 2016·Granted Apr 17, 2018·0 cites·11 claims
- 1936US2012202348A1Method for fabricating semiconductor deviceTOMIYAMA MIO·Filed 2011·Application pending·0 cites
- 2036US2005167760A1Semiconductor device having high-voltage and low-voltage operation regions and method of fabricating the sameTOSHIBA KK·Filed 2004·Application pending·0 cites
- 2134US2016247710A1Semiconductor device and method of manufacturing the sameTOSHIBA KK·Filed 2015·Application pending·0 cites
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