Inventor · disambiguated record
Ho-Yi Tsai
Also filed as: TSAI HO-YI
26 granted patents·19 pending applications·645 citations·filing 2001–2017
96Inventor score
Files withSILICONWARE PRECISION INDUSTRIES CO LTD40CHEN SHU-CHENG1HUANG WEN-HOME1LIN CHANG-FU1TSAI FANG-LIN1
Top patents by PatentIndex Score
45 records- 0196US6603196B2Leadframe-based semiconductor package for multi-media cardSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Aug 5, 2003·185 cites·10 claims
- 0295US7173828B2Ground pad structure for preventing solder extrusion and semiconductor package having the ground pad structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2003·Granted Feb 6, 2007·106 cites·12 claims
- 0394US7371617B2Method for fabricating semiconductor package with heat sinkSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2006·Granted May 13, 2008·29 cites·13 claims
- 0494US7271483B2Bump structure of semiconductor package and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2004·Granted Sep 18, 2007·76 cites·18 claims
- 0594US6865084B2Thermally enhanced semiconductor package with EMI shieldingSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2003·Granted Mar 8, 2005·120 cites·21 claims
- 0690US7855443B2Stack structure of semiconductor packages and method for fabricating the stack structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2007·Granted Dec 21, 2010·19 cites·4 claims
- 0781US7608915B2Heat dissipation semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2008·Granted Oct 27, 2009·12 cites·11 claims
- 0881US6781222B2Semiconductor package having vertically mounted passive devices under a chip and a fabricating method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Aug 24, 2004·34 cites·20 claims
- 0973US7129119B2Method for fabricating semiconductor packagesSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2005·Granted Oct 31, 2006·5 cites·24 claims
- 1070US7348211B2Method for fabricating semiconductor packagesSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2005·Granted Mar 25, 2008·4 cites·26 claims
- 1169US8895366B2Fabrication method of semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Nov 25, 2014·2 cites·10 claims
- 1268US8008769B2Heat-dissipating semiconductor package structure and method for manufacturing the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2008·Granted Aug 30, 2011·3 cites·10 claims
- 1368US7696623B2Electronic carrier board and package structure thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2006·Granted Apr 13, 2010·3 cites·10 claims
- 1467US9013042B2Interconnection structure for semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2012·Granted Apr 21, 2015·3 cites·11 claims
- 1567US7573722B2Electronic carrier board applicable to surface mounted technology (SMT)SILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2007·Granted Aug 11, 2009·9 cites·13 claims
- 1666US7180183B2Semiconductor device with reinforced under-support structure and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2003·Granted Feb 20, 2007·15 cites·19 claims
- 1765US7164210B2Semiconductor package with heat sink and method for fabricating sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2004·Granted Jan 16, 2007·10 cites·7 claims
- 1864US8698326B2Semiconductor package and fabrication method thereofHUANG WEN-HOME·Filed 2007·Granted Apr 15, 2014·4 cites·10 claims
- 1962US8013443B2Electronic carrier board and package structure thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2010·Granted Sep 6, 2011·1 cites·10 claims
- 2060US8361843B2Method for fabricating heat dissipation package structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2011·Granted Jan 29, 2013·1 cites·9 claims
- 2156US7889511B2Electronic carrier board applicable to surface mount technologySILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2009·Granted Feb 15, 2011·0 cites·23 claims
- 2255US10679932B2Semiconductor package and a substrate for packagingSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Granted Jun 9, 2020·0 cites·16 claims
- 2351US6861736B2Leadframe-based semiconductor package for multi-media cardSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2003·Granted Mar 1, 2005·4 cites·3 claims
- 2449US9666453B2Semiconductor package and a substrate for packagingLIN CHANG-FU·Filed 2012·Granted May 30, 2017·0 cites·6 claims
- 2548US2007141761A1Method for fabricating semiconductor packages, and structure and method for positioning semiconductor componentsSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2007·Application pending·0 cites
- 2647US2007054484A1Method for fabricating semiconductor packagesSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2006·Application pending·0 cites
- 2747US2007138632A1Electronic carrier board and package structure thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2006·Application pending·0 cites
- 2846US9368467B2Substrate structure and semiconductor package using the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2012·Granted Jun 14, 2016·0 cites·13 claims
- 2946US2011287588A1Method for manufacturing heat-dissipating semiconductor package structureTSENG WEN-TSUNG·Filed 2011·Application pending·0 cites
- 3045US2008122071A1Heat dissipating semiconductor package and fabrication method thereforSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2007·Application pending·0 cites
- 3145US2008283994A1Stacked package structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2008·Application pending·0 cites
- 3245US2008122070A1Heat dissipating semiconductor package and fabrication method thereforSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2007·Application pending·0 cites
- 3345US2012237457A1Anti-bacterial oral care composition and method for producing the sameCHEN SHU-CHENG·Filed 2011·Application pending·0 cites
- 3444US2007296079A1Heat dissipating structure and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2007·Application pending·0 cites
- 3544US2008017977A1Heat dissipating semiconductor package and heat dissipating structure thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2007·Application pending·0 cites
- 3644US2008213942A1Method for fabricating semiconductor device and carrier applied thereinSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2008·Application pending·0 cites
- 3744US2009096115A1Semiconductor package and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2007·Application pending·0 cites
- 3844US2007273019A1Semiconductor package, chip carrier structure thereof, and method for fabricating the chip carrierSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2007·Application pending·0 cites
- 3943US2008006933A1Heat-dissipating package structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2007·Application pending·0 cites
- 4043US2008251910A1Fabricating method of semiconductor package and heat-dissipating structure applicable theretoSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2008·Application pending·0 cites
- 4142US2006273452A1Semiconductor package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2006·Application pending·0 cites
- 4242US2006292741A1Heat-dissipating semiconductor package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2006·Application pending·0 cites
- 4342US2007202633A1Semiconductor package and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2007·Application pending·0 cites
- 4440US8420521B2Method for fabricating stack structure of semiconductor packagesTSAI FANG-LIN·Filed 2010·Granted Apr 16, 2013·0 cites·12 claims
- 4539US2008157346A1Method for fabricating heat-dissipating package and heat-dissipating structure applicable theretoSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2007·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →