Inventor · disambiguated record
Shinji Takase
Also filed as: TAKASE SHINJI
18 granted patents·4 pending applications·190 citations·filing 1984–2016
94Inventor score
Top patents by PatentIndex Score
22 records- 0185US4595667ACatalyst for the hydrotreating of heavy hydrocarbon oilsNIPPON OIL CO LTD·Filed 1985·Granted Jun 17, 1986·58 cites·14 claims
- 0284US10112377B2Supporting member separation method and supporting member separation apparatusTOKYO OHKA KOGYO CO LTD·Filed 2013·Granted Oct 30, 2018·6 cites·8 claims
- 0384US9627235B2Supporting member separation methodTOKYO OHKA KOGYO CO LTD·Filed 2015·Granted Apr 18, 2017·4 cites·13 claims
- 0483US6977188B2Resin encapsulation molding method of electronic part and resin encapsulation molding apparatus used thereforTOWA CORP·Filed 2003·Granted Dec 20, 2005·36 cites·9 claims
- 0575US7811491B2Method for manufacturing optical electronic componentTOWA CORP·Filed 2005·Granted Oct 12, 2010·6 cites·4 claims
- 0672US9238357B2Supporting member separation apparatus and supporting member separation methodTOKYO OHKA KOGYO CO LTD·Filed 2014·Granted Jan 19, 2016·2 cites·10 claims
- 0769US7056770B2Method of resin encapsulation, apparatus for resin encapsulation, method of manufacturing semiconductor device, semiconductor device and resin materialFUJITSU LTD·Filed 2003·Granted Jun 6, 2006·19 cites·9 claims
- 0868US8696951B2Manufacturing method of optical electronic components and optical electronic components manufactured using the sameTAKASE SHINJI·Filed 2007·Granted Apr 15, 2014·4 cites·10 claims
- 0963US7985357B2Method of resin-sealing and molding an optical deviceTOWA CORP·Filed 2006·Granted Jul 26, 2011·2 cites·6 claims
- 1063US6438826B2Electronic component, method of sealing electronic component with resin, and apparatus thereforTOWA CORP·Filed 2001·Granted Aug 27, 2002·13 cites·14 claims
- 1161US8193558B2Optical electronic componentTAKASE SHINJI·Filed 2008·Granted Jun 5, 2012·2 cites·2 claims
- 1259US4508849AMethod for preparation of catalyst carriersNIPPON OIL CO LTD·Filed 1984·Granted Apr 2, 1985·15 cites·6 claims
- 1357US6929977B2Method of introducing resin for electronic component and apparatus used thereforTOWA CORP·Filed 2003·Granted Aug 16, 2005·8 cites·7 claims
- 1452US6752170B2Fuel pressure regulating valveDENSO CORP·Filed 2002·Granted Jun 22, 2004·5 cites·6 claims
- 1547US8771563B2Manufacturing method of optical electronic components and optical electronic components manufactured using the sameTAKASE SHINJI·Filed 2007·Granted Jul 8, 2014·0 cites·10 claims
- 1646US7618573B2Resin sealing method for electronic part and mold used for the methodTOWA CORP·Filed 2004·Granted Nov 17, 2009·2 cites·1 claims
- 1746US2007110839A1Resin-sealing and molding apparatus of optical deviceTAKASE SHINJI·Filed 2007·Application pending·0 cites
- 1845US4731352AProcess for producing supports for catalystsNIPPON OIL CO LTD·Filed 1986·Granted Mar 15, 1988·8 cites·8 claims
- 1945US2009189310A1Semiconductor chip compression molding method and mold for compression moldingTAKASE SHINJI·Filed 2009·Application pending·0 cites
- 2043US2010006215A1Method of forming light emitter and molding dieTOWA CORP·Filed 2007·Application pending·0 cites
- 2140US2009291532A1Method of resin encapsulation molding for electronic partTAKASE SHINJI·Filed 2007·Application pending·0 cites
- 2232US10814532B2Resin-molding device and method for producing resin-molded productTOWA CORP·Filed 2016·Granted Oct 27, 2020·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →