Inventor · disambiguated record
Hidetoshi Kusano
Also filed as: KUSANO HIDETOSHI
22 granted patents·4 pending applications·335 citations·filing 1998–2009
96Inventor score
Top patents by PatentIndex Score
26 records- 0186US6051450ALead frame, manufacturing method of a lead frame, semiconductor device, assembling method of a semiconductor device, and electronic apparatusSONY CORP·Filed 1998·Granted Apr 18, 2000·72 cites·9 claims
- 0285US7216419B2Method of manufacturing a high-frequency coil deviceSONY CORP·Filed 2005·Granted May 15, 2007·10 cites·6 claims
- 0385US7185429B2Manufacture method of a flexible multilayer wiring boardDAINIPPON PRINTING CO LTD·Filed 2006·Granted Mar 6, 2007·13 cites·11 claims
- 0485US6940385B2High-frequency coil device and method of manufacturing the sameSONY CORP·Filed 2003·Granted Sep 6, 2005·19 cites·6 claims
- 0585US6351025B1Semiconductor chip having an underplate metal layerSONY CORP·Filed 2000·Granted Feb 26, 2002·22 cites·2 claims
- 0684US8334591B2Semiconductor device and method of manufacturing the sameKUSANO HIDETOSHI·Filed 2009·Granted Dec 18, 2012·15 cites·23 claims
- 0783US7421777B2Method of manufacturing multilayer wiring substrate using temporary metal support layerSONY CORP·Filed 2005·Granted Sep 9, 2008·12 cites·6 claims
- 0883US6617236B2Fabrication method of wiring substrate for mounting semiconductor element and semiconductor deviceSONY CORP·Filed 2002·Granted Sep 9, 2003·32 cites·7 claims
- 0980US7679184B2Semiconductor device having high cooling efficiency and method for manufacturing the sameSONY CORP·Filed 2007·Granted Mar 16, 2010·9 cites·7 claims
- 1080US7115818B2Flexible multilayer wiring board and manufacture method thereofDAINIPPON PRINTING CO LTD·Filed 2003·Granted Oct 3, 2006·22 cites·10 claims
- 1180US6563202B1Lead frame, manufacturing method of a lead frame, semiconductor device, assembling method of a semiconductor device, and electronic apparatusSONY CORP·Filed 2000·Granted May 13, 2003·24 cites·11 claims
- 1279US7880317B2Semiconductor device and method of manufacturing semiconductor deviceSONY CORP·Filed 2006·Granted Feb 1, 2011·10 cites·12 claims
- 1378US7420127B2Method of manufacturing multilayer wiring substrate, and multilayer wiring substrateSONY CORP·Filed 2006·Granted Sep 2, 2008·6 cites·14 claims
- 1469US6372620B1Fabrication method of wiring substrate for mounting semiconductor element and semiconductor deviceSONY CORP·Filed 1999·Granted Apr 16, 2002·34 cites·7 claims
- 1564US6340840B1Lead frame and production method thereof, and semiconductor device and fabrication method thereofSONY CORP·Filed 2000·Granted Jan 22, 2002·10 cites·4 claims
- 1663US8146243B2Method of manufacturing a device incorporated substrate and method of manufacturing a printed circuit boardASAMI HIROSHI·Filed 2009·Granted Apr 3, 2012·3 cites·13 claims
- 1760US6403402B1Semiconductor chip having an underplate metal layerSONY CORP·Filed 2000·Granted Jun 11, 2002·5 cites·1 claims
- 1853US6465279B2Lead frame and production method thereof, and semiconductor device and fabrication method thereofSONY CORP·Filed 2001·Granted Oct 15, 2002·4 cites·4 claims
- 1951US6660941B2Electronic parts mounting board and production method thereofSONY CORP·Filed 2002·Granted Dec 9, 2003·4 cites·8 claims
- 2051US2007293038A1Method of manufacturing multilayer wiring substrate, and multilayer wiring substrateSONY CORP·Filed 2007·Application pending·0 cites
- 2150US6369441B1Method of producing a semiconductor chip having an underplate metal layerSONY CORP·Filed 2000·Granted Apr 9, 2002·2 cites·1 claims
- 2246US6140153ALead frame, the manufacturing method, semiconductor device and the manufacturing methodSONY CORP·Filed 1998·Granted Oct 31, 2000·7 cites·7 claims
- 2343US2007290310A1Semiconductor Device and Method for Manufacturing the SameSONY CORP·Filed 2007·Application pending·0 cites
- 2442US2008185712A1Semiconductor device and method for manufacturing the sameSONY CORP·Filed 2008·Application pending·0 cites
- 2540US7288724B2Method of manufacturing multilayer wiring substrate, and multilayer wiring substrateSONY CORP·Filed 2003·Granted Oct 30, 2007·0 cites·2 claims
- 2640US2002030576A1High-frequency coil device and method of manufacturing the sameSONY CORP·Filed 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →