Assignee
TAKASE SHINJI
JP·3 granted patents·3 pending applications·6 citations·filing 2007–2009
Top patents by PatentIndex Score
6 records- 0168US8696951B2Manufacturing method of optical electronic components and optical electronic components manufactured using the sameTAKASE SHINJI·Filed 2007·Granted Apr 15, 2014·4 cites·10 claims
- 0261US8193558B2Optical electronic componentTAKASE SHINJI·Filed 2008·Granted Jun 5, 2012·2 cites·2 claims
- 0347US8771563B2Manufacturing method of optical electronic components and optical electronic components manufactured using the sameTAKASE SHINJI·Filed 2007·Granted Jul 8, 2014·0 cites·10 claims
- 0446US2007110839A1Resin-sealing and molding apparatus of optical deviceTAKASE SHINJI·Filed 2007·Application pending·0 cites
- 0545US2009189310A1Semiconductor chip compression molding method and mold for compression moldingTAKASE SHINJI·Filed 2009·Application pending·0 cites
- 0640US2009291532A1Method of resin encapsulation molding for electronic partTAKASE SHINJI·Filed 2007·Application pending·0 cites
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