US2006006142A1PendingUtilityA1
Method for polishing organic film on semiconductor substrate by use of resin particles, and slurry
Est. expiryOct 2, 2022(expired)· nominal 20-yr term from priority
H10P 14/6334H10P 14/68H10P 95/08H10P 52/00H10D 1/047C09G 1/02
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Claims
Abstract
A method for polishing an organic film, comprising polishing an exposed organic film provided on a semiconductor substrate by use of slurry containing resin particles.
Claims
exact text as granted — not AI-modified1 - 18 . (canceled)
19 . Slurry for chemical mechanical polishing, comprising a suspension liquid including a liquid for chemical polishing of an organic film and resin particles dispersed in the liquid.
20 . The slurry according to claim 19 , wherein the resin particles are spherical particles comprising a polystyrene resin.
21 . The slurry according to claim 19 , wherein the slurry contains an organic nitrogen compound as an additive.
22 . The slurry according to claim 19 , wherein the resin particles have a substantially uniform particle size.Join the waitlist — get patent alerts
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